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Agents With Memory, Not Amnesia
Stateless AI reinvents the wheel every time. SDH agents remember context, sessions, and user goals. Smarter over time.
Build custom agentic AI applications with SDH Global. Our autonomous AI systems reason, plan, and act across workflows, integrating with ent
🧠 MemOS: The First Memory Operating System That Gives AI a Sense of Self A silent revoluti
🧠 MemOS: The First Memory Operating System That Gives AI a Sense of Self A silent revolution is changing the way artificial intelligence thi...
New Gemini Memory?
@mreflow, tells us about a new choice that I could have used in the free ComfyUI months ago. After using the ComfyUI Manager to install the IF LLM nodes use the workflows I found at; “C:\ComfyUI_windows_portable\ComfyUI\custom_nodes\ComfyUI-IF_LLM-main\workflows\Gemini2.json” Keep model on memory and keep history, are about 2 3erds down the IF LLM node, below the prompt box are several choices.…
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SK hynix AI Memory Solutions at HPE Discover 2024
HPE Discover Las Vegas 2024 At Hewlett Packard Enterprise’s (HPE) annual technology conference, HPE Discover 2024, SK Hynix is back in Las Vegas to present its cutting-edge AI memory solutions. HPE Discover 2024, which takes place on June 17–20, has a jam-packed itinerary that includes technical workshops, exhibitors, and more than 150 live demonstrations. Three newly selected programmes on AI, hybrid cloud technologies, and edge computing and networking are also available to delegates this year.
At the event, SK Hynix is showcasing its most recent memory solutions, including those provided to HPE Discover 2024, under the banner “Memory, The Power of AI.” In order to improve relationships with the host company and its other partners, the company is also making the most of the many networking opportunities.
The Top Memory Solutions in the World Powered by AI Three product areas and a demonstration area make up SK Hynix’s exhibit at HPE Discover 2024, showcasing the remarkable potential of its AI memory solutions.
The company’s ground-breaking AI memory solutions, including HBM1 solutions, are presented in the first section. Specifically, the industry-leading HBM3E, with its remarkable processing speed, capacity, and heat dissipation, has become a key product to fulfil the increasing demands of AI systems. This section includes features CXL Memory Module-DDR5 (CMM-DDR5), a crucial product from the company’s CXL portfolio. CMM-DDR5 has drawn attention for its capacity and bandwidth expansion capabilities, which can increase system bandwidth by up to 50% and capacity by up to 100% when compared to systems that are solely equipped with DDR5 DRAM in the AI age.
High Bandwidth Memory (HBM): A high-performance, high-value solution that revolutionises data processing by connecting many DRAM chips over TSV. Compute Express Link (CXL): High-performance computing systems are built using this PCIe-based next-generation interconnect standard. Double Data Rate 5 (DDR5): A server DRAM that provides improved bandwidth and power efficiency over the previous generation, DDR4, to successfully manage the growing needs of larger and more complex data workloads. Leading server DRAM solutions from SK Hynix are on display in the second portion of the booth. The highlighted DDR5 RDIMM and MCR DIMM from the company are fast and power-efficient, demonstrating their capabilities to enable AI computation in high-performance servers. Using 1bnm, the fifth iteration of the 10 nm manufacturing technology, DDR5 RDIMMs can achieve up to 6,400 megabits per second (Mbps), whereas 8,800 Mbps is the maximum speed that MCR DIMMs can achieve. Furthermore, SK Hynix is showcasing their LPCAMM2 module solution, which is being used in AI PCs more and more because of its high-performance and low-power characteristics.
A high-density memory module called a Registered Dual In-line Memory Module (RDIMM) is used in servers and other applications to vertically connect DRAM dies. The Multiplexer Combined Ranks Dual In-line Memory Module (MCR DIMM) is a motherboard-bonded module device that combines two ranks of fundamental information processing units to function at the same time, improving speed. Sixth-Low Power Compression The LPDDR5X-based Attached Memory Module 2 (LPCAMM2) module solution provides great performance, power efficiency, and space reductions. With performance levels comparable to two DDR5 SODIMMs, it is optimised for on-device artificial intelligence. In the third area of the booth, guests could also view some of SK Hynix’s most recent enterprise to SSDs (eSSD). These include the PCle Gen5-based PS1010 and PS1030, whose quick sequential read speeds are said to make them perfect for AI, big data, and machine learning applications. Solidigm, the U.S. subsidiary of SK Hynix, is showcasing its QLC-based eSSDs, D5-P5430, D5-P5316, and D5-P5336, in the same section. These items, which have enormous capacities and industry-leading performance, will be the best options for a variety of clients who need a lot of storage space.
Quadruple Level Cell (QLC): NAND flash memory type with a maximum data storage capacity of 4 bits per memory cell.
data storage capacity of 4 bits per memory cell. SK Hynix gave presentations during the conference that centred on how the company’s memory products are fostering AI innovation. On June 18, SK Hynix America’s Technical Leader Brian Yoon of DRAM Technology Planning gave a summary of CXL and talked about how CMM-DDR5 can enable memory expansion. Yoon also discussed the capabilities of the CMM-DDR5-supporting programme HMSDK.
A few hours later, SSD technology trends and how SK Hynix and Solidigm can satisfy future SSD demands were discussed by Director Santosh Kumar of NAND Technology Planning at Seonjae Kim, the Technical Leader for SSD Enablement at SK Hynix, and SK Hynix America. The two discussed how their companies’ SSD devices are tailored for AI storage and contemporary data centre workloads throughout the discussion.
The software development kit known as 8Heterogeneous Memory Software Development Kit (HMSDK) is specifically made to handle CXL memory, a next-generation memory system that is built on the CXL open industry standard.
HPE Discover 2024 Using the Memory Community to Drive AI’s Future SK Hynix highlighted at HPE Discover 2024 how it is leading the way in AI memory innovation. In addition to showcasing its cutting-edge technologies, the event is an opportunity for the company to fortify its alliance with HPE and other key competitors in the market.
Vice President Myoungsoo Park, head of SK Hynix’s US/EU sales, stated, “SK Hynix is maintaining a close partnership with HPE based on its industry-leading memory technology, including securing contracts to supply high-capacity DDR5 and 16-channel Gen5 eSSD products.” “SK hynix’s will keep bolstering SK hynix’s collaboration with international partners to further establish SK hynix’s technological leadership as the leading supplier of AI memory globally.”
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SK Hynix Platinum P41 SSD Sparks Up COMPUTEX Taipei 2024
SK Hynix Platinum P41 SSD
Beginning in June, SK Hynix showcased its cutting-edge AI memory solutions at COMPUTEX Taipei 2024. Under the topic “Connecting AI,” COMPUTEX Taipei 2024, one of Asia’s leading IT exhibitions, drew in about 1,500 international attendees, including tech firms, venture capitalists, and accelerators. SK Hynix made its debut at the event and highlighted with its array of next-generation products that it is a leader in AI memory and a first mover.
“Connecting AI” with top AI memory solutions
“Linking Artificial Intelligence” SK Hynix’s booth showcased its cutting-edge AI server solutions, innovative technologies for on-device AI PCs, and exceptional consumer SSD goods, all under the theme “Memory, The Power of AI.”
High bandwidth and capacity memory solutions from SK Hynix are tailored for AI systems.
Among the AI server solutions on show was HBM3E, the fifth version of HBM. With its enormous capacity, superior heat dissipation capability, and industry-leading 1.18 terabytes (TB) per second data processing performance, HBM3E is designed to satisfy the demands of AI servers and other applications.
High Bandwidth Memory
A high-performance, high-value product that connects numerous DRAMs vertically using through-silicon via (TSV) to achieve substantially faster data processing speeds than current DRAMs.
CXL is another technology that has proven essential for AI servers since it may boost processing power and system bandwidth. By introducing its CXL Memory Module-DDR5 (CMM-DDR5), which dramatically increases system bandwidth and capacity in comparison to systems that are merely outfitted with DDR5, SK Hynix demonstrated the strength of its CXL portfolio. The server DRAM products DDR5 RDIMM and MCR DIMM were among the other AI server solutions on exhibit. SK Hynix, in instance, debuted their towering 128-gigabyte (GB) MCR DIMM at an exhibition.
Compute Express Link
High-performance computing systems are built using this next-generation PCIe-based interconnect technology.
Double Data Rate 5
A server DRAM that provides improved bandwidth and power efficiency over the previous generation, DDR4, to successfully manage the growing needs of larger and more complex data workloads.
Registered Dual In-line Memory Module
The Registered Dual In-line Memory Module (RDIMM) is a high-density memory module designed to connect DRAM dies vertically in servers and other applications.
Multiplexer Combined Ranks Dual In-line Memory Module
All-Time Multiplexer Ranks The Dual In-line Memory Module (MCR DIMM) is a motherboard-bonded module product that combines multiple DRAMs to operate two rank-one basic information processing units at the same time, improving speed.
Additionally, several of the company’s business SSDs (eSSD), such as the PS1010 and PE9010, were on display for visitors to the stand. Specifically, the fast sequential read speed of the PCIe Gen5-based PS1010 makes it perfect for AI, big data, and machine learning applications. Furthermore, by introducing its flagship devices, the D5-P5430 and D5-P5336, which have ultrahigh capacities of up to 30.72 TB and 61.44 TB, respectively, SK Hynix’s U.S. subsidiary Solidigm enhanced the eSSD range.
Peripheral Component Interconnect Express
Digital device motherboards employ PCIe, or peripheral component interconnect express, a high-speed input/output interface with a serialisation format.
SK Hynix demonstrated its ground-breaking memory solutions for on-device AI PCs, in keeping with the expanding on-device AI trend. Among them was PCB01, a PCIe Gen5 client SSD for on-device AI that has the fastest sequential read and write speeds in the business at 14 gigabytes per second (GB/s) and 12 GB/s, respectively. In addition to PCB01, SK Hynix showcased other products designed for on-device AI PCs, such as GDDR7, the next generation graphic DRAM, and LPCAMM2, a module solution that can replace two DDR5 SODIMMs with the same performance.
On-device AI
Unlike cloud-based AI services, which depend on a distant cloud server, on-device AI does AI computation and inference directly within devices like PCs or smartphones.
Low Power Compression Attached Memory Module 2
Minimal Power Compression The LPDDR5X-based Attached Memory Module 2 (LPCAMM2) module solution provides great performance, power efficiency, and space reductions.
Small Outline Dual In-line Memory Module
The server DRAM known as a Small Outline Dual In-line Memory Module (SODIMM) is smaller than the standard DIMM found in desktop computers.
Platinum P41 SSD
Additionally, attendees might get a look at consumer SSDs from SK Hynix. The incredibly dependable consumer SSD Platinum P51 and Platinum P41, which provide great speed to improve PC performance, were on exhibit at the event. The Platinum P51, which is scheduled for mass production later in 2024, makes use of SK Hynix’s “Aries,” the first high-performance internal controller in the industry. With sequential read and write speeds of up to 14 GB/s and 12 GB/s, respectively, Platinum P51 roughly doubles the speed capabilities of Platinum P41, the previous version. This loads AI training and inference LLMs in under a second.
Large language model
Generative AI problems require LLMs to construct, summarise, and translate texts using massive data sets.
At the presentation, a revised version of the portable SSD Beetle X31 was also revealed. With a USB 3.2 Gen 2 interface, this small and fashionable SSD can operate at a speedy 10 gigabits per second (Gbps). In the third quarter of 2024, SK Hynix intends to release the higher-capacity 2 TB version in addition to the current 512 GB and 1 TB variants.
SK Hynix Platinum P41
A prominent 2024 Red Dot Design Award was given to SK Hynix’s stick-type SSD Tube T31 and heat sink for Platinum P41, Haechi H02, earlier in May, highlighting the SSD lineup’s exceptional design.
Finally, SK Hynix’s ESG strategy which included enhancing the energy efficiency of its products was showcased at the show. The company’s selection of energy-efficient products is especially well-suited for enhancing the sustainability of AI applications, which have high power requirements.
Maintaining the Advancement of AI Memory
In keeping with the COMPUTEX Taipei 2024 theme, SK Hynix is working to develop its technology in order to contribute to the realisation of a day when “Connecting AI” is a common occurrence. To advance its AI memory capabilities, the company will keep taking part in international conferences that showcase the newest developments in the sector.
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Highlights of SK Hynix’s AI Memory Leadership Exhibition at CES 2024
Highlights of SK Hynix’s AI Memory
SK Hynix will emphasize memory chips’ significance in the AI era
HBM3E’s very high performance, an interactive AI fortuneteller will be on show
The company, which aims to accelerate business turnaround while solidifying its leadership in AI memory, announced today that it will present the technology for ultra-high performance memory products, which form the basis of future AI infrastructure, at CES 2024, the world’s most important tech event, which will take place in Las Vegas from January 9 to 12.
According to SK Hynix, the company will showcase its future vision at the event via its Memory Centric1 and emphasize the value of memory products in boosting technical innovation in the AI Memory age and maintaining their competitiveness in the global memory markets.
Along with other significant SK Group affiliates including SK Inc., SK Innovation, and SK Telecom, the business will operate a venue called SK Wonderland where it will highlight its key AI memory technologies, such as HBM3E.
SK Hynix intends to commence mass production of HBM3E, the world’s best-performing memory product, in the first half of 2024, and provide it to the biggest AI technology businesses worldwide. HBM3E was successfully created in August.
SK Hynix will showcase an AI Fortuneteller at their amusement park-themed area, where they are using HBM3E-based generative AI technology. By drawing their cartoon characters from their own faces and interpreting their New Year’s fortunes, the AI Memory fortuneteller is supposed to provide visitors with new entertainment value.
The top AI technology from SK Hynix will also be on show in the SK ICT Family Demo Room, which is co-run by other SK ICT enterprises.
The company will demonstrate two products:
Accelerator-in-Memory based Accelerator (AiMX3), a low-cost, high-efficiency processing-in-memory chip-based accelerator card for generative AI;
And Compute Express Link (CXL2), a next-generation interface and test product of Computational Memory Solution (CMS), a memory solution that integrates the computational functions of CXL.
In particular, with the growth of AI technology, CXL memory and HBM are two of the key items in the spotlight. In the second half, SK Hynix intends to offer DDR5-based CXL 2.0 memory solutions in sizes of 96GB and 128GB to AI clients.
Justin Kim, President (Head of AI Infra) at SK Hynix, said, “We are thrilled to showcase our technology, which has risen to the core of the AI infrastructure in the U.S., home to AI technology.” “SK Hynix aims to accelerate a business turnaround through its leadership in the AI memory space and will intensify its collaboration with global players.”
Notice of Disclaimer
These publications are not meant to constitute an offer for buyers to purchase or sell any SK Hynix, Inc. securities in the United States. Without registrations with the Securities and Exchange Commission of the USA or an exemption from registration under the U.S. Securities Act of 1933, as changed, the securities cannot be legally offered or sold in the United States. In the United States, SK Hynix Inc. has no plans to file an offering or carry out a public offering of securities.
Concerning SK Hynix Inc.
Having its main office located in Korea as a whole SK Hynix Inc. is a leading international supplier of semiconductor products, specializing in memory chips for flash memory, image sensors with CMOS technology, and dynamic random access memory (RAM) chips for many different kinds of prominent customers worldwide. The worldwide Bank shares are listed on the Luxembourg Stock Exchange, whereas the Company’s shares are traded on the Korea Exchange.
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