The packages are classified into two kinds on the basis of how they are mounted on a circuit board.
Through-Hole Mount Packages
They are designed in a way that the lead pins are stuck through one side of the board and soldered on the other. They are bigger in size as compared to the other kind. These are majorly used in electronic equipment to compensate for the board space and cost limitations.
Surface Mount Packaging
Surface mount packaging follows the technology of mounting or placing the components directly on the printed circuit board surface. Although this process of fabrication helps do things quickly, it also increases the chances of defects. This is because of the miniaturization of components and also because they are mounted extremely close to each other.
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