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5 reasons reel-packed nickel tabs = better battery assembly 🔋
Manual tab placement? 😴 Slow. Error-prone. Expensive.
Reel packing fixes it: ⚡ 10,000+ tabs per hour 📏 Perfect spacing every time 🛡️ Tabs stay clean 👥 Less labor 📋 Traceable batches
Bottom line: If you make more than a few hundred packs a month – go reel-packed. 💰
5 reasons tape & reel nickel tabs = better battery assembly
Manual tab placement? 😴 Slow. Error-prone. Expensive.
Tape and reel fixes it: ⚡ 10,000+ tabs per hour 📏 Perfect spacing every time 🛡️ Tabs stay clean 👥 Less labor 📋 Traceable batches
Bottom line: If you make more than a few hundred packs a month – go tape and reel. 💰
SMT Assembly Process
SMT Assembly is the method of mounting and soldering surface mount devices (SMDs) onto a printed circuit board using automated equipment known as a pick-and-place machine.
Before component placement begins, the assembly line checks for any non-washable devices. If such components exist, they are installed later, once the PCB cleaning process is complete. The typical SMT Assembly workflow includes the following steps:
a.Solder paste screening/inspection
At this stage, solder paste is deposited on the board pads using a precision stencil. The solder paste itself is a mixture of powdered solder alloys (such as tin, silver, and copper) and flux.
A stainless-steel stencil containing apertures aligned with the component pads ensures that the correct amount of paste is accurately applied. If a specific type of solder paste is required, this can be noted in the PCB assembly documentation.
Once the paste is printed, inspection is carried out using SPI (Solder Paste Inspection) machines.
2D SPI checks the coverage, width, and thickness of the deposits.
3D SPI measures length, width, and volume while also identifying defects like missing paste or bridging issues.
b. Component Placement
After the solder paste step, the pick-and-place machine places various components—such as resistors, capacitors, ICs, and BGAs—onto the prepared pads. The system picks each device from reels or trays, rotates it as needed, and positions it precisely.
Hitech123 uses advanced YAMAHA placement systems capable of mounting up to 98,000 parts per hour, enabling prototype SMT Assembly with lead times as short as 24 hours.
c.Reflow Soldering
Reflow soldering is the heating process specific to SMT Assembly. During this step, the assembled PCB travels through a reflow oven, where the solder paste melts and bonds the components to their pads. Once cooled, the joints become solid and secure.
The temperature range of reflow soldering depends on the type of solder paste used. 180-220°C for lead solder paste and 210-250°c for lead-free solder paste.
d.Automated optical inspection (AOl)
AOI machines use high-resolution cameras and optics to automatically verify solder joints and component placement. They detect issues such as:
Missing or misaligned parts
Insufficient or excess solder
Wrong polarity or orientation
Shorts, opens, and lifted leads
This step plays a critical role in ensuring consistent quality in SMT Assembly.
e. X-Ray Inspection
For complex multilayer boards and fine-pitch packages like BGAs, X-ray inspection is used. As a non-destructive test method, it produces images of hidden solder joints and reveals internal issues that cannot be checked with AOI alone.
f.Flying probe testing (FPT)
Flying Probe Testing is an automated method for detecting opens, shorts, and verifying passive component values such as resistance, capacitance, and inductance. Movable probes scan across the board in X, Y, and Z axes, making it ideal for small-volume runs and prototypes.
The tester is programmed using netlist data from the PCB design files, ensuring accurate and flexible verification even when frequent design changes occur.
We have our own SMT factory in Shenzhen. With advanced devices and professional technicians, we can provide high quality PCB assembly products. Welcome to send inquiries to my email:[email protected]
The Benefits of Selective Wave Soldering for SMT Assembly
In modern SMT (Surface Mount Technology) assembly, selective wave soldering has become a preferred method for achieving precise, reliable solder joints—especially in mixed-technology boards where through-hole and surface-mount components coexist. Compared to traditional wave soldering, selective wave soldering offers significant improvements in process control, production efficiency, and cost-effectiveness.
Here’s why more SMT assembly providers are turning to this method:
1. Enhanced Precision and Soldering Reliability
As PCBs become increasingly compact, with components densely packed and clearances reduced, traditional wave soldering often lacks the control necessary for high-quality results. Selective wave soldering allows for targeted application of heat and solder, minimizing the risk of solder bridging, cold joints, or component damage. By controlling parameters like flux deposition, preheating, and solder nozzle positioning, manufacturers can ensure consistent soldering quality, even in complex assemblies.
2. Reduced Process Complexity and Thermal Risk
Traditional wave soldering requires the entire board to pass over a solder wave—even areas that are already soldered. This not only increases thermal stress on sensitive components but also complicates process planning. Selective wave soldering eliminates this issue by applying solder only where it's needed, preserving previously soldered areas and simplifying the overall workflow.
3. Increased Production Efficiency
Selective wave soldering is inherently faster when dealing with partial through-hole soldering tasks. Since it focuses only on the necessary points, cycle times are reduced. This leads to higher throughput without sacrificing quality, enabling SMT assembly facilities to scale production and respond faster to customer demands.
4. Cost Savings through Accuracy and Automation
By reducing soldering defects and improving first-pass yield, selective wave soldering minimizes material waste and the need for rework. Its high level of automation also means fewer manual interventions, lowering labor costs and improving consistency across batches. Over time, these benefits translate into significant operational cost reductions.
Hitech Circuits specializes in providing turnkey PCBA electronic manufacturing services, including component sourcing to PCB production, SMT mounting, DIP insertion, PCBA testing, finished product assembly and other one-stop services. You can provide PCB related manufacturing documents to inquire, we will give you a quotation within 24 hours!
Analysis of the Causes of Component Displacement in SMT Assembly Production and Handling Methods
With the development of technology and the improvement of living standards, the pursuit of electronic products is increasingly trending towards miniaturization and precision. In SMT small-batch patching processing plants, traditional DIP plug-ins no longer play as significant a role in small, compact PCBA as SMT patching, especially for large-scale and highly integrated ICs. The precision industry requires meticulous attention to both material usage and processing steps, as even the slightest error can render the entire device inoperable. Therefore, every step in the patching process must be carefully observed.
SMT patching processing, namely Surface Mount Technology (SMT), is the most popular technology and process in the current electronic assembly industry. Surface Mount Technology for electronic circuits, also known as surface mounting or surface installation technology, primarily aims to accurately mount surface-mounted components onto fixed positions of a PCB. However, during patching processing, some process issues may arise, affecting patching quality—such as component displacement. Component displacement in patching processing is a precursor to several other problems during the welding process and requires attention. So, what are the causes of component displacement in patching processing?
Causes of Component Displacement in Patching Processing:
Solder paste has a limited shelf life. After exceeding the usage period, the flux in it deteriorates, leading to poor soldering.
The solder paste itself has insufficient viscosity, causing component displacement due to oscillations or shaking during handling.
Excessive flux content in the solder paste leads to component displacement due to the flow of excess flux during reflow soldering.
Component displacement caused by vibration or improper handling during transportation after printing and patching.
In patching processing, the suction nozzle's air pressure is not adjusted properly, with insufficient pressure causing component displacement.
Mechanical issues with the patching machine itself result in incorrect component placement.
Once component displacement occurs in patching processing, it affects the circuit board's performance. Therefore, during processing, it is necessary to understand the causes of component displacement and address them specifically.
Targeted Solutions Based on Specific Causes:
Strictly calibrate positioning coordinates to ensure the accuracy of component mounting.
Use high-quality, high-adhesion solder paste to increase SMT mounting pressure and bonding force for components.
Select appropriate solder paste to prevent solder paste collapse, with the solder paste having a suitable flux content.
Adjust the speed of the fan motor.
In fact, in the reflow soldering of SMT patching processing, besides component displacement, there are many other possible defects, such as stand-up and flip-over issues. However, these defects can be resolved by starting from circuit board design—from excellent PCB fabrication to meticulous execution in responsible SMT patching processing—addressing everything from components to solder paste and processes to fundamentally improve reflow soldering quality and prevent component displacement.
Want to know more? Contact me at [email protected]. From Sandy
Go through this blog and know how SMT line works for PCB Assembly services.
The SMT assembly process involves a series of precisely controlled steps performed on an SMT production line. Each step is crucial for achieving high-quality PCB assemblies used in consumer electronics, industrial applications, and automotive industries. This blog provides a comprehensive look at how an SMT line works for PCB assembly.
Good luck with your work throughout the new year 🤗 Hope everything at work gets off to a good start~ Welcome to send us the Gerber file and BOM list to our email address: [email protected]
Discover the critical differences between PCB making and designing, from layout creation to manufacturing, and how both processes impact the
Discover the critical differences between PCB making and designing, from layout creation to manufacturing, and how both processes impact the final product.
