seen from United States
seen from United States
seen from United States
seen from United States
seen from Türkiye
seen from India
seen from Türkiye
seen from T1
seen from Albania
seen from Germany
seen from Switzerland
seen from Bulgaria
seen from Türkiye
seen from T1
seen from United States
seen from France
seen from Switzerland
seen from Australia
seen from Italy
seen from United Kingdom
TI to raise chip prices from April, supply chain says
March 6, 2026 /SemiMedia/ — Texas Instruments may increase prices for some semiconductor products starting April 1, according to people in the electronic components supply chain. Sources said the new prices have already been set in the company’s internal pricing system. The changes are expected to apply to both direct customers and companies that buy through distribution channels. The…
Vishay introduces automotive 1 MBd high speed optocoupler
July 15, 2026 /SemiMedia/ — Vishay Intertechnology has introduced the VOMHA43A, an automotive 1 MBd high speed optocoupler in a new SOP-5 package with a narrow width of 3.6 mm. The device is designed for automotive, industrial, home and building control, and telecom applications requiring compact size, high isolation voltage and strong noise immunity. Vishay said the VOMHA43A combines a…
PSMC raises DRAM wafer prices by 40% to 45% amid tight AI-driven demand
July 15, 2026 /SemiMedia/ — Powerchip Semiconductor Manufacturing Corp. said it has raised DRAM wafer prices by about 40% to 45% in July as demand from artificial intelligence applications continues to tighten memory supply. PSMC General Manager Frank Huang said during the company’s earnings conference that both memory and mature-node foundry markets are becoming tighter because of strong…
Tower Semiconductor to invest $3 billion in Japan chip manufacturing
July 15, 2026 /SemiMedia/ — Tower Semiconductor said it will invest $3 billion to strengthen its chip manufacturing operations in Japan, including $1 billion in support from the Japanese government. The investment is aimed at expanding production of silicon photonics and silicon germanium technologies as demand grows from artificial intelligence and data center applications. Tower’s U.S.-listed…
Bosch begins sample production at first U.S. silicon carbide chip fab
July 14, 2026 /SemiMedia/ — Bosch has started sample production at its first semiconductor manufacturing facility in the United States and finalized a $225 million funding agreement with the U.S. Department of Commerce to expand domestic silicon carbide chip capacity. The facility is located in Roseville, California. Bosch acquired the site from TSI Semiconductors in 2023 and began converting…
Intel to invest €5 billion in Ireland chip manufacturing expansion
July 14, 2026 /SemiMedia/ — Intel said it has launched a €5 billion, or about $5.7 billion, capital investment plan to expand its semiconductor manufacturing operations in Leixlip, Ireland. The investment is intended to meet growing global demand for processors used in artificial intelligence and high-performance computing systems. Intel said the funding will be used to increase production at…
Infineon launches SECORA ID Key S USB for passwordless authentication
July 13, 2026 /SemiMedia/ — Infineon Technologies has introduced the SECORA ID Key S USB, a Java Card-based security solution with USB and NFC connectivity for passwordless authentication, digital signatures and public key infrastructure applications. Infineon said the SECORA ID Key S USB is the first solution to receive FIDO Level 3+ certification and is compliant with CTAP 2.1. The…
Samsung to start Yongin chip fab production in 2029 amid AI memory demand
July 13, 2026 /SemiMedia/ — Samsung Electronics said it plans to bring forward the start of production at its first chip manufacturing facility in Yongin, south of Seoul, to 2029 as demand for memory chips used in artificial intelligence infrastructure continues to grow. The facility had previously been scheduled to begin production between 2030 and 2031. Yongin is one of South Korea’s key…
