In STHL's SMT workshop, reflow soldering is not just a process step, but a core technology determining soldering reliability. We use precise temperature control to ensure every solder joint reaches a perfect state.
2 x 10-zone reflow ovens + 1 x 8-zone reflow oven
Supports soldering needs from simple single-sided boards to complex HDI boards
Optional nitrogen process, oxygen concentration < 1000ppm
Oxidation rate reduced by 90%, resulting in bright and full solder joints
Stable temperature rise, safe solvent evaporation
Fluoride activation, oxide removal
Precise temperature control, achieving perfect eutectic bonding
Optimized solidification structure, improved solder joint strength
► Lateral Temperature Difference < ± 2℃
► Supports lead-free/lead-containing process switching
► Real-time temperature profile monitoring and traceability
BGA void rate controlled below 8%
Soldering defect rate reduced by 35%
Supports automotive electronics-grade reliability requirements
We ensure that the temperature profile of every board is a testament to quality
