#soldering techniques

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Soldering techniques: Surface-mount

Surface-mounted components are becoming more and more common due to the obvious shortcomings associated with the use of through-hole soldering. However, the technique may seem a bit less straightforward as compared to the through-hole technique. Here are the necessary steps to carry out a surface mount.

Clean the printed circuit board

Perhaps always the first step in any type of soldering or desoldering, this is necessary to minimize the level of impurities in the board that may affect the outcome of the soldering. Cleaning can be done using a wide range of tools and agents.

Prepare the component

It is necessary to identify the point on the board where the component is to be soldered in and decide whether the number of pins on the component fits those on the board. The normal soldering preparation should then be carried out such as preheating.

Hold the component in place

Due to the small size of PCB components and the heat produced by a soldering iron tip, it is advisable to hold the component in place using a household tool such as a pair of tweezers and not with your bare hands. This will reduce the chances of accidental burns.

Apply some small solder drop

This is against the soldering rules but necessary to hold the component steady before soldering. Using the iron tip, apply a small drop of molten solder onto one of the component legs. After this, heat the pad and feed solder as happens during a correct soldering process. This should be done on all component leads until uniform concave balls of solder gave formed on each of the leads. It may be necessary to desolder certain points of the PCB to get rid of solder balls, beads or bridges that may have formed during the process.

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Soldering techniques: Wave soldering

Wave soldering is one of the traditional techniques used to solder components onto PCBs in large scale. The technique is especially successful with the through-hole technology but requires minor adjustments to function with surface-mounted components. The technique has various steps:

Placing components on the board

This step makes the through-hole technology the most viable for this since the components can simply be held in place by bending the leads at a right angle. For surface-mounted components though, the components have to be glued to the board before being soldered. However, the technique is applicable to both methods and the components need only stay on the board.

Passing through solder

This is normally molten solder in a wave soldering machine. Due to the industrial application of the technique, wave soldering machines tend to be relatively expensive machines and normally out of reach for the average household consumer. This step involves passing the board over a wave of solder produced by components within the wave soldering machine. This causes the solder to flow into the holes where the leads pass through and thus effectively soldering the entire printed circuit board.

Fluxing and cleaning

Since the process follows the basic soldering technology, it is important to preheat, flux and clean. Normally, such industrial processes use what is known as no clean flux that does not require cleaning once the process is complete. This is because the flux residue has no electrical or corrosive capabilities thus rendering it inconsequential to the eventual operation of the circuit board. These types of fluxes are however sensitive to processes involving heat and may not always be applicable. When the usual flux is used, the process ends with cleaning off of the flux though any of a wide range of methods.

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Soldering Techniques: Laser Soldering

Laser soldering is a relatively new technique that has the potential to replace regular soldering. In the laser technique, a laser beam is used to illuminate leads which then emits heat and raises the temperature of the material to melting point. At this stage, solder is applied, melts and seals joints, crack and holes within or along the leads. The main differences between laser and regular soldering include;

Heating

Regular soldering uses soldering iron, torches or guns to heat the surface and the tips. However, laser soldering makes uses of laser beams to illuminate the leads. The illuminated section of the lead heat up and transfer the heat to the rest of the component. This is carried on until the leads reach melting point. Once this temperature is achieved, solder is applied to the contact point, melts and flows into the joints. It is less messy than the regular soldering process.

Equipment

While the regular soldering process makes use of soldering irons and torches, a laser soldering device is required for laser soldering. This is a high precision device that blasts the laser ray required to illuminate the leads. These are still relatively uncommon but may become the mainstream soldering equipment in the near future.

Heat transfer vs heat emission

In regular soldering, heat is transferred to the leads using tools such as a soldering iron. However, in laser soldering, a single point is illuminated and emits heat that is then transferred to the rest of the lead. These methods have their own shortcomings and advantages when compared. However, laser soldering though still expensive is catching up to regular soldering and may soon be the main soldering technique.

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A Summary Of Soldering: Techniques

Wave soldering

Wave soldering is one of the traditional techniques used to solder components onto PCBs in large scale. The technique is especially successful with the through-hole technology but requires minor adjustments to function with surface-mounted components. The technique has various steps that include placing the components on the board, fluxing, passing the PCB through solder, and cleaning.

Laser soldering

Laser soldering is a relatively new technique that has the potential to replace regular soldering. In the laser technique, a laser beam is used to illuminate leads which then emits heat and raises the temperature of the material to melting point. At this stage, solder is applied, melts and seals joints, crack and holes within or along the leads. The main differences between laser and regular soldering include the heating mechanism and equipment used. Laser soldering is slowly becoming the industry standard for neatness and efficiency and is thus being embraced more.

Through-hole soldering

Through-hole soldering is one of the more popular electronic component mounting schemes used in a wide range of printed circuit boards. The components to be mounted have leads running from both ends. These leads then pass through holes within the circuit boards onto which they are fixed then soldered using any of a wide range of techniques. The most common include manual soldering for small-scale tasks and automated soldering for production lines. There are two main types of leads used in through-hole soldering. These include radial and axial leads. Axial leads are in essence wires of lead that protrude from each end of the component. Radial leads on the other hand stem from a single side of the component as seen in aged capacitors.