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Are IC package dimensions standard?
Yep! All IC package dimensions are standard, such as DFN, QFN, QFP, BGA, SOP and so on, which comply with the Standards of JEDEC ( Joint Electron Device Engineering Council, USA.)
PS:
DFN: Dual flat-pack no lead
QFN: Quad flat no-leads package
QFP: Quad flat package
BGA: Ball Grid Array
SOP: Small-outline package
List of integrated circuit packaging types - Wikipedia
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How do you find faulty soldering?
When it comes to the faulty soldering, cold solder joint leads to open circuit, tin connected cuases short circuit, incorrect welding direction or place of components are the major considerations, which can be virtually discovered by virtual inspection and PCBA fuction test.
