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PSA: If you are working on a PCB which includes a SOIC package, be aware of the fact that there are two different package standards. The EIAJ SOIC body is approximately 5.3mm wide, while the JEDEC SOIC body is approximately 3.8mm wide. Make sure to check your parts before ordering your PCBs ... #pcb #eagle #kicad #eda #soic #part #eiaj #jedec #whoops #fail

#pcb #jedec #part #eagle #whoops #eda #fail #soic #kicad #eiaj

RECOM’s SMT AC/DCs Pack 3W in 1 Square Footprint. Universal input surface-mount AC/DCs from RECOM are tailored for JEDEC reflow processe Boa

#RECOM_Power #Footprint #JEDEC #powerelectronics #powermanagement #powersemiconductor

DDR6, 21 Gbps'ye kadar hızlar sunabilir

14. nesil Çekirdekler geriye dönük olarak DDR4'ü de desteklediği için DDR5 RAM henüz bir standart haline gelmedi, ancak JEDEC organizasyonu DDR6 ile ilgili ayrıntıları paylaştı. DDR6, 21 Gbps'ye kadar hızlar sunabilacak. JEDEC, yeni bellek standardına ilişkin ayrıntıları açıkladı Yani, LPDDR6 belleği 10.667 ila 14.400 Mbps arasında hız ve 28,5 ila 38,4 Gbps aralığında bant genişliği sunacak. DDR6'ya gelince, standart henüz kesinleşmedi, ancak JEDEC 8800'den 17.600 Mbit/s'ye ve hatta 21.000 Mbit/s'ye kadar bir aralıktan bahsediyor! Yani bu zaten GDDR6X seviyesidir. DDR6 spesifikasyonlarının gelecek yılın ikinci çeyreğine kadar onaylanması gerekiyor. Read the full article

#DDR6 #haber #hız #JEDEC

全球首發！十銓科技宣佈 DDR5 記憶體出貨～TEAMGROUP ELITE U-DIMM DDR5 六月底將在歐美 EC 搶先上架！

十銓科技自 2020 年底與原廠達成合作並取得顆粒後，即不斷致力於 DDR5 記憶體的研究與發展，同時與各大主機板廠攜手合作，確保每一階段的研發過程皆完整通過測試，提供業界最好之品質，今日更是領先業界震撼宣布 TEAMGROUP ELITE U-DIMM DDR5 首波桌上型記憶體正式出貨，預計全世界消費者可於六月底至七月中於各大 EC 平台上搶先購買。 (more…)

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#DDR5 #DDR5 U-DIMM #INTEL 600 #JEDEC #On-die ECC #PMIC #TeamGroup #TEAMGROUP ELITE U-DIMM DDR5 #十銓 #十銓科技 #記憶體

JEDEC Wide Bandgap Power Semiconductor Committee publishes guideline for switching reliability evaluation procedures for GaN devices

JEDEC Solid State Technology Association, the global leader in standards development for the microelectronics industry, announces the publication of JEP180: Guideline for Switching Reliability Evaluation Procedures for Gallium Nitride Power Conversion Devices. Developed by JEDEC’s JC-70 Committee for Wide Bandgap Power Electronic Conversion Semiconductors, JEP180 is available for free download…

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#GaN #JEDEC #Power Semiconductor #SiC

Huawei bị tổ chức về mạng Wi-Fi "bài trừ", tự nguyện rút lui khỏi hiệp hội bán dẫn JEDEC

Huawei bị tổ chức về mạng Wi-Fi “bài trừ”, tự nguyện rút lui khỏi hiệp hội bán dẫn JEDEC

Huawei đã mất quyền thành viên tại Wi-Fi Alliance và JEDEC, một là do ép buộc và một là do Huawei tự nguyện rút lui.

Mỗi ngày trôi qua, danh sách các đối tác ngừng làm việc với Huawei nhằm tuân theo lệnh của chính phủ Mỹ ngày một dài. Sau Google, Qualcomm, Intel, ARM, Microsoft, Toshiba… mới đây, Huawei tiếp tục bị loại khỏi danh sách hội viên của hai tổ chức quan trọng là Wi-Fi Alliance và…

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#Huawei #JEDEC #Wi-Fi

Transphorm Inc. announced that its third-generation, JEDEC-qualified high-voltage GaN platform has passed the Automotive Electronics Council’s AEC-Q101 stress tests for automotive-grade discrete semiconductors. This achievement marks the company’s second automotive-qualified product line. And, notably, its most reliable given the Gen III GaN platform’s ability to perform at 175°C during qualification testing. Transphorm’s Gen III AEC-Q101 …

#gallium nitride #GaN #AEC #JEDEC

JEDEC Solid State Technology Association, a standards development organization for the microelectronics industry, announced the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power Conversion Devices. JEDEC’s newest main committee, JC-70, Wide Bandgap Power Electronic Conversion Semiconductors, developed this new publication, JEP173, which is available for free download from the JEDEC …

#JEDEC #GaN HEMT #standard

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