#fpcway

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Materials exhibit high peel strength because the adhesive possesses ductility or elasticity. High-strength adhesives have relatively low peel strength, naturally leading to stress-concentrated peeling patterns.

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The key characteristic for flexible board substrates is peel strength; however, the peel strength of flexible boards is not constant, difficult to measure, and independent of failure modes.

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Rigid board bonding sheets are more suitable for multilayer lamination, exhibiting excellent flowability in the initial polymerization stage, allowing for smooth encapsulation of circuitry.

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A protective film is formed and then applied around the etched lines to help the low-flow adhesive create a seal. However, this method is not suitable for rigid-flex board manufacturing.

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The flexible board adhesive has low flowability, which helps prevent adhesive from seeping into the slotted areas.

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Traditional flexible sheet adhesives are made in the form of bonding sheets or coated adhesives, suitable for rigid-flex sheets, and offer good cost-effectiveness for products with low layer counts and simple designs.

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Differences between flexible sheet and rigid-flex sheet adhesives: Adhesive layer openings should avoid areas where adhesion is not required, and filler material should be made into thin sheets extending into the laminated cutouts. Adjust the thickness to be uniform and control adhesive flow.

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Differences in adhesives between flexible boards and rigid-flex boards: Rigid-flex boards require more adhesive to fill the gaps between circuit lines during lamination.