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Texas Instruments opens new packaging and test plant in Malaysia to boost analog chip capacity

November 11, 2025 /SemiMedia/ — Texas Instruments (TI) has begun operations at its second packaging and test facility in Melaka, Malaysia, marking another step in strengthening its global semiconductor manufacturing network. The new plant, known as TIEM2, is expected to package and test billions of analog and embedded chips annually. TI said the total investment for TIEM2 could reach about US…

#analog chips #embedded processors #Malaysia fab #packaging and testing #semiconductor capacity #Semiconductor manufacturing #supply chain resilience #Texas Instruments #TIEM2 #wafer backend

Tata Electronics eyes Malaysia semiconductor deal to boost ATMP operations

June 4, 2025 /SemiMedia/ — Tata Electronics is in advanced talks to acquire a semiconductor plant in Malaysia as part of its strategy to strengthen its assembly, testing, marking and packaging (ATMP) capabilities. The company is evaluating multiple candidates, including SilTerra, a wafer foundry owned by Dagang NeXchange Berhad (DNeX), as well as OSAT operations of Globetronics and assets from…

#ATMP expansion #Globetronics OSAT #Indian semiconductor #OSAT Malaysia #packaging and testing #semiconductor news #SilTerra acquisition #supply chain resilience #Tata Electronics

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