Intel’s 3D-stacked Lakefield chips are here to take on ARM in laptops, tablets, and foldables
Intel’s 3D-stacked Lakefield chips are here to take on ARM in laptops, tablets, and foldables
Intel’s 3D-stacked Lakefield processors are finally getting an official debut after months of previews, promising to bring a smaller, more versatile chipset option to hardware manufacturers for new ultraportable, foldable, and dual-screen devices in what might be Intel’s best answer yet to ARM.
The new “Intel Core processors with Intel Hybrid Technology” (an official name that almost…