Discover Top Posts Tagged with #chipet

Intel publicizes new 3D Lakefield chips for foldable and ultra-thin laptops

[ad_1]

Intel at this time unveiled its new processors meant for ultra-thin and hybrid laptops. The firm has been engaged on these for a very long time now, below the codename Lakefield. The chips use the corporate’s Foveros 3D packaging expertise to mix completely different chip architectures and reminiscence into one processor.