According to its characteristics, MediaTek 8300 is similar to the flagship Dimaensity 9200 MediaTek has performed powerfully in the top segment this year: the single-chip Dimensity 9300 has outperformed the Qualcomm Snapdragon 8 Gen 3. Next up is the release of a new SoC MediaTek sub-flagship class – Dimensity 8300, and, according to published data, it will be very similar to the ex-flagship Dimensity platform 9200. MediaTek Dimensity 8300 SoC specifications revealed – potentially it will be a powerful platform The Dimensity 8300 CPU will be three-cluster, with one Cortex-X3 core with a frequency of 2.8 GHz, three Cortex-A715 with […]
According to its characteristics, MediaTek 8300 is similar to the flagship Dimaensity 9200 MediaTek has performed powerfully in the top segment this year: the single-chip Dimensity 9300 has outperformed the Qualcomm Snapdragon 8 Gen 3. Next up is the release of a new SoC MediaTek sub-flagship class - Dimensity 8300, and, according to published data, it will be very similar to the ex-flagship Dimensity platform 9200. [caption id="attachment_83532" align="aligncenter" width="780"] MediaTek Dimensity 8300 SoC[/caption] MediaTek Dimensity 8300 SoC specifications revealed – potentially it will be a powerful platform The Dimensity 8300 CPU will be three-cluster, with one Cortex-X3 core with a frequency of 2.8 GHz, three Cortex-A715 with a frequency of 2.4 GHz and four Cortex-A510 with a frequency of 1.6 GHz. As for the GPU, its role will be performed by the Mali-G615 MC6. So far, the most powerful platform in sub-flagship smartphones is the Snapdragon 7+ Gen 2, but on paper the Dimensity 8300 looks more interesting (Cortex X3 core instead of Cortex-X2, Cortex-A715 core instead of Cortex-A710). It is very possible that the Dimensity 8300 will outperform the Snapdragon 7+ Gen 2. The official premiere of MediaTek Dimensity 8300 will take place on November 21. According to rumors, the first smartphone based on it will be Redmi K70E.