Technical current situation and development of foreign laser machining
The intersection of laser machining and technical development and employ the summary: Handkerchief the intersection of Rec and new the intersection of turning and central power how based on reinforcement of tapered wedge centrifugal female clamp purchase, antisepticize the intersection of valve and the intersection of mould and the intersection of programming and middle's craft, CAM of numerically controlled machining, join while being high-quality tool post The setting method Japanese mould enterprises counted visit the impression multifunction machine: World zero developing direction of lathe transmit the intersection of numerical control and the intersection of high speed cutting and the intersection of turning tool and Hi-Tech that precision analysis develop newly of hobbing machine make the intersection of Shenzhen and Hong Kong and the intersection of major path and China adopt and fasten for the first time future Gushing out a mountain special Vic's coke full new blade carbide daily trade mark and use of coming out recommends the numerical control of the small-scale double housing planer to transform the NC machine tool of combined machining to develop in Dalian Succeed trouble of NC machine tool and what is fault classification whether the intersection of numerically controlled machining and the intersection of carbide and cutting tool spread the intersection of abrasion and mechanism study natural abrasive employ, promote stone material develop numerically controlled machining The new mentality of designing of the determining ruler succeeding in developing machine clamp type bit of laser sense of the nanometer of program composition has feasibility [label: Tag ] laser is invented by the significance in this century, have huge technological potentiality, the experts think, it is the technical all-victorious period of electron now, its protagonist is a computer, the future generation will be only technological era, its protagonist is laser. Because laser has monochromaticity, coherence and three major characteristics of parallelism, are especially suitable for the material processing. Laser machining is the most rising field of the laser application, have already developed abroad.
The laser is invented by the significance in this century, have huge technological potentiality, the experts think, it is the technical all-victorious period of electron now, its protagonist is a computer, the future generation will be only technological era, its protagonist is laser. Because laser has monochromaticity, coherence and three major characteristics of parallelism, are especially suitable for the material processing. Laser machining is the most rising field of the laser application, have already developed 20 multi-type laser processing technologies abroad. Space control and time control of the laser are very good, it is very large to processing the target's material, degree of freedom of the shape, size and processing environment, especially suitable for automation to process. Laser machining system and computerized numerical control technology combine together and can form the high-efficient automatic processing unit, have already implemented the critical technology produced in right time as enterprises, has produced and opened vast vistas for high-quality, high-efficient and low-cost processing.
First, technical application of laser machining
The already mature laser processing technology includes at present: Fast shaping technology of laser, laser bonding technique, technology of laser boring, technology of laser cut, laser marking technology, the laser goes to value balancing technique, laser etching technology, laser trimming technology, laser memory technology, laser scriber technology, laser wash technology, laser heat treatment and surface treatment technology. Laser fast shaping technology intergration laser technique, CAD/CAM technology and technical newest achievement of material, according to the intersection of CAD and model of part, use laser beam photosensitive polymeric material layer-by-layer solidification, pile up into a prototype workpiece accurately, does not need mould and cutting tool to make the part with complicated shape accurately fast, this technology has been already used widely in the fields of industrial Aero-Space, electron, car,etc.. Laser bonding technique have, dissolve pool, purify effect is can pure a weld joint metal, suitable for the welding among the same and different metallic material. The energy density of laser welding is high, it is very favorable that the metal differing greatly to high melting, high reflectance, high thermal conductivity and physical characteristic is welded. The technology of laser boring has precision high, high versatility, such advantages as low cost and comprehensive technological economic benefits are prominent with high efficiency, have already become one of the critical technology of the modern manufacturing field. The technology of laser cut can be applied to the processing of metal and nonmetallic material extensively, can reduce process time greatly, reduce the process cost, raise the work piece quality. The pulse laser light is suitable for the metallic material, the serial laser is suitable for the nonmetallic material, the latter is a technical important application of laser cut. Laser marking technology is one of the applications of the maximum of laser machining. The laser that the laser marking is the high energy density of the use carries on local irradiation to the work piece, evaporate surface layer material or the chemical reaction of the color change takes place, thus leave a marking method of the permanent mark. Can type various characters, symbol and pattern,etc. in laser marking, the character size can be from one millimetre of quantity to one micron of order of magnitude, this has special meaning to forgery prevention of the products. The marking of Excimer Laser Processing Equipment for Wafer Stepper is a new technology developed in recent years, especially suitable for the metal marking, can realize one submicron of marking, has already been used in microelectronics industry and biotechnology extensively.
Laser go serious balancing technique to remove the unbalanced overweight part at the at a high speed gyro unit with the laser, make the principal axis of inertia coincident with rotating shaft, so as to work up the compensating course. Laser go serious balancing technique have, measure and go in weight two major function, can carry on unbalanced measurement and correction at the same time, efficiency is improved greatly, there is broad application prospect on the manufacturing field of top. As to high-accuracy trochanter, laser dyanamic balancing can rise equilibrates the precision at double, equilibrating precision reachable 1% or part per thousand microns of the eccentricity value of its quality. Laser etching technology is getting more chemical than in traditional one for etching technology simple technological process, can greatly lowering production cost, can process the wide line of 0.125- 1 microns, is very suitable for the manufacture of the grand scale ic. Laser trimming technology can carry on automatic accurate fine setting to appointed resistance, precision reachable 0.01% - 0.002%, than precision and low cost with high efficiency of the traditional processing method. Laser trimming includes (0.01- 0.6 microns thick) sheet resistance And thick-film resistor (20- It is 50 microns thick) Fine setting, that fine setting sum hic that is capacitive finely tune. The laser memory technology makes use of laser to record a kind of technology of the video, audio frequency, written historical materials and computer information, it is one of the support technology of information age.
The laser scriber technology is the critical technology for producing integrated circuit, its score line is detailed, precision height (line thickness is 15- 25 microns, the trough is deeply 5- 200 microns) ,Processing is fast (reachable 200 millimetres per second) ,The yield can be more than 99.5%. The laser can reduce the particle which is processed the device to pollute greatly while washing technical adoption, raise the yield of the accurate device. Laser heat, table treatment technology include: The phase change of laser hardens technology, the laser coats technology, laser surface alloying technology, laser annealing technology, laser and assaults and hardens technology, laser ruggedization electric plating technology, laser glazing technology, the technology, to changing mechanical performance, heat resistance and corrosion resistance of the material,etc. of great importancely. The phase change of laser is hardened (namely laser quenching) Study in the laser heat treatment initially, at most, develop fastest, employ the widest kind of innovative technology, suitable for different placements between most materials and different shape parts, can improve wearability and fatigue strength of the part, some foreign industrial sectors regard this technology as the means to guarantee product quality. It is to obtain one of the laser surface modification technology that employs in industry extensively that the laser coats technology, have very good economy, can improve the corrosion resistance of the products greatly.
Laser surface alloying technology is that the surface part of material modifies the new method to deal with, one of the surface modification technology with the largest potentiality that it is the future application, suitable for the part of characteristic of needing improving wear-resisting, able to bear corroding, high temperature resistant etc. in the aviation, spaceflight, weapon, nuclear industry, car manufacturing industry. The technology of laser annealing is a kind of innovative technology that the semiconductor is processed, the result is much better than regular thermal annealing. After laser annealing, impurity can make the electrical resistivity of polycrystalline silicon drop to and heat annealed 1/2- 1/3 ordinarily for achievable 98%- 99% of bit rate, it can improve the integrated level of the integrated circuit greatly, make the interval of the interelement of circuit lessen to 0.5 microns. The laser assaults and hardens the mechanical performance that technology can improve the metallic material, can prevent production and expansion of the crackle, improve intensity and hardness of alloy such as steel, aluminium, titanium, improve it and resist fatigue property. Laser ruggedization electric plating technology can improve the metallic deposition speed, it is 1000 times faster that there is no laser exposure in the velocity ratio, production and repair of microswitch, precision instrument part, microelectronic device and large scale integrated circuit have great justice purpose. Use and change to make firm degree on the electrical degree floor raise and hold 100- 1000 times high in technology. Laser glazing technology modifies to the material risingly, its low cost, easy to control and duplicate, help to develop new material. The laser glazes and combines technology such as flame spraying, plasma arc spray, ion deposition, in control organization, improve surface to be wear-resisting able to bear the intersection of corrosion behavior and,ing having broad application prospect. It is the ideal very much that electronic material, electromagnetic material and other electric materials are used in the measuring instrument after the laser glaze.
Second, technical development trend of laser machining
1.Numerical control and totalization
Position and combine laser, computerized numerical control technology, advanced optical system and high-accuracy and unattended work piece, form and develop and produce the machining center, has already become an important trend of development of laser machining.
2.Miniaturize and unitize
Have already rammed laser cut and mould two kinds of processing methods to make up a lathe abroad, make laser punch press, the efficient characteristic of high speed that it has multifunctionality of laser cut concurrently and the ramming is processed, can finish cutting complicated appearance, punching, marking, score line,etc. to process.
3.High frequency degree and high reliability
At present, the repeated frequency count of the foreign YAG laser has already been up to for 2000 times / second, Nd of array pumping of the diode: YAG mean time-to-repair of laser improve to 1-2 hour Wan from original a several hundred hour already.
4.Adopt the excimer laser to carry on metal processing, this is a new subject of foreign laser machining. The excimer laser can launch the UVL ultravioletr lasers of 157- 350 nanometers of wavelength out, the reflectance to this kind of laser of most metal is very low, absorptivity corresponding and very high, so the laser there is very much loud using value on the metal processing field.
