Jan 13
PermiNex® 1000 & 2000 are bonding resists designed to be used in applications where critical alignment, low-temperature processing and high
PermiNex® 1000 & 2000 Bonding Resists for Precision Semiconductor Alignment
PermiNex® 1000 & 2000 are epoxy-based, photo-imageable bonding resists designed for applications requiring critical alignment, low-temperature processing and high bond quality. Ideal for BAW, SAW and microfluidic devices, they support precise cavity definition and reliable capping in advanced semiconductor fabrication.