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@semimediapress
TDK launches EP21 SMD common-mode chokes rated up to 35A
July 28, 2026 / SemiMedia / — TDK Corporation has introduced the EP21 series of surface-mount flat-wire double chokes for common-mode electromagnetic interference filtering in DC-DC converters and other low-voltage circuits. Identified by the ordering-code family B82552J*J021, the series consists of four models with rated currents ranging from 20.3A to 35A and nominal inductance values from…
Infineon launches RIC70115 rad-hard gate driver for GaN and silicon power devices
July 27, 2026 / SemiMedia / — Infineon Technologies has introduced the RIC70115 radiation-hardened gate driver for satellite buses, payloads, power-conditioning units, power-distribution systems and DC-DC converters. The RIC70115 is a single-channel device capable of operating as either a high-side or low-side driver. It is designed for radiation-hardened GaN Schottky-gate HEMTs and logic-level…
Allegro integrates wheel-speed decoding into A81415 automotive safety PMIC
July 24, 2026 / SemiMedia / — Allegro MicroSystems has introduced the A81415 automotive power management IC, combining a wheel-speed sensor interface, multi-rail power management and functional safety features in a single device for electromechanical braking systems. Allegro describes the A81415 as the industry’s first ASIL-D safety PMIC with an integrated wheel-speed sensor interface. The…
Samsung Electro-Mechanics adds KRW 295 billion AI server MLCC order
July 24, 2026 / SemiMedia / — Samsung Electro-Mechanics has secured a KRW 295.1 billion, approximately $200 million, contract to supply multilayer ceramic capacitors for artificial intelligence servers and data center systems. The agreement was signed on July 22 and disclosed the following day. The supply period will run from January 1 through December 31, 2027. Its value represents 2.6% of…
NVIDIA provides $1.5 billion prepayment to expand Amkor’s U.S. AI packaging capacity
July 24, 2026 / SemiMedia / — NVIDIA and Amkor Technology have entered into a multi-year strategic partnership that includes a $1.5 billion prepayment to expand advanced semiconductor packaging and test capacity in the United States. The financial arrangement will support Amkor’s U.S. manufacturing expansion and the joint development of packaging technologies for future AI and accelerated…
TSMC reportedly finalizes 2027 foundry pricing with increases reaching 10%
July 23, 2026 / SemiMedia / — TSMC has reportedly completed discussions with customers on foundry price increases scheduled to take effect in early 2027, as higher material, semiconductor equipment and overseas manufacturing costs place greater pressure on the company’s investment requirements. Base price adjustments are expected to range from 5% to 10%, depending on the customer, process…
NAND Flash shortage may persist through early 2027 before supply recovers
July 23, 2026 / SemiMedia / — The NAND Flash market is expected to record a bit supply deficit of 4% to 5% in 2026, with shortages likely to continue through the first half of 2027, according to TrendForce’s latest market survey. Supply growth in 2026 will come mainly from process migrations rather than large increases in wafer capacity. Existing fab space remains limited, while major memory…
SK Siltron exits U.S. SiC wafer market amid Michigan plant shutdown
July 23, 2026 / SemiMedia / — SK Siltron is liquidating its U.S. silicon carbide wafer subsidiary, SK Siltron CSS, and will gradually close the company’s manufacturing facility in Bay County, Michigan. SK Siltron said significant changes in the electric vehicle market have created sustained challenges for its SiC business. The liquidation process is expected to be completed by the end of…
Morgan Stanley sees MCU recovery continuing as restocking momentum moderates
July 21, 2026 / SemiMedia / — The recovery in microcontroller and analog semiconductor demand is continuing into the third quarter of 2026, although channel momentum has moderated from the sharp acceleration recorded earlier in the year, according to Morgan Stanley’s latest AlphaWise distributor survey. None of the distributors surveyed expected unit shipments of analog chips or microcontrollers…
Diodes to acquire ElevATE Semiconductor for $250 million in ATE expansion
July 21, 2026 / SemiMedia / — Diodes Incorporated has entered into a definitive agreement to acquire automated test equipment chip supplier ElevATE Semiconductor in an all-cash transaction valued at $250 million. ElevATE is a fabless semiconductor company based in San Diego, California. It develops low-power, high-density integrated circuits for automated test equipment, including pin…
Infineon launches RIC70115 rad-hard GaN gate driver for space systems
July 20, 2026 / SemiMedia / — Infineon Technologies has introduced the RIC70115, a radiation-hardened single-channel gate driver for satellite power systems and other high-reliability space applications. The RIC70115 is a gate driver rather than a GaN power transistor. It is designed to operate with radiation-hardened Schottky-gate GaN HEMTs and logic-level silicon FETs, allowing engineers to…
TSMC adds $100 billion to Arizona investment as AI chip demand stays strong
July 20, 2026 / SemiMedia / — Taiwan Semiconductor Manufacturing Co. plans to invest an additional $100 billion in its Arizona operations, raising its total planned investment in the state to $265 billion as customer demand for AI-related chips remains strong. TSMC Chief Financial Officer Wendell Huang said the company is satisfied with the progress of its Arizona projects and continues to see…
CXMT DRAM orders reportedly booked through 2027 as PC makers secure supply
July 20, 2026 / SemiMedia / — ChangXin Memory Technologies’ DRAM orders have reportedly extended through the end of 2027 as major PC manufacturers move to secure memory supplies during a continuing global shortage. According to supply chain sources cited by DIGITIMES, leading PC manufacturers have completed product testing involving CXMT memory. Passing qualification, however, does not guarantee…
Micron secures AI vehicle memory deals with Qualcomm and auto suppliers
July 17, 2026 / SemiMedia / — Micron Technology has signed long-term strategic customer agreements with Qualcomm, HARMAN, Visteon, JOYNEXT, DENSO, Astemo and Hyundai Mobis to support the supply of memory and storage products for next-generation connected and AI-enabled vehicles. As vehicle architectures become increasingly software-defined, digital cockpits, advanced driver assistance systems,…
Powertech plans $400 million Broadcom PLP venture in Singapore
July 17, 2026 / SemiMedia / — Powertech Technology Inc. said its board has approved a plan to establish a panel-level advanced packaging joint venture with Broadcom Technologies in Singapore, with Powertech planning to invest $400 million in the project. The investment will be made in stages according to the construction schedule and funding requirements of the Singapore facility. Powertech said…
Mitsubishi Electric seeks September deal with Rohm and Toshiba on power chips
July 17, 2026 / SemiMedia / — Mitsubishi Electric aims to reach an agreement with Toshiba and Rohm by September on a plan to combine their semiconductor operations, Mitsubishi Electric CEO Kei Uruma said. The companies are discussing detailed terms for a proposed joint venture that would integrate sales, manufacturing and research and development. Uruma said the parties have reached a…
ROHM adds DFN8080 and TOLL packages to 600V Super Junction MOSFETs
July 16, 2026 / SemiMedia / — ROHM has expanded its 600V Super Junction MOSFET portfolio with the R60xxXNx and PrestoMOS™ R60xxWNx series, adding DFN8080-5L and TOLL surface-mount packages for high-density power supplies used in AI servers, data centers and industrial equipment. Increasing processing loads in AI and industrial systems are raising power requirements while placing tighter limits…