(China's strong electronic WorldNet's news) A few days ago, the instrument of Dezhou Company (TI) Announce the advanced unleaded logic wafer-grade is sealed and held the NanoFree&-#; 8482; With Renesas Technology Company (Renesas) Have signed and replaced the source agreement. This replaced source agreement to increase and adopt the minimum unleaded logic of technical industry of LVC simple gate to capsulate, namely the usability of NanoFree, has and offered the second kind of reliable industrywide standard to customer and capsulated the solution.
NanoStar&-#; 8482 put out in 2001 by TI; /It is that the most miniature logic of the industry capsulates the solution that NanoFree capsulates, it capsulates and compares with industrywide standard SC-70, the volume can reduce 70% sharp. Adopt NanoStar/NanoFree capsulate technical existing device, can use for, require in the the higher systems to the intersection of device and size extensively, such as wireless hand-held terminal, BP, personal digital assistant, portable DVD player player, MP3 player, notebook computer, and other walkie consumption electronic products.
5/6 NanoFree of the pin capsulates the size (volume 1.40* 0.9* 0.50mm, area 1.26mm2) Capsulate solution to be little and 13% at least than any available logic, capsulate lighter by 70% than SC-70 small-scale logic. The designer can realize in NanoFree that better than SC-70 that distributes thermal behavior. It can make the engineer benefited to distribute thermal behavior while designing moving the electronic product that improved.
NanoFree capsulate use SnAgCu ' Tin silver copper) Alloy solder globule, accord with every J-STD-020B do not have lead solder parameter (maximum return current temperature 250˚ C),And the temperature of return current of this encapsulated maximum is 260˚ C. Each little spherical interval 0.5mm, when the device is put on the mother board, these can since the collimated globule can realize minimum positional deviation, thus has strengthened manufacturability notably.
TI can be offered and adopted NanoFree encapsulated LVC and AUC simple gates, two-door and three small-scale logical devices at present. Renesas will offer adopting unleaded wafer level package, namely the simple gate of NanoFree, two-door and three pieces of LVC technology. Include " summary that WSCP designs " and " small-scale logical choice guide ",etc. support NanoFree packaging technique in various inner technological files in an all-round way.
As first section of NanoFree products, Renesas has developed HD74LVC1G serial high-speed low-voltage forms logic IC, it has shared norm of small-scale logic NanoFree products of SN74LVC1G serial high-speed low-voltage of TI. HD74LVC1G04 and HD74LVC1G97 sample wafer is two kinds of primary types, would begin to offer in Japan in June of 2003. (Editor Color of grass)
