Engineering consulting and CAD services
The wide array of contents communalization options and diverse substrate and packaging materials applicable in preparation for specific environments, can nowadays at present a daunting disconcert on deciding how as far as plow back into together an electronic module. By over 30 years of experience, we take advantage concerning state-of-the-art technologies, old design software and latest achievements on manufacturing processes and substrate materials, to essential on oiled manufacturability yields, performance, quality and despoilment first prize. Our designs are stereotype avant-garde commercial and military applications including satellites, medical MRI, cellular phones, guided brickbat systems, radars, power generation and placement equipment, wood oil and gas exploration innards, power supplies, automotive and avionic control systems, and au reste. MillPack offers engineering consulting and CAD\CAM services for aesthetic form of holograph close the circle boards, multi-chip modules, hybrids and custom semiconductor packaging. € Schematic capture, PCB design and mechanical drafting € RoHS & Lead-free compliant € Auto-routing & Hand-routing € Matched length, token & controlled clog € Simulation - Signal solidity and thermal running € High-speed, compound signal and MF\microwave circuits € High power circuits We work for a lingual stage setting concerning substrate materials and microelectronic packaging options similar as, but not hushed till: € FR4 autograph circuits, Recurve and rigid-flex, Polyimide, BT € Alumina, Aluminum Nitride, Beryllium Oxide € Thick-films and Thin-films made of DuPont„ Fodel® € In the depths Temperature Co-fired Photography (LTCC) € Hybrids and Multi-chip Modules € Flip-chip and wire-bond attachments € Chip-scale packaging and stacked-chip packaging € Chip carriers and semiconductor packaging € Ball grid arrays (BGA) and pin grid arrays (PGA) € Kovar® metal housings by use of glass feedthrus € Subtrates with Kovar® ring and seal lid, brazed pins, cavities and lead frames, embedded capacitors, inductors and furrowed resistors _Integration_ Our professional engineering partnered with ISO 9001:2008 certified manufacturers state the best affiliation design\manufacturing. We swallow real-time interface between customer, grower and manufacturer is imperative. _Documentation_ Input - We accept inputs fashionable a variety of electronic formats, even hand written to refine into reliable CAD foundation. We stay in involve throughout the complete launch cycle to ensure customers are up-to-date and homely with our progress, so we deliver what they expect and when they expect. Output - In addition to Gerber, IPC netlists and concurrence pick-and-place files, we will provide documentation drawings and check plots favorable regard Adobe® PDF warp and woof and DXF\AutoCAD® for nonrigid viewing and printing. Backup & Security - Every document is electronic or converted to electronic. Files are kept organized in folders by customer, date, project name and purchase order. We encrypt using DoD encryption standards and double backup off-site and online. http:\\www.millpack.com <\p>
