TechSearch: Backbonded chip, wafer level package increase steadily
Author: Sally Cole Johnson, Contributing Editor According to the market survey company TechSearch International Inc. (Austin, Texas) The latest report, from 2007 to 2012, backbonded chip (Flip-chip) And wafer level package (WLP) Will advance steadily with 14% of the annual speedup. TechSearch International forecasts steady 14% annual growth rates for flip-chip packaging. (Source: STATS ChipPAC) The bright spot factor of driving these two markets to grow up is mainly characteristic and shape factor. " the wireless application will be one of the fields of high-speed growth in 2009, chip level packaging (CSP) Will adopt the backbonded chip extensively, " TechSearch president and concurrently creator Jan Vardaman show. She points out, the increasingly many supplier's ASIC, FPGA, DSP, chip set, figure and microprocessor products, expand upside-down mounting chip package (FCIP) which adopts salient point of solder and copper pin salient point . Backbonded chip (FCOB) on the board Also drive in the car electron, hard disk and get application on the wrist-watch module. Recommend according to Vardaman, the growth of demand promotion WLP that thinner, lighter walkie products increase sharply. Though it is used in the low pin that WLP is typical Book (less than or equal to 50 I/O) And on the chip of the smaller size of bare chip, but become jumbo size now, guide the number of leg (greater than or equal to 100 I/O) high Plant choice. The gold salient point demand will continue being driven the influence of IC by LCD, but TechSearch finds the deflation of chip size limits the growth of the wafer number. " the applied difference, demands of the salient point of gold nail head are different too, " Vardaman shows, " in some application, it can make the chip near the base plate even more, narrows and capsulates the area entirely, for tiering and capsulating employing(PoP) This is very important. In other situations, such as highlighted LED, but exist and dispel the heat and some miscellaneous problems. " When asking about the global economic situation may influence the price containing chip and WLP material upside down, Vardaman says, " up till now, the price of raw material has been soaring all the time with price of petroleum and production cost related to energy. "