Crylink's 800nm laser is described in detail
An overview of Crylink's 800nm laser
Description
Ti:sapphire lasers are tunable lasers that emit red and near-infrared light with wavelengths ranging from 650 to 1100 nanometers, with wavelengths approaching 800 nm being the most efficient. Another laser with a wavelength of 514 to 532 nm is commonly used to pump a Ti:sapphire laser. Femtosecond lasers function in pulse mode and have a short duration and high instantaneous power, allowing them to treat materials in a very short period and in small places.
Feature
· Small thermal region
· High peak power
· Wide tuning range
· Stable performance
Application
Transparent dielectric material processing
Ti:sapphire crystals emit a laser wavelength of 800nm, which may be focused on materials. Plasma occurs surrounding the focal point due to the high temperature, culminating in a microburst. The Mazur team at Harvard University generated microcavities with a diameter of roughly 300nm using an 800nm,100fs,0.5J pulse. Because of its limited temperature zone, femtosecond lasers may be used to precisely write optical gratings.
Dual photon polymerization micro-machining
Polymerization occurs in a part of the focal center where energy surpasses the absorption threshold when Ti:sapphire crystals are subjected to laser beams with wavelengths of 800nm, 100fs, and 20nj that exceed the absorption threshold of dual photons. This technology may be used to make three-dimensional structures.
Ablating meral materials
The effects of different energy of 200fs,800nm laser beams on ablating metal materials are distinct. When energy approaches the threshold, phase transition happens on the material subsurface under low-energy circumstances, and materials are ablated due to pressure exerted by the material subsurface. The melting and vaporization expansion of the surface-atmosphere causes thermal ablation on the material surface under high-energy circumstances.
Verdict
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800nm Ti:Sapphire femtosecond lasers enabling to process materials in very short time and short space, suitable for material processing.
