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@semimediapress
SK hynix aims to triple wafer capacity by 2034 as AI memory demand surges
June 12, 2026 /SemiMedia/ — SK Group Chairman Chey Tae-won said SK hynix plans to triple its wafer production capacity by around 2034 as artificial intelligence computing drives surging demand for advanced memory chips. Chey said the company’s current expansion plan would double wafer capacity within five years. However, once all planned facilities are completed, capacity could rise to three…
Vishay expands ILHB series automotive ferrite beads for higher current filtering
June 12, 2026 /SemiMedia/ — Vishay Intertechnology, Inc. has expanded its ILHB series of automotive-grade multilayer chip ferrite beads, designed for high-current filtering applications. The expanded lineup provides higher current handling, smaller case sizes, and a broader range of impedance values to meet more demanding EMC noise suppression requirements. The ILHB series is now available in…
Applied Materials opens $500 million Singapore campus to expand chip equipment manufacturing
June 11, 2026 /SemiMedia/ — Applied Materials has opened a new $500 million campus in Tampines, Singapore, expanding its advanced manufacturing and research capabilities as demand for semiconductor equipment continues to grow. The company said the new facility has already entered volume production and will double its advanced cleanroom capacity. Applied Materials expects to add about 1,000 jobs…
TSMC says price increases remain possible as inflation raises operating costs
June 11, 2026 /SemiMedia/ — TSMC said price increases remain possible as inflation continues to raise operating costs, though the company emphasized that it does not plan to make sudden, extreme pricing moves. Chief Financial Officer Wendell Huang said during the company’s annual shareholder meeting that inflation has increased TSMC’s cost base. However, he said the company would not suddenly…
Global chip equipment spending hits record $36.55 billion in Q1 as AI investment grows
June 11, 2026 /SemiMedia/ — Global semiconductor equipment spending reached a record $36.55 billion in the first quarter of 2026, rising 14% from a year earlier and 1% from the previous quarter, according to the latest data from industry association SEMI. SEMI said the strong quarterly performance was driven mainly by AI-related investment, including capacity expansion and technology upgrades…
Wall Street expects DRAM and NAND shortages to last through 2028
June 10, 2026 /SemiMedia/ — Wall Street analysts expect DRAM and NAND shortages to persist through the end of 2028 as artificial intelligence demand, limited supply growth and long-term supply agreements reshape the global memory chip market. Cantor Fitzgerald analyst C.J. Muse said in a recent report that the memory industry is reaching an important turning point. While DRAM and NAND have…
KYOCERA AVX expands TransGuard VT MLV series for 48V automotive power systems
June 10, 2026 /SemiMedia/ — KYOCERA AVX has expanded its TransGuard® VT series of high-temperature automotive-grade multilayer varistors with new devices designed for 48V automotive power supply systems. The new 48V system MLVs are intended to provide bidirectional overvoltage protection and EMI/RFI attenuation in compact surface-mount packages, helping reduce board space and component count in…
onsemi to cut 200-300 jobs at Czech SiC wafer facility amid market adjustments
June 10, 2026 /SemiMedia/ — onsemi has announced plans to reduce its workforce by 200-300 employees at its Roznov plant in the Czech Republic, primarily affecting its core silicon carbide (SiC) wafer production lines. This follows a previous 2025 workforce reduction of 170 employees and reflects broader changes in the global power semiconductor market driven by supply-demand adjustments and cost…
Nexperia announces collaboration with Polar Semiconductor to expand next-generation power MOSFET production
June 9, 2026 /SemiMedia/ — Nexperia B.V. announced a strategic partnership with U.S.-based wafer foundry Polar Semiconductor to manufacture next-generation power MOSFET devices, aiming to expand its product portfolio and secure stable supply for customers worldwide. The collaboration combines Polar’s experience in power semiconductor manufacturing and capacity expansion with Nexperia’s leading…
Middle East conflict disrupts PCB resin supply, raising electronics cost risks
June 9, 2026 /SemiMedia/ — The Middle East conflict is adding new pressure to the global electronics supply chain after a strike on Saudi Arabia’s Jubail petrochemical complex disrupted production of high-purity polyphenylene ether resin, a key material used in printed circuit board laminates. High-purity PPE resin is used in advanced PCB materials that require strong electrical performance,…
ROHM launches TSC3PAK package for SiC MOSFETs enhancing heat dissipation and reliability
June 9, 2026 /SemiMedia/ — ROHM has introduced the TSC3PAK package (14.00 × 18.58 × 3.50 mm) for silicon carbide (SiC) MOSFETs, featuring a top-side heat dissipation structure that supports automated mounting while delivering heat dissipation comparable to conventional through-hole packages such as TO-247-4L. The package is aimed at enhancing efficiency and reliability in power conversion…
Nvidia and SK hynix expand partnership to develop next-generation memory for AI factories
June 8, 2026 /SemiMedia/ — Nvidia and SK hynix announced a multi-year technology partnership to develop next-generation memory for global AI factories while expanding cooperation in semiconductor design, manufacturing simulation and fab automation. The agreement builds on years of joint development between the two companies. SK hynix is one of Nvidia’s key suppliers of high-bandwidth memory,…
Infineon to shift backend operations from Mexico’s Tijuana plant
June 8, 2026 /SemiMedia/ — Infineon Technologies said it will transfer semiconductor backend manufacturing operations from its Tijuana plant in Mexico to other production sites, marking the start of a phased withdrawal of manufacturing activities from the facility. The company said wafer dicing, assembly and testing operations currently handled at the Tijuana site will be gradually moved…
Memory chip prices may peak sooner as AI-driven rally faces demand risks
June 8, 2026 /SemiMedia/ — Wall Street analysts are divided over how long the AI-driven memory chip rally can last, as some investors begin to question whether DRAM and NAND prices could peak sooner than expected. Most analysts still expect strong AI demand to keep memory supply tight until around mid-2027, even as suppliers add capacity. However, Raymond James analyst Kal Ackerman has issued a…
Vishay launches 200 A power module for 48 V traction and mild-hybrid systems
June 5, 2026 /SemiMedia/ — Vishay Intertechnology has introduced the VS-HOT200C080, a 200 A power module designed for 48 V traction inverters in light electric vehicles and belt-start generator and recuperation systems in mild-hybrid electric vehicles. The module is designed to reduce board space and improve efficiency in high-current 48 V power systems. Vishay said the device can reduce PCB…
SK Group reconsiders SK Siltron sale as AI chip supply chain value rises
June 5, 2026 /SemiMedia/ — SK Group is reportedly reassessing the planned sale of SK Siltron as the AI-driven semiconductor upcycle increases the strategic value of silicon wafer supply within the group’s chip business. The group selected Doosan Semiconductor as the preferred bidder for SK Siltron at the end of 2025 and had continued negotiations for the sale. However, industry observers said…
Murata launches soft-termination 0805 MLCC for automotive power and safety systems
June 4, 2026 /SemiMedia/ — Murata Manufacturing Co., Ltd. has introduced the GCJ21BD72A225KE02, a soft-termination multilayer ceramic chip capacitor (MLCC) designed for automotive powertrain and safety systems. The new 0805-inch (2.0×1.25 mm) MLCC achieves 2.2 μF at 100 Vdc, the highest available capacitance in this small size worldwide. As vehicle electrification accelerates and autonomous…