Pump Solution Guide for Data Center and Server Liquid Cooling System
The Importance of Liquid Cooling for Data Centers
Liquid cooling is a key method for enhancing energy efficiency in data centers. According to statistics from the White Paper on Liquid Cooling in China's Data Centers, the market size for liquid-cooled data centers in China is expected to exceed 100 billion RMB by 2024.
When the Thermal Design Power (TDP) reaches 200-300W, specialized airflow management, increased fan capacity and speed, as well as larger and thicker heat sinks, are required to dissipate heat fast enough in server thermal designs. However, when the TDP reaches 350-400W, cooling servers with air becomes extremely difficult and costly, with air cooling nearing its limits. (Data source: Application and Development of Liquid Cooling Technology in Data Centers)
In this situation, liquids with higher thermal conductivity become a better option for heat dissipation. Compared to traditional air cooling, liquids can remove 1,000 to 3,000 times more heat per unit volume, not only achieving precise component-level cooling and ensuring the high performance and reliability of components but also facilitating heat recovery, thereby improving energy efficiency.
Liquid cooling refers to the use of liquids instead of air as the coolant to transfer heat away from heat-generating components. By injecting this liquid into servers, the heat can be removed through heat exchange. Generally, the industry classifies liquid cooling into direct and indirect cooling. Currently, indirect cooling mainly involves cold plate liquid cooling technology, while direct cooling primarily focuses on immersion liquid cooling technology, which can be further divided into phase-change and non-phase-change types. Additionally, there is spray-type liquid cooling.
TOPSFLO liquid cooling pump solutions
The rise of Generative AI (AIGC) and the breakthrough applications of large-scale model technologies have significantly increased demands on the computational efficiency of servers and chipsets. Enhancing CPU and GPU processing power is urgently needed to support their vast computational requirements. In response to the challenges of server overheating and the surge in energy consumption due to rapidly increasing computing power, liquid cooling technology has emerged as a cutting-edge solution. TOPSFLO’s liquid cooling pump solutions precisely match the diverse cooling needs of servers, offering broad compatibility with cold plate efficient cooling, cooling distribution unit (CDU) optimization, and innovative immersion cooling methods. These solutions are adaptable to meet the customized design needs of various clients, ensuring that servers maintain cool and efficient performance even under high workloads.
With nearly 20 years of experience in the DC micro pump industry, TOPSFLO possesses extensive expertise in cooling and pressure boosting solutions for pumps. TOPSFLO has made significant strides in developing liquid cooling solutions for the data center industry, successfully creating liquid cooling pumps that are optimally suited for data center applications.
TOPSFLO Since 2005,The High-end Micro DC Pump Leader in China, High Density Server Cooling Pump Manufacturer
TOPSFLO Since 2005,The High-end Micro DC Pump Leader in China, High Pressure Liquid Cooling Pump Manufacturer
TOPSFLO Since 2005,The High-end Micro DC Pump Leader in China,Magnetic Drive Micro Gear Pump Manufacturer
TOPSFLO Since 2005,The High-end Micro DC Pump Leader in China, Micro DC Diaphragm Pump Manufacturer
Advantages of TOPSFLO Liquid Cooling Pump Solutions
Leak-proof, Safe, and Reliable: Designed with consideration for data center leakage concerns, the pump's structure and materials have been carefully selected to ensure safety and prevent leaks.
Comprehensive Product Range: Our solutions cater to various data center cooling requirements, supporting different CPU/GPU power ratings (200W-1000W) and various application.
Low Noise: Compared to fan-based solutions, our pump systems reduce noise levels by over 40%.
Long Lifespan: Designed to meet the operational needs of data center equipment for up to 10 years.
Strong Material Compatibility: Our pumps are compatible with a wide range of liquid media to suit different application environments.
Data Center Liquid Cooling Pump Solutions with Different Functions
1. Cold plate liquid cooling pump solution
Cold plate liquid cooling mainly uses cold plates (enclosed cavities made of high thermal conductivity metals such as copper and aluminum) to indirectly transfer the heat of components to the cooling liquid enclosed in the circulation pipe, and then uses the coolant to take away the heat. It transports the intermediate heat to the back end for cooling through the transfer characteristics of the working fluid. The system mainly includes liquid cold plates, liquid cooling water pumps, pipes, joints, etc.
TOPSFLO water pump solution for 1U/2U servers, combined with cold plate liquid cooling solution —TDC
2. Immersion Liquid Cooling Pump Solutions
Immersion liquid cooling involves submerging the heat-generating components of electronic devices directly into a cooling liquid, where heat is dissipated through heat exchange. The key equipment and facilities involved include outdoor cooling sources, cooling subsystems, liquid cooling pumps, liquid cooling pipelines, and immersion chambers (liquid cooling cabinets). Immersion liquid cooling can be categorized into two types based on whether there is a phase change in the cooling medium: single-phase immersion liquid cooling and phase-change immersion liquid cooling. The primary function of the liquid cooling pump is to promote liquid circulation and accelerate heat dissipation. Compared to phase-change immersion liquid cooling, single-phase immersion liquid cooling requires pumps with higher power to achieve effective liquid circulation.
3. Cold distribution unit CDU
CDU is a cooling distribution unit that connects the cold plate liquid cooling internal circulation and external circulation. The cold plate liquid cooling joint is divided into two layout forms: centralized CDU and distributed CDU. CDU components include interfaces, micro water pumps, liquid-liquid or air-liquid heat exchangers, liquid storage tanks, valve control devices, monitoring devices, filters and various sensors, which are mainly used for the measurement and control of cooling capacity, flow, pressure and temperature. In order to ensure that sufficient cooling power can be provided for the equipment, a powerful micro water pump will be used in the CDU to ensure uniform and sufficient distribution of cooling capacity.
TOPSFLO High-end and Reliable Liquid Cooling Pump Solutions
TOPSFLO has a professional team with reliable capabilities in micro water pumps and liquid cooling technology, and can provide customers with a variety of liquid cooling water pump solutions. These solutions are designed and verified to adapt to the limited cooling space and heat dissipation requirements of each data center, while ensuring excellent cooling efficiency and reliability.
TOPSFLO different series of liquid cooling water pumps are introduced into servers for various application scenarios, and can also be customized according to the cooling needs of different applications, striving to provide our customers with a wider range of liquid water pump solution options.
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