#ipc 6012

[soldertools1]

IPC 6012

IPC 6012D Qualification and Performance Specification for Rigid Printed Boards. This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided. For more details, visit their site.

[theworldofelectronics]

4 Common PCB Design Mistakes And How To Avoid Them

Many of the most common mistakes in designing electronics often occur on the Printed Circuit Board (PCB).  Taking IPC online classes, especially the IPC 6012 certification online, will significantly help those who are working or want to work in the electronics assembly industry, steer clear of costly errors like the ones below:

1. Using The Wrong Landing Patterns

All PCB design tools contain libraries of the most commonly used electronic components.  Each library includes the schematic symbol and PCB landing pattern.

The problem occurs when a component not included in the libraries is used in the design, and you end up having to draw the schematic symbol and the PCB landing pattern manually, which is easily prone to mistakes.  

Being off by even a fraction of a millimeter in drawing a landing pattern will already affect the placement of the component on the board, making it extremely difficult to solder.  So, it’s crucial to just stick with components included in the design tool’s library.

2. Wrong Antenna Layout For Wireless Designs

For products with wireless technology, the layout of the antenna on the board is crucial.  An incorrect antenna layout prevents maximum power transfer between the transceiver and antenna.

A matched impedance is needed to achieve an optimal wireless antenna layout.  For this to happen, two conditions must be satisfied:

· A proper microstrip must be used to connect the antenna and transceiver

· The microstrip must be designed with a 50-ohm impedance to ensure maximum power transfer with the antenna.  This can be done by setting the microstrip’s width with a microstrip calculator.

3. Not Enough Width For Power Traces

To keep the board as small and compact as possible, engineers design the traces as narrow as it’s functionally viable.  The mistake occurs when a high current isn’t taken into consideration.  A minimum trace width won’t be able to handle a 500mA current flowing through it.

The width of the trace depends on several factors, like copper thickness and whether it’s an external or internal layer.  To avoid this mistake, be sure to use a trace width calculator to ensure the accuracy of the trace thickness.

4. Unmanufacturable Blind/Buried Vias

Electronic devices are getting smaller and smaller, and with that, also comes the shrinking of electronic components.  Smaller devices require smaller PCBs, and because of this, some designers use blind and buried vias to connect boards with at least four layers to decrease the board’s footprint.

While they’re useful in compacting the board, vias reduce routing space on every layer of the board.  Furthermore, it’s not that simple to use vias in your design because blind and buried vias have strict limitations on which layers they can connect.  That’s why it’s highly recommended to totally refrain from using them in your design.

Conclusion

By being aware of these mistakes, you’ll be able to avoid costly delays in production and produce high-quality PCBs.  Electronics manufacturing demands strict adherence to IPC standards, much of which is taught in IPC online classes.  

More specifically, when you take an IPC 6012 certification online with training, you’re going to have a good grasp on the principles of PCB design.  This will help you avoid committing the mistakes discussed in this article and pave the way for a successful career in the electronics assembly industry.

Image Source:  https://www.pexels.com/photo/green-circuit-board-3531811/