Mar 18
CEA-Leti presents seven papers at IRPS 2026, showcasing expertise in microelectronics reliability, advanced technologies, & integrated resea
At the prestigious IEEE International Reliability Physics Symposium (IRPS) 2026, CEA-Leti is showcasing its deep expertise with multiple technical papers spanning device physics, RF technologies, FD-SOI, GaN, and advanced integration.
Their work highlights how innovative characterization methods and physics-based modeling are enabling more robust, industrial-grade semiconductor solutions—critical for next-gen AI, RF, and 3D integration systems.