Hitech Circuits Co., Limited @roger-hitechpcba666 - Tumblr Blog

High Quality Flex PCB with Cheaper Price made by Hitech Circuits Co., Limited

Flexible circuit board, also known as "soft board", is a printed circuit made of flexible insulating substrate. Flexible circuits provide excellent electrical performance, which can meet the design needs of smaller and higher density installations, and also help reduce assembly processes and enhance reliability. Flexible circuit boards are the only solution to meet the miniaturization and mobility requirements of electronic products. It can be freely bent, wound, and folded, withstand millions of dynamic bends without damaging the wires, can be arranged according to spatial layout requirements, and can move and expand freely in three-dimensional space, thus achieving the integration of component assembly and wire connection; Flexible circuit boards can greatly reduce the volume and weight of electronic products, meeting the needs of electronic product development towards high density, miniaturization, and high reliability.

Flexible Printed Circuit Board, commonly known as FPC in the industry, is a printed circuit board made of flexible insulating substrates (mainly polyimide or polyester films) and has many advantages that hard printed circuit boards do not possess. For example, it can be freely bent, coiled, and folded. The use of FPC can greatly reduce the volume of electronic products, meeting the needs of electronic product development towards high density, miniaturization, and high reliability. Therefore, FPC is used in aerospace, military, mobile communications, laptops, computer peripherals PDA、Digital cameras and other fields or products have been widely used.

FPC also has good heat dissipation and solderability, as well as advantages such as easy installation and low overall cost.

Flexible printed circuit boards can be classified into single-sided, double-sided, and multi-layer boards. The substrate used is mainly polyimide copper-clad laminate. This material has high heat resistance and good dimensional stability, and is pressed into the final product with a cover film that combines mechanical protection and good electrical insulation properties. The surface and inner conductors of double-sided and multi-layer printed circuit boards are metalized to achieve electrical connections between the inner and outer circuits.

The functions of flexible circuit boards can be divided into four types, namely lead lines, printed circuits, connectors, and integration of functions. Their applications cover computers, computer peripheral auxiliary systems, consumer electronics, and automobiles

Type:

1. Single panel

After the completion of the circuit, a single-sided PI copper-clad material is used to cover it with a protective film, forming a flexible circuit board with only a single layer of conductor.

2. Ordinary double-sided panel

After using double-sided PI board copper-clad material on the double-sided circuit, a protective film is added on both sides to form a circuit board with double-layer conductors.

3. Single panel generation from substrate

Using pure copper foil material in the circuit process, a protective film is added on both sides in sequence to create a circuit board with only a single layer of conductor but exposed conductors on both sides of the board.

4. Double sided board generated from substrate

Using two layers of single-sided PI copper-clad board material with adhesive tape that opens windows at specific locations for compression bonding, a double-sided conductor circuit board with a two-layer separation structure in local areas is formed to achieve high flexural performance in the layered area

For more, please visit https://www.hitechpcba.com/flexible-pcb-manufacturer

Please feel free to contact [email protected] if you have any PCB needs.

#Flexible circuit board

Electronic Manufacturing Services Good China EMS supplier - Shenzhen Hitech Circuits

Hitech Circuits has always been focused on electronic manufacturing services for over 15 years with much experience for design and production in the PCBA field. We provide one-stop services, including SMT mounting, plug-in (THT), electronic component procurement and sourcing, finished product assembly, testing, and other comprehensive services.

From the introduction of new products to the provision of customized components, to stable production, we provide solutions for the entire product lifecycle, enabling our customers to achieve success. Hitech Circuits creates value for customers through advanced value engineering services, customized component solutions, global factory layout, and high-level supply chain management.

We have introduced advanced imported production and testing equipment, and have been committed to the development of new technologies for a long time, implementing comprehensive quality management and environmental management. Therefore, we have become an industry leader with highly competitive prices, ultra-high product stability, reliable delivery guarantee, and excellent service.

One stop electronics manufacturing service

One stop electronic manufacturing service: providing agency component procurement, circuit board supply, and design and application of built-in electronic devices for brand electronic equipment manufacturers.

Provide and solve the entire process from electronic consumer goods to electronic circuit assembly. At the same time, it is equipped with some warehouse logistics management, quality control, and technical services.

Hitech Circuits provides customized services to every customer, forming a professional team to serve a single customer, from sample production, trial production, to mass production, aiming to help customers' products go public in the shortest possible time. Please refer to the one-stop service process we provide for customers as shown in the diagram:

Engineering Services

NPI New Product Introduction

A professional team composed of departments such as engineering, quality assurance, materials, and production management, serving a single customer, strictly overseeing every step of production for the customer.

Provide DFM and DFT reports for customer new product development

The product engineer acts as the communication coordinator for engineering related issues between the customer and the internal team, integrating internal information to help the customer eliminate problems as soon as possible.

Based on the trial production results, discuss and propose improvement measures and suggestions in the trial production report to assist customers in rapid mass production and marketing of their products.

Design Optimization for DFM/DFT Manufacturability and Testability

DFM (Design for Manufacturing)

DFM refers to the consideration of manufacturing capabilities during product design. Through Hitech Circuits electronics' DFM report, it can assist customers in early detection of design issues, reduce the time for repeated trial production verification, save material and labor costs, improve product production quality, and accelerate mass production speed.

Design For Testing

In the PCB layout stage of the product, the Hitech Circuits Electronic Engineering team can analyze the Gerber files and make empirical judgments through software to determine the testing coverage of the PCB and the potential risk of failure during the testing phase. This allows customer RD personnel to modify the circuit diagram as soon as possible, reducing the difficulty of future release engineering design changes.

ECO/ECR/ECN Engineering Specification Change Management

Engineering change management services include:

ECO Engineering Change Order: usually initiated by customer RD to correct design issues.

ECR Engineering Change Request: typically initiated by the process engineer of the OEM factory, such as requesting customers to change parts to improve SMT/DIP/assembly yield.

ECN Engineering Change Notice: usually issued by the DCC (Document Control Center) document management center to notify relevant units that the BOM has been changed.

Supplier management includes:

Control the quality and cost of key materials for strategic planning.

Establish good relationships with suppliers to achieve stable supply.

Understand supplier quality systems and production processes to ensure material quality.

Regularly audit the quality, price, and delivery time of suppliers.

Improve communication efficiency between customers, Hitech Circuits and suppliers through the delivery platform.

Exchange experience and resources with suppliers to establish a win-win partnership.

Always rely on unparalleled quality to meet your EMS needs on time. Our core point is always to deliver quality on time, as Hitech Circuits 's core belief is that each functional department and its related processes must be integrated throughout the entire enterprise. An integrated product delivery system method for managing.

Discover top-tier electronic manufacturing services at Hitechpcba. Quality electronics manufacturing solutions tailored to your needs

WhatsApp/Wechat+8618118703950

Please feel free to contact [email protected] if you have any needs.

#pcbassembly #EMS

Professional Aluminum LED PCB Assembly with Short Lead time

Generally, LED PCB assembly is considered to be a circuit board that has the LED components soldered to it. The LED is soldered to the printed circuit board and features a chip that creates the light as electrically connected. A thermal heat sink and a ceramic base are used to bond the chip. Not all the PCB products can be used in Led industry, as an LED PCB is easy to create a high volume of heat, but making it hard to cool with traditional methods. For this reason, metal core PCB is widely used in LED application because of their enhanced ability to dissipate heat, especially aluminum pcb is often used to fabricate PCB for LED lights.

We’ve had great LED PCB assembly experiences with top LED chips to brand such as Cree, Luxeon, Osram, Nichia, Lumileds, MLS, EVERLIGHT, Samsung, LG, Seoul., etc. PCB LED lights can be incorporated into numerous lighting applications due to their combination of excellent energy efficiency, low cost and maximum design flexibility.

LED PCB assembly means installing all necessary electronic components, including LEDs, on a printed circuit board.

If the LED is of SMD type, LED PCB assembly is a surface mount (SMT) component on the PCB.

The assembly process of LED PCB is: screen printing solder paste on PCB pads>solder paste inspection>placing SMD components on PCB pads>reflow soldering to connect component pins to PCB>automatic optical inspection (AOI) to ensure that major problems do not occur.

If the LED is a COB LED, it is directly bonded onto the PCB without the need for surface mount and reflow soldering. These two methods are wire bonding and flip chip bonding.

For wire bonding COB LED PCBs, the chip is connected to the positive and negative pads using gold wires.

Application of LED PCB Assembly

Hitechpcba serves customers in different industries, providing highly reliable and innovative LED PCBs for various applications:

• Horticulture light LED PCB Assembly

• LED controller PCB Assembly

• Computer LED display and indicators

• LED lights PCB Assembly for medical use

• Automotive LED PCBs Assembly include PCBs for brake lights and headlights

• Street lighting LED PCB Assembly

• Flashlights and camping accessories

• Traffic light PCB Assembly

• Commercial lighting LED PCB Assembly

LED PCB Assembly specification

Number of layers for LED PCB

These layers are made up of aluminum and magnesium, but now have Copper base material and Ceramic base materials for LED PCB industry, we can meet it.

Aluminum LED PCBs stand out among other PCBs because it has a good insulation characteristic and has a better machinery performance, the cheap cost is one important factor too.

Types of layers for LED PCB Assembly

Normally, the base layer is made using aluminum alloy metal.

This aluminum alloy substrate used in making the base makes it ideal for through-hole technology which transfers and dissipates heat.

A thermal insulation layer is made using some ceramic polymer which has good viscoelasticity characteristics.

It is highly heat resistant and protects the PCB against heat and mechanical stress.

The circuit layer, which is covered by a copper foil which can range from one to ten ounces.

LED Board type- single or in panel

Some boards are shapeless. For this reason, LED PCB panels are used. This reduces time, labor production and testing time.

Some LED PCB Assembly is done on a single board while others are done on panel boards.

LED PCB Assembly Process

Roughly, the PCBA process can be divided into theses phases: soldering paste printing > SMT (surface mounted technology) > reflow soldering > AOI (automated optical inspection)> THT (through-hole technology) > wave soldering > touch-up and cleaning > IC-programming > FCT (functional tests) > aging testing.

Below we show you the process.

Step1. Summarizing Project Information

Before contacting your supplier, make sure you have all the project information. Suppliers will need info following for quoting LED PCB assembly:

Gerber+BOM

LED PCB specification

Quotation quantity

Once you have gathered these information, you can contact us and request for a quote.

Of course, you can also provide the schematic, LED PCB Assembly pictures and even samples to us. The more details they have, the more accurate the supplier’s quotation will be.

Step2. Discussion and details about custom LED PCB Assembly

Different projects will have different requirements. Remember the special requirements mentioned in step 1? That’s going to be the focus of this session. Equipment and engineering capacity will not be identical between suppliers. Make sure your supplier has the equipment to produce and assemble major components and the corresponding testing capabilities.

For example, some vendors don’t have X-ray testing equipment, which means they can’t check the mount quality of BGA chips. Outsourcing this step will increase risk and cost. That’s what you don’t want.

Also, pay attention to time taken by the supplier to quote. Motherboards often contain hundreds or even thousands of components, and they are supplied by different manufacturers. To ensure the quality of the components, the supplier sourcing team will make multi-inquiries from these manufacturers or authorized suppliers to match customer’s requirement, which usually takes 2-3 business days, and even longer for some scarce chips. Therefore, if your project is complex and the supplier quotes you within few hours, double check with them.

Step3. Sample and feedback

After confirming the PI, the supplier will usually provide pre-production samples for your approval. At the same time, the supplier will also confirm with you the logistics plan of the bulk goods. Make sure they understand your shipping requirements, including details on packaging, customs clearance, taxes, etc.

For us to have a successful LED PCB Assembly process, its functions must be defined. Compliance requirement is defined to reduce the effect when components are selected.

The Bill of Materials is then generated from the information installed on the LED PCB.

All this information is used to assemble components which are identified from MOB to the LED PCB.

After that, the routing of traces is determined to each component, based on the size, shape of the circuit board and location of connectors.

For more, visit https://www.hitechpcba.com/led-pcb-assembly

Please feel free to contact [email protected] if you have any needs.

#LED PCB #aluminium pcb

Nice Ceramic PCB Resist High Temperature Good Price from China

Ceramic PCB board is also called ceramic substrate, ceramic circuit board, ceramic copper coated plate, ceramic substrate refers to the copper foil directly bonded to alumina (Al2O3) or aluminum nitride (AlN) ceramic substrate or other ceramic substrate surface (single or double) on the special process board.

The ceramic pcb can be described as an organic binder and ceramic powder that conducts heat. The thermal conductivity at which this PCB is prepared is between 9 to 20W/m.

To explain further, ceramic PCBs are printed circuit boards, with ceramic as its base material. This base material is highly thermally conductive like aluminum nitride, alumina, and beryllium oxide. These are very effective in the transfer of heat from hot spots and then dissipating this heat over the entire surface.

Asides from this, the fabrication of ceramic PCB is done with the LAM technology. This technology is a laser quick activation metallization type. Therefore, ceramic PCBs are highly versatile and can easily substitute the whole traditional PCBs. This PCB will achieve this with even more enhanced performance and involving less complicated construction.

1. The difference between ceramic substrate and pcb board

Ceramic substrate is that we say ceramic circuit board, ceramic pcb and printed circuit board have the same circuit interconnection, through hole conduction characteristics. So what are the differences between ceramic substrate and pcb board?

(1)The thermal conductivity of PCB board and ceramic substrate is different

Ceramic substrate is made of ceramic substrate, that is, the medium is ceramic material, including alumina ceramic base, aluminum nitride ceramic base, silicon nitride ceramic base, ceramic heat dissipation performance is very good, the thermal conductivity of ceramic substrate from 25w to 230w, different ceramic medium thermal conductivity is different. The thermal conductivity of alumina ceramic substrate is 25w~30w, the thermal conductivity of aluminum nitride ceramic substrate is above 170w, and the thermal conductivity of silicon nitride ceramic substrate is 80w~90w. Then pcb board is usually the use of medium is fr4 or metal substrate, thermal conductivity is less than 3w, and the gap is too large compared with ceramic substrate, especially the need for high heat dissipation performance of the product field, ceramic substrate has become a very popular medium material.

2. Ceramic substrate and pcb board insulation is different

Ceramic substrate is generally line layer - ceramic base - line layer structure, ceramic substrate insulation is very good, is also determined by the ceramic material itself, no need to add insulation layer. pcb board needs to add an insulating layer to play a mobile insulation role, but the insulation effect is far less than ceramic substrate.

(3) The heat dissipation structure of ceramic substrate is different from that of pcb board

The heat dissipation structure of the ceramic substrate is the structure of the circuit layer - ceramic base - circuit board layer. Because there is no insulating layer in the middle, the heat of the device is transferred directly from the ceramic base to the circuit layer and the heat dissipation is out, the heat dissipation is fast and the effect is good. pcb board is the need for heat from the medium layer - insulation layer - line layer, separated by an insulation layer at the same time, the dielectric layer itself of the thermal conductivity is poor, then add heat conduction adhesive, heat conduction effect is still not improved, often can not achieve the purpose of rapid heat dissipation device. In particular, some high-power devices need to use ceramic substrate as a cooling substrate in the product field where the heat dissipation and temperature change is relatively large.

(4) Ceramic substrate and pcb board application is different

Ceramic substrate and pcb board application is different, mainly the performance of the two is different, ceramic substrate is used in high thermal conductivity, high heat dissipation, high insulation, product field, such as high power LED lighting, high power module, high-frequency communication, track power supply; Ordinary pcb board is used in some more extensive, heat dissipation, insulation and other requirements are not strict, used in private commercial commodities.

(5) The price of ceramic substrate is different from that of pcb board

The material and performance of ceramic substrate and pcb board are different, and the final decision is that their prices are different. The board of ceramic substrate is very high and the production cost is high.

Ceramic substrate has outstanding advantages, but the ceramic substrate is fragile and has a high scrap rate, which requires a high level of production technology. However, you can't make a circuit board with the size of more than one meter like ordinary pcb boards. Hitech Circuits has more than 10 years of experience in the ceramic circuit board industry, and many universities and R & D institutions are in cooperation, welcome to inquiry.

2.Ceramic substrate and high-frequency plate difference

The material is different. The ceramic substrate is made of aluminum oxide or aluminum nitride, and the high frequency plate is made of Rogers, Yaron, PTFE, etc., with low dielectric constant and high frequency communication speed.

Performance is different. Ceramic substrate is widely used in refrigeration and systems, high power modules, automotive electronics and other fields. High frequency board is mainly used in high frequency communication field, aviation, high-end consumer electronics and so on. High-frequency communication field involves heat dissipation requirements, usually need to be combined with the ceramic base and high frequency plate, such as high frequency ceramic pcb.

1. Application of ceramic substrate

Ceramic substrates are used in led chips to achieve better thermal conductivity. In addition, ceramic substrate is also used to make ceramic chips in the following electronic devices:

　　◆High power semiconductor module

　　◆Semiconductor cooler, electronic heater; Power control circuit, power mixing circuit

◆Intelligent power module; High frequency switching power supply, solid state relay

◆Automotive electronics, aerospace and military electronics components

　　◆Solar panel module; Telecommunications private exchange, receiving system; Laser and other industrial electronics

Application of ceramic substrate in third generation semiconductor

The mainstream power devices represented by MOSFET, IGBT and transistor occupy a place in their own frequency and power supply segments. Due to the comprehensive excellent performance of IGBT, it has replaced GTR, become the inverter, UPS, frequency converter, motor drive, high-power switching power supply, especially now the hot electric vehicle, high-speed rail and other power electronic devices in the mainstream devices.

Application of alumina ceramic substrate in electronic power field

In the field of power electronics, such as power switching power supply, electric drive, etc., dielectric ceramic substrate is needed to achieve better thermal conductivity, prevent current burn out and short circuit.

Application of alumina ceramic co-fired plate in lithium battery industry

With the recommendation of artificial intelligence and environmental protection, the automobile industry has also launched electric cars, mainly through battery storage. Lithium batteries made of ceramic substrate can achieve better current and heat dissipation functions, promoting the market demand for new energy vehicles.

2. Advantages of ceramic substrate

A. The thermal expansion coefficient of ceramic substrate is close to that of silicon chip, which can save Mo sheet of transition layer, save labor, save material and reduce cost;

B. Reduce the welding layer, reduce the thermal resistance, reduce the cavity;

C. Under the same load flow, the wire width of copper foil 0.3mm thick is only 10% of that of ordinary printed circuit board;

D. Excellent thermal conductivity, so that the chip packaging is very compact, so that the power density is greatly increased, improve the reliability of the system and device;

E. Ultra-thin (0.25mm) ceramic substrate can replace BeO, without environmental toxicity problems;

F. Large load capacity, 100A current continuously through 1mm wide 0.3mm thick copper body, temperature rise about 17℃; With 100A current continuously passing through a 2mm wide 0.3mm thick copper body, the temperature rise is only about 5℃.

G. Low thermal resistance, 10×10mm ceramic substrate 'thermal resistance of 0.63mm thickness of ceramic substrate is 0.31K/W, 0.38mm thickness of ceramic substrate is 0.19K/W, 0.25mm thickness of ceramic substrate is 0.14K/W.

H. High insulation and high pressure resistance to ensure personal safety and equipment protection.

I. New packaging and assembly methods can be realized, so that the product is highly integrated and the size is reduced.

Ceramic PCB board is also called ceramic substrate, ceramic circuit board, ceramic copper coated plate, ceramic substrate refers to the copp

Please feel free to contact [email protected] if you have any needs.

#ceramic pcb

PCB Assembly, PCB Manufacturing & Electronic Assembly service & electronics manufacturing company – Hitech Circuits Co., Limited

As leading one-stop PCB Assembly services provider in China, Hitech Group offers high quality, cost effective, express PCB board products and provides PCB manufacturing, electronics assembly manufacturing, components sourcing, Box build assembly and PCBA testing services for our customers.

For low volume PCB assembly projects, our quick turn PCB assembly delivery time goes from 8 hours to 48 hours when components are ready.

No matter you are an electrical engineer, a product designer, a system integrator or a maker looking for PCB fabrication and PCB assembly, or PCB manufacturing and assembly, or electronic assembly services (electronic PCB assembly) ,or a low cost PCB assembly house, Hitech Circuits PCB assembly team will be your perfect PCB assembly house in China.

What is PCB Assembly?

It’s the step in the manufacturing process in which you populate a blank board with the electronic components needed to make it into a functional printed circuit board. It’s these components that make a board into the circuit that enables an electronic product to function. PCB assembly typically takes place via one of two processes:

1. Surface-mount technology

SMT: SMT stands for “Surface Mount Technology“. The SMT components are very small sizes and comes in various packages like 0201, 0402, 0603, 1608 packages for resistors and capacitors. Similarly for Integrated circuits ICs we have SOIC, TSSOP, QFP and BGA.

The SMT components assembly is very difficult for human hands and can be time taking process so it is mostly done by automated pick and place machine.

2. Through-hole manufacturing

THT: THT stands for “Through hole Technology”. The components with leads and wires, like resistors, capacitors, inductors, PDIP ICs, transformers, transistors, IGBTs, MOSFETS are example.

The component has to be inserted on one side of PCB and pulled by leg on other side and cut the leg and solder it. The THT components assembly is usually done by hand soldering and is relatively easy.

Printed Circuit Board Assembly Techniques

There are only two common PCBA techniques available for use by a PCB designer. The methods are:

1. Automated PCB Assembly Techniques

Generally, this technique employs the use of state of the art machines, which are fully automatic. For example, the surface mount components are worth positioning with the aid of an automated pick and place machine.

Again, reflow soldering is commonly for surface mount components usually done in a reflow oven. An automated solder stencil is also used to apply the solder paste on the PCB.

Finally, high tech inspection machines are used to confirm and check the quality of the PCBA. Some of which include: Automated optical inspection machine (AOI), X-ray inspection machines, etc.

Above all, due to the precise monitoring, control of soldering, no human input and versatile machines.

This technique ensures utmost efficiency, output consistencies, and limits defects.

2. Manual PCB Assembly Techniques

This method is favorite for use with through-hole parts, which needs manual placement on the board. Besides, with these through-hole parts, it’s advisable you use wave soldering. Note that in the through- hole assembly process, you need to place the components and electronics on the PCB.

After that, you use wave soldering to solder the leads. Typically, you will need an individual to insert a component into a marked PTH. Once done, transfer the PCB to the next station where the next person will be on standby tasked with fixing another part.

Top PCB Assembly & Manufacturing company in China. Specializing in rapid-turn PCB assembly, Hitechpcba delivers quality, affordable solution

For RFQ,please contact [email protected]

#pcba

High quality Ceramic PCB made in China with cheaper price by Hitech Circuits Co., Limited

What is Ceramic PCB?

The ceramic pcb can be described as an organic binder and ceramic powder that conducts heat. The thermal conductivity at which this PCB is prepared is between 9 to 20W/m.

1. The difference between ceramic substrate and pcb board

(1)The thermal conductivity of PCB board and ceramic substrate is different

2. Ceramic substrate and pcb board insulation is different

(3)The heat dissipation structure of ceramic substrate is different from that of pcb board

(4)Ceramic substrate and pcb board application is different

(5) The price of ceramic substrate is different from that of pcb board

2.Ceramic substrate and high-frequency plate difference

1. Application of ceramic substrate

Ceramic substrates are used in led chips to achieve better thermal conductivity. In addition, ceramic substrate is also used to make ceramic chips in the following electronic devices:

　　◆High power semiconductor module

　　◆Semiconductor cooler, electronic heater; Power control circuit, power mixing circuit

◆Intelligent power module; High frequency switching power supply, solid state relay

◆Automotive electronics, aerospace and military electronics components

　　◆Solar panel module; Telecommunications private exchange, receiving system; Laser and other industrial electronics

Application of ceramic substrate in third generation semiconductor

Application of alumina ceramic substrate in electronic power field

Application of alumina ceramic co-fired plate in lithium battery industry

2. Advantages of ceramic substrate

A. The thermal expansion coefficient of ceramic substrate is close to that of silicon chip, which can save Mo sheet of transition layer, save labor, save material and reduce cost;

B. Reduce the welding layer, reduce the thermal resistance, reduce the cavity;

C. Under the same load flow, the wire width of copper foil 0.3mm thick is only 10% of that of ordinary printed circuit board;

D. Excellent thermal conductivity, so that the chip packaging is very compact, so that the power density is greatly increased, improve the reliability of the system and device;

E. Ultra-thin (0.25mm) ceramic substrate can replace BeO, without environmental toxicity problems;

H. High insulation and high pressure resistance to ensure personal safety and equipment protection.

I. New packaging and assembly methods can be realized, so that the product is highly integrated and the size is reduced.

If you want to learn more information and want a quote,please feel free to contact [email protected] and visit us at https://www.hitechpcba.com/ceramic-pcb

#ceramic pcb #pcb manufacturer

Electronic Manufacturing Services China EMS supplier - Hitech Circuits

One stop electronics manufacturing service

Engineering Services

NPI New Product Introduction

Provide DFM and DFT reports for customer new product development

Design Optimization for DFM/DFT Manufacturability and Testability

DFM (Design for Manufacturing)

Design For Testing

ECO/ECR/ECN Engineering Specification Change Management

Engineering change management services include:

ECO Engineering Change Order: usually initiated by customer RD to correct design issues.

ECR Engineering Change Request: typically initiated by the process engineer of the OEM factory, such as requesting customers to change parts to improve SMT/DIP/assembly yield.

ECN Engineering Change Notice: usually issued by the DCC (Document Control Center) document management center to notify relevant units that the BOM has been changed.

Supplier management includes:

Control the quality and cost of key materials for strategic planning.

Establish good relationships with suppliers to achieve stable supply.

Understand supplier quality systems and production processes to ensure material quality.

Regularly audit the quality, price, and delivery time of suppliers.

Improve communication efficiency between customers, Hitech Circuits and suppliers through the delivery platform.

Exchange experience and resources with suppliers to establish a win-win partnership.

Always rely on unparalleled quality to meet your any EMS needs on time.

Always delivering quality on time is our top priority. We start with Hitech Circuits 's core belief that each functional discipline and its related processes must be integrated throughout the entire enterprise. The integrated product delivery system approach for managing business helps to ensure that each customer's plan meets or exceeds all technical and commercial requirements of the customer. In order to successfully become an electronic manufacturing service (EMS) provider among today's competition, the factory must be able to do all of this and do it well throughout the entire product lifecycle. Hitechpcba will try the best to meet different customers’ requirements.

If you want to learn more information and want a quote,please feel free to contact [email protected].

Discover top-tier electronic manufacturing services at Hitechpcba. Quality electronics manufacturing solutions tailored to your needs

#pcbassembly #china pcb manufacturer

Aluminum LED PCB with good quality made in China by Hitech Circuits

What is the LED Circuit Board assembly?

Application of LED PCB Assembly

Hitechpcba serves customers in different industries, providing highly reliable and innovative LED PCBs for various applications:

• Horticulture light LED PCB Assembly

• LED controller PCB Assembly

• Computer LED display and indicators

• LED lights PCB Assembly for medical use

• Automotive LED PCBs Assembly include PCBs for brake lights and headlights

• Street lighting LED PCB Assembly

• Flashlights and camping accessories

• Traffic light PCB Assembly

• Commercial lighting LED PCB Assembly

LED PCB Assembly specification

Number of layers for LED PCB

These layers are made up of aluminum and magnesium, but now have Copper base material and Ceramic base materials for LED PCB industry, we can meet it.

Aluminum LED PCBs stand out among other PCBs because it has a good insulation characteristic and has a better machinery performance, the cheap cost is one important factor too.

Types of layers for LED PCB Assembly

Normally, the base layer is made using aluminum alloy metal.

This aluminum alloy substrate used in making the base makes it ideal for through-hole technology which transfers and dissipates heat.

A thermal insulation layer is made using some ceramic polymer which has good viscoelasticity characteristics.

It is highly heat resistant and protects the PCB against heat and mechanical stress.

The circuit layer, which is covered by a copper foil which can range from one to ten ounces.

LED Board type- single or in panel

Some boards are shapeless. For this reason, LED PCB panels are used. This reduces time, labor production and testing time.

Some LED PCB Assembly is done on a single board while others are done on panel boards.

LED PCB Assembly Process

Below we show you the process.

Step1. Summarizing Project Information

Before contacting your supplier, make sure you have all the project information. Suppliers will need info following for quoting LED PCB assembly:

Gerber

BOM

LED PCB specification

Quotation quantity

Once you have gathered these information, you can contact us and request for a quote.

Of course, you can also provide the schematic, LED PCB Assembly pictures and even samples to us. The more details they have, the more accurate the supplier’s quotation will be.

Step2. Discussion and details about custom LED PCB Assembly

Step3. Sample and feedback

For us to have a successful LED PCB Assembly process, its functions must be defined. Compliance requirement is defined to reduce the effect when components are selected.

The Bill of Materials is then generated from the information installed on the LED PCB.

All this information is used to assemble components which are identified from MOB to the LED PCB.

After that, the routing of traces is determined to each component, based on the size, shape of the circuit board and location of connectors.

If you want to learn more information and want a quote,please feel free to contact [email protected].

Discover top-tier LED PCB assembly services from a trusted manufacturer. Get efficient solutions for your projects at Hitechpcba

#aluminium pcb #Aluminum LED PCB

Medical Main Board PCBA with good performance made in Shenzhen China

With the rapid development of modern medical technology, medical equipment is moving towards high precision, miniaturization, and intelligence. In this process, PCBA (Printed Circuit Board Assembly) processing technology plays a crucial role. PCBA is one of the core components of medical equipment, which integrates various electronic components together to achieve complex functions of the equipment, ensuring the accuracy and reliability of medical operations.

Printed Circuit Board Assembly for medical electronic products,

It is the assembly of medical grade PCBs, components, and special processes into functional boards that can be directly used in medical equipment.

The biggest difference between it and ordinary industrial/consumer electronics PCBA is its extremely high reliability, safety, traceability, and compliance.

1、 Application Fields

Almost all medical electronics are inseparable from:

Diagnostic categories: CT, MRI, ultrasound, electrocardiograph, oximeter, biochemical analyzer

Therapeutic category: ventilators, anesthesia machines, physiotherapy devices, surgical equipment

Monitoring category: monitor, infusion pump, dialysis equipment

In vitro diagnostics (IVD): POCT rapid testing equipment, nucleic acid testing equipment

Implant/Wear: Pacemakers, hearing aids, wearable monitoring devices

2、 Core Features (Most Critical)

high reliability

Cannot crash, cannot trigger by mistake, and cannot fail at critical moments.

high security

Direct contact with the human body/life support must prevent leakage, interference, and misoperation.

Strict compliance

Must follow:

International: IEC 60601 (Safety of Medical Electrical Equipment)

EU: CE MDR

United States: FDA

China: NMPA Medical Device Registration

traceability

From the PCB board, each component, welding batch, and inspection data, the entire process can be traced.

long life cycle

Medical equipment should be used for 5-10 years or more,

Require long-term supply of components and avoid easy shutdown.

3、 Material and PCB requirements (different from ordinary PCBA)

Commonly used PCB:

FR-4 high Tg, heat-resistant, flame-retardant

High frequency/high precision: Rogers, PTFE, etc

requirements

Accurate impedance control

High voltage resistance and high insulation strength

Resistant to chemical cleaning and high temperature aging

Priority given to halogen-free and biocompatibility

4、 Production process requirements

component screening

Priority: Medical grade/Vehicle grade/Industrial grade, Refuse to sell new or miscellaneous products.

welding process

Strict temperature control and minimal residual flux

Common precision BGA and QFN soldering

Three defenses and reinforcement

Commonly used: Three proof paint (moisture-proof, corrosion-resistant, and mold resistant), glue filling, and reinforcement.

rigorous testing

ICT needle bed testing

Functional testing FCT

aging test

Safety regulations for withstand voltage, insulation, and grounding testing

Electromagnetic compatibility EMC/EMI testing

The Importance of PCBA Processing in Medical Equipment

（1） Realize the multifunctionality of medical equipment

Diagnostic equipment

PCBA processing technology enables precise control of imaging parameters in medical imaging diagnostic equipment such as X-ray machines, CT scanners, and MRI (magnetic resonance imaging) devices. For example, the PCBA in a CT scanner can control the emission intensity of the X-ray tube and the reception signal processing of the detector. Through high-precision PCBA circuits, the weak signals received by the detector can be amplified, filtered, and digitized to generate clear and accurate images of the internal structure of the human body, helping doctors accurately diagnose diseases.

The PCBA in ultrasound diagnostic equipment is responsible for controlling the emission frequency, intensity, and reception processing of ultrasound waves. Through complex circuit design, ultrasound imaging of different depths and tissue types can be achieved, and various functions such as Doppler blood flow detection can be performed, providing rich information for clinical diagnosis.

Therapeutic equipment

For radiation therapy equipment such as linear accelerators, PCBA processing enables precise control of high-energy radiation. The PCBA in a linear accelerator can control the emission of the electron gun, the intensity and direction of the accelerating electric field, as well as the focusing and scanning of the radiation. Through precise PCBA control circuits, high-energy radiation can be accurately focused on the tumor site, maximizing the killing of cancer cells while protecting surrounding normal tissues and improving the effectiveness of radiation therapy.

Electrical stimulation therapy equipment such as pacemakers and nerve stimulators also rely on PCBA processing. The PCBA in a pacemaker can monitor the electrical activity of the heart. When abnormal heart rhythm is detected, it can emit electrical pulses according to a preset program to stimulate the heart to restore normal rhythm. The PCBA in the neurostimulator can generate electrical stimulation signals of specific frequency and intensity, which are used to treat neurological diseases such as Parkinson's disease and epilepsy, and improve patients' symptoms.

（2） Ensure the reliability and stability of medical equipment

Power management

Medical equipment requires extremely high stability of power supply. The power management module in PCBA processing can stabilize, filter, and convert the input power supply, ensuring stable working voltage for various electronic components in the equipment. For example, in some life support equipment such as ventilators and extracorporeal membrane oxygenation (ECMO) devices, the power management part of the PCBA can ensure that the critical functions of the equipment can still operate even in the event of power outages or power outages. By using backup batteries and intelligent power switching circuits, PCBA can achieve seamless power switching, ensuring the safety of patients' lives.

Electromagnetic Compatibility (EMC)

There are a large number of electronic devices in the medical environment, and electromagnetic interference problems are very prominent. PCBA processing can ensure the normal operation of medical equipment in complex electromagnetic environments through reasonable circuit layout, shielding design, and electromagnetic filtering technology. For example, in the operating room, high-frequency electric knives, anesthesia machines, monitors, and other equipment work simultaneously. The EMC design of PCBA can prevent electromagnetic interference between these devices, avoiding equipment misoperation or performance degradation. By using metal shielding covers, grounding technology, and electromagnetic interference filters on PCBA, electromagnetic radiation and conducted interference can be effectively suppressed, improving the electromagnetic compatibility of medical equipment.

（3） Promote the miniaturization and portability of medical equipment

Wearable medical devices

With the development of PCBA processing technology, wearable medical devices such as smart bracelets, smartwatches, continuous blood glucose monitors, etc. have been widely used. The PCBA in these devices use highly integrated chips and micro components, integrating complex circuit systems in extremely small spaces through multi-layer circuit board design and micro assembly technology. For example, the PCBA in a continuous blood glucose monitor can integrate glucose sensors, signal processing circuits, wireless communication modules, etc., to achieve real-time monitoring and data transmission of patients' blood glucose levels, making it convenient for patients and medical staff to understand the condition at any time, while also improving patients' quality of life.

Portable diagnostic and therapeutic equipment

The emergence of portable ultrasound diagnostic devices, portable electrocardiographs, and other equipment is due to the advancement of PCBA processing technology. The PCBA in these devices adopts low-power chips and efficient power management technology, reducing the size and weight of the devices while extending their working time. For example, the PCBA in portable ultrasound diagnostic equipment can integrate ultrasound transmission and reception circuits, image processing circuits, display screen driver circuits, etc. By optimizing circuit design and adopting advanced packaging technology, the equipment can be easily carried to the bedside or remote areas for medical diagnosis, expanding the scope of medical services.

3、 Technical challenges of PCBA processing in medical equipment

（1） High precision and high reliability requirements

Component selection

The selection of components is crucial in the PCBA processing of medical equipment. Components with high reliability, long lifespan, and high precision must be selected. For example, for implantable medical devices such as pacemakers, the selected chips and electronic components need to undergo strict biocompatibility testing and have an extremely low failure rate during long-term operation. At the same time, for some high-precision diagnostic equipment such as electron microscopes, passive components such as resistors and capacitors on PCBA need to have high-precision resistance and capacitance values to ensure the measurement accuracy of the equipment.

manufacturing process

The manufacturing process requirements for medical device PCBA are higher than those for ordinary electronic products. In the manufacturing process of circuit boards, it is necessary to strictly control parameters such as etching accuracy, coating thickness, and hole wall quality. For example, in some high-precision medical sensor PCBA, the circuit width and spacing may need to be controlled within a range of tens of micrometers or even smaller, which requires the use of advanced photolithography technology and high-precision etching equipment. At the same time, high-precision surface mount machines and reflow soldering equipment are required during the component placement process to ensure accurate placement and soldering quality of components, and to avoid defects such as virtual soldering and short circuits.

（2） Strict compliance with regulations and standards

Medical regulations

Medical devices are subject to strict regulatory oversight, such as the FDA (Food and Drug Administration) regulations in the United States and the CE certification standards in the European Union. PCBA processing companies need to ensure that the medical equipment PCBA they produce complies with these regulations and standards. This includes strict control over various aspects of PCBA design, manufacturing, testing, and document management. For example, in the design phase of PCBA, risk assessment and Failure Mode and Effects Analysis (FMEA) are required to ensure the safety and reliability of the design. In the manufacturing process, it is necessary to establish a sound quality control system, record and trace data from every production process, so that effective investigation and handling can be carried out when problems arise with the product.

Industry standards

In addition to regulatory requirements, medical device PCBA also needs to comply with industry standards, such as those established by the International Electrotechnical Commission (IEC). These standards provide detailed regulations on the electrical safety, electromagnetic compatibility, environmental adaptability, and other aspects of PCBA. For example, the IEC 60601 series of standards specify the safety requirements for medical electrical equipment, and PCBA processing companies need to design and test according to these standards to ensure that the product can guarantee the safety of patients and operators under normal use and single fault conditions.

As a leading one-stop electronics manufacturing services provider in China, Hitech Circuits Co., Limited offers high quality, cost effective and quick turn PCB board products, Printed Circuit board, PCB assembly, electronics assembly manufacturing, electronic parts components sourcing services for your new products development.

With mature supply chain, talented design team, advanced manufacturing techniques and quality control systems, Hitech Circuits Co., Limited is able to provide one-stop electronics manufacturing services and solution for our customers to help them stand out in the marketplace.

If you have nay needs, please contact [email protected].

Hitechpcba specializes in all types of PCB assembly projects, including full turnkey PCB assembly and partial turnkey PCB assembly. With our

#pcba #pcbassembly

Aluminum Metal Core PCB for Led lighting with high-thermal conductivity

Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single panel is composed of three layers: circuit layer (copper foil), insulation layer, and metal substrate. Commonly seen in LED lighting products. There are two sides, the white side is for soldering LED pins, and the other side presents the natural color of aluminum, usually coated with thermal conductive paste and in contact with the thermal conductive part. There are also ceramic substrates and so on.

LED aluminum substrate refers to PCB, which also means printed circuit board. However, the material of the circuit board is aluminum alloy. Previously, the material of our general circuit board was fiberglass, but because LED generates a lot of heat, the circuit board used for LED lamps is usually aluminum substrate, which can conduct heat quickly. The circuit board used for other equipment or electrical appliances is still fiberglass board.

Aluminum PCB (metal-based copper-clad laminate MCPCB) is an efficient heat dissipation circuit board designed specifically for high-power and high heat generating electronic devices. It is based on aluminum alloy and has a three-layer composite structure. Its core advantages are strong heat dissipation, mechanical stability, and cost friendliness. It is widely used in scenarios such as LED, power supply, and automotive electronics.

1、 Standard three-layer structure (sandwich)

1. Circuit layer (top layer, copper foil)

Material: Electrolytic/rolled copper foil, with a thickness of 1oz~10oz (35-350 μ m), thicker than ordinary PCB, and stronger current carrying capacity.

Function: Etched into circuits to achieve electrical connections and high current transmission.

2. Insulation and thermal conductivity layer (middle layer, core)

Material: Ceramic filled epoxy resin/polyimide (Al ₂ O3, AlN, BN, etc.), thickness 50-200 μ m.

Core function: insulation+thermal conductivity+bonding, withstand voltage of 2.5-6kV, overall thermal conductivity of 1.0-20W/(m · K) (ordinary FR-4 is only 0.3-0.5).

Key: Determining the overall heat dissipation and electrical safety of the board is the technical core.

3. Metal substrate (bottom layer, aluminum plate)

Material: 6061/5052 aluminum alloy, thickness 1.0-3.0mm, thermal conductivity 150-230W/(m · K).

Function: Fast homogenization+external heat dissipation+mechanical support, impact resistance, bending resistance, and dimensional stability.

2、 Core Performance and Advantages

1. Heat dissipation crushing level (biggest highlight)

The thermal resistance is only 1-2 ℃ (FR-4 is about 20-22 ℃), and under the same operating conditions, the device temperature is 20-50 ℃ lower, significantly extending its lifespan.

It can directly replace some heat sinks, reduce volume, and lower costs.

2. Machinery and reliability

High strength, earthquake resistant and deformation resistant, suitable for harsh environments such as automotive and industrial use.

The coefficient of thermal expansion (≈ 24ppm/℃) is closer to that of silicon/ceramic chips, reducing thermal stress cracking.

Lightweight (60% lighter than copper substrate), recyclable, RoHS compliant.

3. Electrical and Processing

Strong current carrying capacity and high voltage resistance; Supports SMT and has good processability.

3、 Main classification (by thermal conductivity/structure)

According to thermal conductivity:

Ordinary type: 1.0~2.0W/(m · K), suitable for LED lighting.

High thermal conductivity type: 3.0~5.0W/(m · K), industrial power supply, automotive electronics.

Ultra-high thermal conductivity:>10W/(m · K), high-end power module, charging pile.

By structure: single panel (mainstream), double-sided panel (rare), multi-layer panel (extremely difficult).

4、 Typical application scenarios

LED lighting: bulb, tube light, panel light, car headlight (most mainstream).

Power supply category: Switching power supply DC‑DC、AC‑DC、 Inverter, welding machine, charging station power board.

Automotive electronics: BMS, headlights, motor controllers, onboard power supply.

Others: high-power amplifiers, industrial controls, hybrid ICs, LED displays.

Aluminium PCB are metal-based, copper-clad laminates with a good heat dissipation function. Usually, Aluminium PCB is referred to LED PCB board, which is the most important part of LED display and lighting products, etc.

Hitech Circuits Co., Limited is a professional aluminum pcb board, LED PCB manufacturer in China. Through 10 years of aluminum pcb board designing and manufacturing experience, Hitech are able to provide high quality and cost-effective single layer, double layer and multi-layer aluminum pcb boards to global customers.

For any of your requirements regarding aluminum pcb board, please don’t hesitate to contact [email protected].

#aluminium pcb

Perfect and Great FR4 PCB board Manufacturing with high quality made in Shenzhen China

FR4 is a commonly used printed circuit board (PCB) substrate material, mainly composed of fiberglass cloth and epoxy resin. Fiberglass cloth provides excellent mechanical strength, allowing PCBs to withstand certain external forces without easily deforming or damaging; Epoxy resin plays a role in bonding glass fibers and has good electrical insulation performance and chemical stability.

PCB or Printed Circuit Board is the traditional name for the bare board of which we produce with the layout data and which will be used to mount the components on.

A printed circuit board, or PCB, is used to mechanically support and electrically connect electronic components using conductive pathways, tracks or signal traces etched from copper sheets laminated onto a non-conductive substrate. Components are generally soldered onto the PCB to both electrically connect and mechanically fasten them to it.

1、 What is FR4 PCB? ——Definition and core positioning

FR4 PCB refers to a printed circuit board (PCB) with FR4 substrate as the core, where "FR" stands for "Flame Retainer" and "4" represents the fourth generation flame retardant substrate standard. It is currently the most widely used and mature universal PCB in the world. It is processed by etching, drilling, solder mask, screen printing and other processes using FR4 copper-clad laminates (fiberglass cloth+epoxy resin+copper foil), and has three core functions: electrical insulation, mechanical support, and signal transmission. It is the "skeleton and nerve" of the vast majority of electronic devices.

Compared with special-purpose PCBs such as aluminum substrates, Rogers high-frequency boards, and ceramic substrates, the core advantages of FR4 PCBs are strong versatility, controllable cost, mature technology, and coverage of low, medium, and high difficulty products. They occupy more than 70% of the global PCB market share and can be regarded as the "cornerstone of the electronics industry".

2、 Core Structure and Materials of FR4 PCB

1. Core substrate: FR4 copper-clad laminate (determines basic performance)

The core of FR4 substrate is a composite structure of "fiberglass cloth+epoxy resin", which can be divided into ordinary type, high Tg type, halogen-free type, etc. according to performance. Key parameters include:

Tg value (glass transition temperature): ordinary FR4 Tg ≈ 130~140 ℃, high Tg FR4 Tg ≥ 170 ℃ (high temperature resistance, aging resistance, suitable for welding intensive/high temperature conditions);

Flame retardant rating: UL94 V-0 (mandatory standard, self extinguishing in case of fire, non spreading);

Dielectric constant (ε r): 4.2~4.8 (1MHz), meeting the requirements of conventional signal transmission;

Thermal conductivity: 0.3~0.5 W/(m · K) (with average heat dissipation, suitable for low to medium power consumption scenarios).

2. Copper foil layer (signal transmission carrier)

Materials: electrolytic copper foil (conventional choice, low cost), rolled copper foil (good flexibility, suitable for flexible FR4 or high-frequency scenarios);

Thickness: Conventional 1oz (35 μ m), 2oz (70 μ m). For high current scenarios, 3-10oz thick copper can be used, and ultra-thin copper foil (0.5oz) can be used for high-density circuits.

3. Solder mask (protection and insulation)

Material: Epoxy resin solder mask ink (mainly green, supporting customized colors such as black, white, blue, etc.);

Function: To prevent copper foil oxidation, avoid solder joint short circuits, protect circuits from mechanical damage, and some solder mask inks support chemical cleaning resistance and high hardness requirements.

4. Silk screen layer (identification and maintenance)

Content: Component numbers (R1, C2), polarity markings, manufacturer logo, version number;

Function: It is convenient for production assembly, post maintenance and traceability. The ink needs to have the characteristics of friction resistance and not easy to fall off.

3、 Core Performance and Advantages of FR4 PCB

1. Highly versatile and adaptable to a wide range of scenarios

Balanced electrical performance: low dielectric loss (suitable for conventional signals below 1GHz), high insulation strength (withstand voltage ≥ 2kV), and current carrying capacity to meet the needs of the vast majority of electronic devices;

Stable mechanical performance: resistant to bending and impact, precise dimensional tolerance control (within ± 0.1mm), suitable for automated assembly;

Good process compatibility: Supports mainstream processes such as SMT surface mount, DIP plug-in, BGA/QFN precision soldering, through-hole electroplating, impedance control, etc., and can achieve multi-layer board processing from single-layer, double-layer to tens of layers.

2. Cost and supply chain advantages

Popularization of raw materials: FR4 copper-clad laminates have sufficient production capacity and numerous global suppliers (such as Shengyi, Jiantao, Rogers, etc.), with procurement costs much lower than special substrates;

Mature processing: More than 90% of PCB factories in the industry have FR4 processing capabilities, high mass production efficiency, stable yield (conventional multi-layer board yield ≥ 98%), and can adapt to both small and large orders.

3. Environmental Protection and Compliance

Conventional FR4 meets RoHS standards (lead-free, cadmium free), while halogen-free FR4 (without brominated flame retardants) can meet stricter environmental requirements such as EU REACH and US FDA, and is suitable for special fields such as healthcare and automotive.

4、 Main classifications of FR4 PCB

1. Divided by layers (the most commonly used classification method)

Single Sided: With copper foil wiring on only one side, it has a simple structure and the lowest cost, making it suitable for simple circuits such as remote controls, toys, and power adapters;

Double Sided: Both sides have lines, and the upper and lower layers are connected through vias, making it the mainstream choice for consumer electronics (such as mobile phone chargers, routers, and small home appliance control boards);

Multi Layer board: 3 or more layers, including inner layer circuits, optimized for high-density and complex circuits (such as mobile phone motherboards, computer graphics cards, industrial controllers) through blind holes and buried holes, suitable for 20-40 layers in high-end scenarios.

2. Divided by performance level

Ordinary FR4: Tg=130~140 ℃, suitable for low to medium power consumption and conventional temperature environments (such as consumer electronics and general industrial control);

High Tg FR4: Tg ≥ 170 ℃, high temperature resistant, anti-aging, suitable for high-temperature welding (such as automotive electronics, power modules), long-term operation equipment;

Zero halogen FR4: flame retardant without bromine, high environmental protection level, suitable for medical, maternal and child electronics, and EU export products;

High frequency FR4: Optimize dielectric constant stability (ε r=3.8~4.2), reduce signal attenuation, suitable for network devices such as routers and switches.

3. Special Form Division

Rigid FR4 PCB (mainstream): high hardness, strong mechanical support, adopted by the vast majority of electronic devices;

Flexible FR4 PCB (with FR4 as the base material for flexible copper-clad laminates): It combines the electrical performance and flexibility of rigid FR4, making it suitable for folding and bending scenarios such as mobile phone cables and wearable devices;

Rigid flexible combination FR4 PCB: Integrating rigid and flexible areas, suitable for complex installation spaces such as drones and medical equipment.

5、 Typical application scenarios of FR4 PCB

FR4 PCB covers almost all fields of the electronics industry and is the "ubiquitous cornerstone of electronics":

Consumer electronics: mobile phones, computers, tablets, routers, televisions, headphones, power banks, small appliances (air conditioners, refrigerators, washing machine control boards);

Industrial electronics: PLC controllers, frequency converters, sensors, industrial power supplies, instruments and meters;

Automotive electronics: in car navigation, central control screen, headlight control board, OBD equipment (for conventional temperature scenarios, high Tg FR4 or special automotive substrates are commonly used in high-temperature core areas);

Medical electronics: blood pressure monitor, blood glucose meter, thermometer, ordinary monitor (non implantable, low to medium power consumption scenario, requiring halogen-free/high reliability FR4);

Communication equipment: base station antenna, optical module, switch, router core board (high-frequency FR4 or mixed high-frequency substrate);

Other: toys, security equipment (cameras, alarms), IoT modules, LED driver boards (low to medium power).

6、 Limitations of FR4 PCB (applicable boundaries)

Weak heat dissipation capability: The thermal conductivity is only 0.3~0.5 W/(m · K), which is not suitable for high-power and high heat generating scenarios (such as LED headlights, charging pile power boards, which require the use of aluminum or copper substrates);

High frequency performance is limited: the dielectric constant varies greatly with frequency, and the signal attenuation is significant. It is not suitable for high-frequency signals above 5GHz or high-speed serial buses (such as PCIe 4.0/5.0), and high-frequency substrates such as Rogers and PTFE need to be selected;

Poor adaptation to extreme environments: In high temperature (>150 ℃), high humidity, and strong corrosive environments, performance is prone to degradation, and ceramic substrates and polyimide substrates need to be selected.

7、 Key Points for FR4 PCB Selection (Practical Guide)

Select by layer:

Simple circuit (up to 100 components): single-layer/double-layer board;

Complex circuits (multi chip, high-density): 4-8 layer boards;

High end devices (mobile phones, servers): multi-layer boards with more than 10 layers.

Select Tg value according to temperature scenario:

Conventional environment (-20~85 ℃): ordinary FR4 (Tg=130~140 ℃);

High temperature environment (>85 ℃), high temperature soldering (such as lead-free reflow soldering peak at 260 ℃): high Tg FR4 (Tg ≥ 170 ℃).

Select copper foil thickness based on current:

Conventional signal: 1oz copper foil;

High current (>5A): 2-5 oz thick copper;

Ultra high current (>10A): 5-10oz thick copper+widened circuit.

Select type according to environmental requirements:

Ordinary export: RoHS compliant FR4;

EU/Medical: Halogen free FR4.

Select substrate according to signal frequency:

Conventional signal (regular FR4;

High frequency signal (1-5GHz): High frequency FR4;

5GHz: Select high-frequency dedicated substrate (non FR4).

For any PCB needs, please feel free to contact [email protected].

Leading China PCB manufacturer, Hitech Circuits specializes in various PCBs – prototypes, FR4, Double-sided, Aluminum, RF, Ceramic, High-Fre

#fr4 pcb

Cheaper Thick copper PCB board Manufacturing with Good Quality made by Hitech Circuits in China

Thick copper PCB is one of the commonly used materials in electronic engineering, which has excellent conductivity and mechanical strength, and is therefore widely used in various electronic devices. This article will introduce the definition, characteristics, and applications of thick copper PCB.

Thick copper printed circuit boards contain over three ounces of copper material per square foot, used to carry high current loads.

1、 What is thick copper plate? ——Definition and Standard Boundaries

Thick Copper PCB refers to printed circuit boards with copper foil thickness ≥ 2oz (70 μ m). In the industry, 2-6oz is usually referred to as conventional thick copper, and>10oz (350 μ m) is referred to as ultra thick copper. The core feature is to break through the current carrying and heat dissipation limits of ordinary PCBs by thickening the copper layer.

1. Copper thickness standard and conversion (industry standard)

Copper thickness specification (oz)

Corresponding thickness (μ m)

Core application scenarios

2oz

Medium current power board, industrial control

3oz

105

High current control board, new energy BMS

6oz

210

Energy storage system, charging pile power circuit

10~12oz

350~420

Extra large current industrial equipment, high voltage platform

15~20oz

525~700

Special military and aerospace equipment

Note: 1oz copper thickness is defined as 1 ounce per square foot of copper foil weight, approximately equal to 35 μ m, and is the standard measurement method in the PCB industry.

2. Core boundary with ordinary PCB

Ordinary PCB copper thickness is mostly 0.5~1oz (17~35 μ m), focusing signal transmission; Thick copper plates are centered around "power carrying", with copper layers serving as both conductive channels and heat dissipation structures, making them the core foundational components of high-power equipment.

2、 Core performance advantages of thick copper plate

A qualitative leap in current carrying capacity

Copper thickness is approximately proportional to current carrying capacity, under the same line width and temperature rise conditions:

1oz copper thickness (35 μ m) 1mm line width current carrying capacity of about 30A, only suitable for low-power logic circuits;

10oz copper thickness (350 μ m) 1mm line width can carry 100A+current, meeting the requirements of the hundred ampere level power path;

In extreme scenarios, the ultra thick copper plate (20oz) can stably carry peak currents of over 500A.

Core principle: As the cross-sectional area of the copper layer increases, the resistance significantly decreases (R=ρ L/S), reducing losses and heat generation in current transmission from the source.

2. The "built-in radiator" effect of heat dissipation efficiency

The thermal conductivity of copper is about 401W/(m · K), which is over a thousand times that of FR-4 substrate. The thick copper layer itself is an efficient heat dissipation channel:

The transverse thermal conductivity of 10oz copper foil is increased by 300% compared to 1oz, which can quickly diffuse the heat of power devices such as IGBT/MOSFET and reduce the hotspot temperature by more than 40 ℃;

The steady-state temperature of a 3-oz copper thick PCB is about 15 ℃ lower than that of a 1oz PCB, and it can meet the thermal management needs of medium to high power equipment without the need for an additional heat sink;

The large-area thick copper grounding layer forms a "heat sharing plate" effect, effectively avoiding device failure caused by local overheating.

3. Mechanical strength and environmental adaptability

The thick copper layer enhances the rigidity of the substrate, and the tensile strength of the hole ring is three times higher than that of ordinary PCBs. It can withstand vibration environments of>5Grms and is suitable for harsh scenarios such as automotive engine compartments and mining equipment;

The copper layer has strong bonding strength and can withstand over 1000 cycles of cold and hot shock at -55 ℃~150 ℃ (IPC-TM-650 standard), maintaining stability even in extreme temperature environments;

The large-area copper layer reduces grounding impedance, has excellent electromagnetic shielding effect, reduces EMI interference, and improves equipment electromagnetic compatibility (EMC) pass rate.

4. High voltage resistance and reliability

High quality thick copper plates can withstand high voltages above 10kV, pass 1000V DC withstand voltage tests (leakage current<10 μ A), and with high Tg substrates (≥ 170 ℃) and optimized creepage distance design (≥ 8mm), can meet the safety requirements of new energy scenarios such as 800V high-voltage platforms.

3、 Core manufacturing process of thick copper plate (difficulties and key controls)

The difficulty of processing thick copper plates far exceeds that of ordinary PCBs, requiring breakthroughs in the three core bottlenecks of lamination, electroplating, and etching. Each step requires precise control of parameters:

1. Compression process: No bubbles, high adhesion is key

Pre treatment: Thick copper foil needs to undergo alkaline cleaning (to remove oil stains) and dilute hydrochloric acid micro etching (to remove the oxide layer). High Tg substrates need to be baked at 120 ℃ for 2-4 hours to remove moisture;

Compression parameters: temperature 170~180 ℃, pressure 30~40kg/cm ² (ordinary PCB only 20~25kg/cm ²), vacuum degree ≤ 10Pa, to avoid bubbles between copper foil and substrate;

Testing standard: The adhesion between copper foil and substrate is ≥ 5N/cm, the diameter of bubbles is ≤ 0.2mm, and there is no more than 1 bubble per square decimeter.

2. Electroplating thickening: Uniformity control is the core

For products that require an extra thick copper layer, further thickening is required through electroplating process:

Electroplating solution formula: copper sulfate (180-220g/L)+sulfuric acid (50-70ml/L)+additives to ensure uniform deposition of copper ions;

Key parameters: current density 1-1.5A/dm ², temperature 20-25 ℃, using air agitation and filter element filtration to avoid pinholes or nodules in the copper layer;

Accuracy requirement: The difference in copper thickness between different areas of the same circuit should be ≤ 10%. For example, the allowable deviation for a 3-oz copper layer (105 μ m) should be ≤ 10.5 μ m.

3. Etching process: Control side etching and residual copper

Thick copper foil has a long etching time and is prone to side corrosion (excessive corrosion on the side of the circuit):

Etching solution selection: Acidic etching solution of ferric chloride or copper chloride (concentration 38-42Be '), temperature 45-50 ℃, spray pressure 2.5-3.0bar;

Side corrosion control: By adding corrosion inhibitors or segmented etching techniques, the side corrosion amount is reduced to ≤ 10% of the line width;

Residual copper control: After etching, the residual copper rate is ≤ 0.1%, and the residual copper powder is removed by washing with a high-pressure water gun (0.8MPa).

4. Post processing: Ensuring long-term reliability

Cleaning and drying: Rinse 3-4 times with deionized water, dry in an oven at 80-100 ℃ for 15-20 minutes, ensuring that the moisture content is ≤ 0.1%;

Surface treatment: Nickel gold plating (nickel layer 5-10 μ m, gold layer 0.1-0.3 μ m) is used in automotive/industrial scenarios to enhance corrosion resistance, while OSP treatment is used in ordinary scenarios to reduce costs;

Full process testing: 100% AOI optical inspection, cross-sectional analysis, electrical performance testing (line resistance, insulation resistance).

4、 Typical application scenarios of thick copper plates (irreplaceable core areas)

Thick copper plates are a "must-have" for high-power and highly reliable electronic devices, with core applications concentrated in four major fields:

1. New energy and energy storage

Charging pile: power module, high-voltage distribution unit, requiring 6-10oz thick copper to carry high current fast charging;

New energy vehicles: OBC (on-board charger), BMS (battery management system), 800V high-voltage platform IGBT module, 12oz thick copper can reduce the temperature rise of the module from 65 ℃ to 42 ℃;

Photovoltaic inverter/energy storage PCS: DC-AC conversion circuit, 10oz thick copper to avoid copper foil melting caused by 200A+current.

2. Industrial electronics

Industrial power supply: Communication base station power supply, server power supply, 3-6oz thick copper ensures continuous and stable power supply;

Variable frequency drive/servo drive: high-power motor control, thick copper reduces power device temperature rise, extends equipment life;

Welding equipment: high current output circuit, thick copper layer to resist high-frequency thermal shock.

3. Special equipment

Aerospace: Electronic systems under extreme temperature changes (-40 ℃~150 ℃) and vibration environments require a copper layer bonding force of 1.8N/mm ²;

Military equipment: High voltage, high current special components, ultra thick copper (15~20oz) to meet strict reliability requirements;

Mining equipment: frequency converter in strong vibration and high dust environment, with thick copper substrate to enhance impact resistance.

4. Other high demand scenarios

Medical equipment: high-power therapy equipment, diagnostic equipment, thick copper ensures stable operation and electromagnetic compatibility of the equipment;

Rail transit: train power module, traction control system, suitable for high voltage and high current working conditions.

5、 Key points for selecting thick copper plates and guidelines for avoiding pitfalls

1. Core principles for selection

Select copper thickness based on current: choose 2oz for 5-15A, 3-6oz for 15-50A, 6-10oz for 50-100A, 10oz+for 100A and above, with a 20% safety margin reserved during design;

Select substrates according to the environment: High Tg FR-4 (Tg ≥ 170 ℃) is used for conventional environments, while polyimide or ceramic substrates are used for extreme environments;

Process selection based on reliability: High pressure scenarios require vacuum pressing+3D groove cutting technology, while vibration scenarios require thick copper filling process to enhance the strength of the hole ring.

2. Common misconceptions and pitfalls to avoid

Misconception 1: Thicker copper is better → Increasing copper thickness can lead to increased costs, limited wiring, and extended lead times (1-3 days more than regular PCBs). It is recommended to adopt a "locally thick copper" solution (only use thick copper for power circuits, maintain regular copper thickness in other areas);

Misconception 2: Neglecting line width matching → The larger the copper thickness, the higher the minimum line width/spacing requirement (such as 13mil/13mil for 6oz copper thickness), and it is necessary to confirm the process capability with the factory in advance;

Misconception 3: Neglecting heat dissipation design → Although thick copper has good heat dissipation, it still needs to optimize the copper layer layout (such as grid design, window opening rate of 30%) to further reduce temperature rise.

6、 Industry Development Trends

With the popularization of new energy and silicon carbide (SiC) devices, thick copper plates are developing in two directions:

Combination of ultra-high copper thickness and ultra-thin substrate: such as 12oz thick copper+0.2mm ultra-thin substrate, suitable for 800V high-voltage platform, power density increased to 50W/cm ³;

Integrated process innovation: The popularization of technologies such as vacuum resin plug holes and dynamic impedance compensation further enhances reliability in extreme environments;

Green manufacturing: The application of halogen-free thick copper and recycled copper foil has increased, complying with environmental standards such as RoHS and REACH.

Do you have such board requirements? Please send your requirements to [email protected]. We will answer you soon.

Hitech is a professional heavy copper pcb, thick copper pcb board manufacturer, supplier and design company from China, we have been associa

#Thick copper PCB #pcb manufacturer

Teflon PCB Professional Supplier in China with High quality by Hitech Circuits Co., Limited in Shenzhen

What is Teflon PCB?

Teflon is a brand name for Polytetrafluoroethylene. PTFE is known for its nonstick and non-reactive surface. Teflon is a well-known material used in the manufacturing of several products. Teflon PCB is an electric circuit that is equipped with better capacities and enhanced connections.

Teflon PCB is a synthetic resin material utilized in non-sticky applications. This material is manufactured by polymerizing tetrafluoroethylene. Teflon PCB material can resist high temperatures. Due to this, it is commonly used for high-frequency PCB.

It features properties like low dissipation factor, cold resistance, low coefficient of thermal expansion, chemical resistance, and high heat. Teflon PCB manufacturers design this PCB to offer outstanding advantages to users.

Polytetrafluoroethylene is a material known for its resistance to moisture, grease, chemicals, and oil. PTFE PCB features high lubrication, no adhesion, weather resistance, and high insulation. This material is used in the production of PCB ideal for electronic appliances.

Teflon PCB in high-end electronic products uses Teflon laminate material. The scientific name of Teflon is polytetrafluoroethylene(PTFE).This material is resistant to acids, alkalis, and various organic solvents, and is almost

insoluble in all solvents. At the same time, Teflon material has the characteristics of high-temperature resistance, and its dielectric coefficient is very low, so it is an ideal high-frequency PCB material for high-frequency Teflon PCB

Teflon PCB has a series of excellent performances:

High-temperature resistance: long-term use temperature 200~260 degrees;

Low-temperature resistance: still soft at-100 degrees;

Corrosion resistance: can withstand aqua Regina and all organic solvents:

Weather resistance: the best aging life among plastics,

High lubrication: has the smallest coefficient of friction in plastics (0.04):

Non-sticky: It has the smallest surface tension among solid materials without adhering to any substance?

It is physiologically inert it has excellent electrical properties and is an ideal C-level insulating material. A thick layer of newspaper can block the high voltage of 1500V: it is smoother than ice

Teflon has outstanding excellent comprehensive properties, high-temperature resistance, corrosion resistance, non-stick, self-lubricating, excellent dielectric properties, and a very low coefficient of friction. Among Teflon PCB Teflon is a high-frequency PCB material with very excellent performance. This is very suitable for applications in radar, high-freouency communication equipment, radio equipment and other fields.

Usually in Teflon PCB general manufacturers seldom use this kind of Teflon sheet, we can provide Tefon PCB to meet customers various PCB needs. At present in the manufacture of Teflon PCB for us. Teflon PCB material can achieve 4-6 layers of pure compression: 4~8 lavers of mixed compression.

Teflon PCB circuit board - advantages:

High temperature resistance: Teflon PCB has a wide operating temperature range, up to 260℃, which enables it to maintain good performance even in high temperature environments.

Low temperature resistance: Even at extremely low temperatures, Teflon PCBs can maintain a certain degree of flexibility and mechanical toughness, making them less prone to embrittlement.

Corrosion resistance: It exhibits inertness towards most chemicals and solvents, and can withstand strong acids, strong alkalis, and various organic solvents, making it capable of stable operation in various harsh environments.

High insulation: Teflon PCB has excellent electrical insulation properties, which can effectively resist high voltage and ensure the stable operation of the circuit board.

Non-adhesive: Its surface tension is extremely low, making it difficult for any substances to adhere to it, which makes cleaning and maintenance relatively easy.

High lubricity: Among solid materials, Teflon has a relatively low friction coefficient, which helps reduce friction and wear between various components on the circuit board.

Teflon PCB circuit board - disadvantages:

Cold flow property: Teflon material possesses a certain cold flow property, which may lead to minor changes in the shape and size of the material in certain applications.

Processing difficulty: Due to the special properties of Teflon PCBs, such as high lubricity and non-stickiness, their processing difficulty is relatively high. During PCB wiring and drilling, issues such as gouging or tearing are prone to occur.

Higher cost: Compared to traditional FR-4 materials, the cost of Teflon PCB is significantly higher. This is mainly due to its special production process and material cost.

In summary, Teflon PCBs exhibit significant advantages in terms of high and low temperature resistance, corrosion resistance, insulation, and lubricity. However, they also face challenges such as cold flow, processing difficulties, and higher costs.

Teflon PCB Manufacturing

For the production of Teflon circuit boards, extreme attention and carefulness are required. Teflon PCB manufacturers understand that this material is different from FR4 PCB material. For the production of Teflon boards, the following should be considered;

Surface preparation: A substrate’s surface is always prepared for layer formation, marking, and metallization. The manufacturer needs to pay attention to the type of equipment utilized for the preparation of the surface.

For example, things like bristles, scrubbers, and composite brushes should be avoided during the preparation of the surface. These things can disturb the soft laminate. Sodium etchants or plasma gas recycling is used for the preparation of the PTFE surface.

Copper plating: Special care is needed when copper plating ceramic with high dielectric materials. Pure PTFE materials have a high Z-axis coefficient of thermal expansion. Therefore, it is important to utilize plated copper on through-hole walls.

This plated copper must feature high tensile strength. This helps to minimize the chances of pad lifts and barrel cracks.

Solder mask: You must apply the solder mask within 12 hours of etching the material. A Teflon PCB manufacturer must ensure it processes the etched surface via a standard PTFE cycle. You can also clean residual moisture by baking the PTFE laminates before applying a solder mask.

Drilling: This is a new procedure ideal for drilling PTFE substrates covered with copper. Drilling must be utilized with a high chip load. This removes fibers and PTFE tailing. In most cases, PCB fabricators prefer ceramic-filled laminates since they can drill them easily.

Handling and storage: PTFE laminates need extra care since they are soft. This makes them vulnerable to tearing or gouging. It is advisable they are stored at room temperature. They shouldn’t be exposed to sunlight to avoid surface oxidation and contamination.

Lamination: Teflon substrates don’t require oxide pretreatment. PCB fabricators laminate PTFE and copper films at high pressures without bonding films or pre-pegs. Sometimes, PTFE PCB manufacturers use bonding films or prepreg of a very low melting point to minimize the processing temperatures. PTFE-FR4 laminates are ideal in some applications, but they need oxide pretreatment.

For more, you can click at https://www.hitechpcba.com/teflon-pcb.

Advantages of Teflon PCB

PTFE is a useful material for the fabrication of PCB. Teflon PCBs have their unique advantages.

Temperature resistance: Teflon printed circuit board can survive extreme cold and heat. This is a major reason it is used in military and aerospace applications. This board can work from -454 to 600°F and -270 to 315°F. Its ability to withstand any temperature prevents it from cracking.

Great dielectric strength: Due to the high dielectric strength of this board, it is non-conductive. It works perfectly as an insulator. The insulating capability of this material protects equipment from electrical breakdowns.

Durability: PTFE PCB is an ideal option to consider since it is very durable. It can withstand oxidation, ultraviolet rays, embrittlement, or discoloration. It is a cost-effective option because of its long-lasting nature.

Mechanically rigid: Teflon PCB is mechanically stable. This makes it ideal for use in applications that are exposed to high levels of mechanical stability. The thermal conductivity of Teflon PCB is great.

PTFE Teflon PCB to meet the demand for faster communications. Please refer Teflon PCB Applications. Teflon materials are valued for their suitability in high-frequency electronic applications. At Microwave RF PCB, FR-4 Material (approx. 4.5) dielectric constant o is often too high, its significant signal loss during transmission across the printed circuit board. Luckly, Teflon materials boast dielectric constant values as low as 3.5 or less, it is ideal material for overcoming the high-speed limitations of FR-4. The most common of these Teflon PCB materials were developed by Rogers. In addition to a reduction in dielectric constant, these materials also offer very impressive thermal characteristics for High Temperature PCB applications, reaching Tg values as high as 280°C.

Teflon circuit board (Teflon PCB) is a synthetic resin material utilized in non-sticky applications. This material is manufactured by polyme

WhatsApp:+8618118703950

For more, please contact [email protected]

#pcb manufacturer #PTFE Teflon PCB

Cable & Harness Assembly by Hitech Circuits Co., Limited in Shenzhen China

What is Wire Harness and Cable Assembly?

Ｗire Harness is also known as cable and harness assembly, wire assembly or wiring loom applicable to the interior of electronic, computer, automotive, industrial and consumer products. The wire harness simplifies the connection to larger components by integrating the wiring into a single unit for “drop-in” installation. As one of the leading wire harness and cable assembly manufacturers in China, Hitechpcba provides quality wire harness & cable assembly manufacturing services for you.

Cable Assembly, also known as a wire harness, wiring harness, a cable and harness electronics, wiring assembly or wiring loom, is an assembly of electrical cables or wires which transmit signals or electrical power. Cable Assemblies are often confused with Wire Harnesses, however, the two are quite different. The main difference is that cable assemblies and harnesses normally have only two ends, whereas a wire harness contains multiple breakouts (ends) that run in many different directions with multiple terminations on each breakout.

Cable assemblies and wiring harnesses are often mistaken for the same thing.

This confusion is understandable, as many professionals interchangeably use these two terms, and the basic functions of these products are quite similar. However, there are significant differences between these products, as well as their intended uses, which means clear definitions are needed to help people obtain the products they need. This article will briefly explain the difference between cable assemblies and wire harnesses, as well as the practical applications of these two products.

Cable Assemblies and Harnesses Before exploring the significant differences between cable assemblies and harnesses, it is necessary to first clarify the distinction between wires and cables, as although these two terms can be used interchangeably, they refer to distinctly different products. Essentially, a wire is a bundle of conductive material, such as aluminum or copper. In contrast, a cable is a combination of two or more wires. They are typically bonded or braided together, which is why you may see cables appearing as a tangled mass of intertwined wires.

Quick-Turn Cable Assemblies & Wire Harness Assemblies

In a hurry? We can provide quick-turn cable assemblies and wire harness Assemblies for your projects.

Hitechpcba has multiple cable assembly houses worldwide to meet your local needs. For low-volume cable assemblies, wire harnesses, quick-turnaround cable assemblies & wire harnesses, our cable assembly houses in Shenzhen, we can provide fast and efficient cable and wire harness assembly manufacturing services. For high-volume cables & wire harness assemblies, OEM cables, and industrial cables, our owned cable assembly house in China can provide mass production manufacturing.

Contact any of our local support operations for immediate assistance. We have dedicated quick-turn manufacturing procedures specifically for rush orders in addition to prototypes and volume manufacturing requirements. We are members of the Wiring Harness Manufacturer's Association and BICSI. We can meet the industrial standard and your requirements.

For OEMs requiring simple cable assemblies through to complex wiring harnesses, you can be confident at Hitechpcba will provide a high-quality service.

We can manufacture a broad range of cable assemblies, from prototype to volume production. We also co-ordinate the entire supply chain and provide certifiable traceability.

Hitech Circuits has a breadth of experience gained producing simple point-to-point cables and straightforward looms, to multi-component assemblies and complex looms. We can process cable from 36AWG to 6AWG for use in demanding environments, including medical, surgical or high-end audio.

We have highly trained engineering and assembly teams to assist with design and carry out the assembly and support for all your cable and loom requirements.

Our dedicated build cells feature Schleuniger and Seno automatic cable cut and strip machines and are designed for low volume complex harnesses through to medium volume cable assemblies. We can accommodate various cable types, including coaxial - and have several automatic crimp machines for a host of manufacturers, such as JST, Harting and Amp. Cable assemblies are continuity tested, usually with Banair or Cirris automated equipment, before shipment or use in higher level assemblies.

Whether your requirement is for a single single-ended wire or a full harness complete with connectors, switches and fuses, you can be confident that we will provide a high-quality service, right first time.

Contact Hitechpcb for Turnkey Custom Cable Assembly and Wire Harness Solutions

If you have any questions, please contact us, we look forward to hearing from you.

From the simple to the complex, we can manufacture your custom wire harness and Cable Assembly for any application. To learn more about the custom solutions,please visit use at https://www.hitechpcba.com/cable-harness-assembly.

#CableAssembly

#custom wire harnes

What’s meaning for Through Hole (THT) PCB Assembly and Surface Mount Technology（SMT）PCB Assembly ?

Surface Mount Technology (SMT) is necessary for PCB assembly. If the PCB has no through-hole components, Through Hole (THT) PCB Assembly is not needed.

SMT assembly: SMT stands for surface mount technology, which is a versatile PCB assembly technology. Currently, all electronic components can be made into surface-mounted devices (SMD). SMDs are interconnected to the PCB pads with solder paste. SMT assembly is automatic.

THT assembly: THT, or PTH or DIP, means through-hole technology. The electronic components that require THT assembly have long pins. Usually, they are capacitors, fuses, and connectors. The PCB is pre-drilled, and these components' pins plug in the holes and wave reflowed. THT assembly is manual.

In the PCB assembly process, SMT assembly happens before the THT assembly.

What are the benefits of Through Hole PCB assembly?

Through-Hole PCB Assembly comes with a range of benefits including:

Withstanding stress-As opposed to SMT components, through-hole components are known for their ability to withstand mechanical and environmental stress.

Perfect for large components-Through-hole works well for large components that have to undergo high power and high voltage

High heat tolerance-Known for their high heat tolerance, they find application in a number of industries, particularly military and aerospace.

Ease of Prototyping- Through-hole PCBs also lend themselves to ease of prototyping and improved reliability

High Reliability-Through-hole PCBs are best used for high-reliability products that require stronger connections between layers.

Little surprise then, that even though surface mount components allow for denser configurations, for larger and heavier components that require strong bonds, through-hole technology has remained resilient and relevant.

What are the capabilities you offer for Through Hole PCB assembly?

We provide through-hole PCB services to a variety of industries including medical, electronics, instrumentation, and military, all thanks to our complete assembly capabilities:

• Hand soldering

• Dual wave flow solder

• Hand Insertion of components

• Automate axial or radial insertion

• RoHS soldering using tin-lead solder

• Use of high and low melting point solder

• Prototype build to high-volume assembly

• Functional test and automated inspection

• Support various types of PCBs including metal core PCBs, Rigid PCBs, Flex-rigid PCBs, FR4 PCBs, etc.

Disadvantages of Through Hole Assembly

Like any other manufacturing or assembling techniques, Through Hole PCB Assembly has its disadvantages too.

These include:

Longer production time-It takes a lot of time to drill the multiple holes through which the leads are expected to run.

Expensive-because the drilling process is difficult and time-consuming, it increases the cost of production

Minimizes space on the boards-drilling the holes on the surface of the board limits the routing area for tracing signals.

Also, by feeding the leads through the board, only one of its sides is usable, thus making the THT PCB a bit slower in operation speeds.

Through Hole Assembly Components – What are the Best Components for Through Hole Assembly?

Radial lead components

Axial lead components.

Types of Through Hole PCB Assembly

There are two (2) main types of the Through Hole PCB Assembly. The first is the Automated Through Hole PCB Assembly. The second is the Manual Through Hole PCB Assembly.

On the one hand, the automated variant is roundly touted to be faster and cost-effective because it takes little time to be completed. It also demands little human inputs, which makes it cost-effective.

On the other hand, the manual Through Hole PCB Assembly involves the traditional or manually-operational model of drilling the holes into the Printed Circuit Boards (PCBs). This model tends to take time and attracts more costs.

Functional tests and automated inspection for Through Hole PCB Assembly

Using automated inspection is very critical in minimizing turnaround time to ensure timely delivery of the boards.

Conclusion

As you can see, Through Hole Assembly of PCB can be time consuming.

However, in some applications, it is worth it more so when mounting heavier and bulkier components.

You can easily achieve the strength by soldering the components on the reverse side as you have seen.

In fact, it is virtually impossible to pull components assembled using Through Hole Assembly.

The good news, today’s guide has simplified the Through Hole PCB Assembly technique.

Do you have questions or inquiries on Through Hole Assembly process?

For more please visit at https://www.hitechpcba.com/through-hole-tht-pcb-assembly

In addition to through hole PCB assembly, we also provide value-added services, such as conformal coating, labeling, and complete PCB encapsulation.

Through-hole PCB Assembly Testing and Inspection at Hitechpcba

In-Circuit Testing:

This type of testing is conducted for high volume production lines, and helps us check every minute soldering and other components in detail.

Automated Optical Inspection: Abbreviated as AOI, these tests are performed to ensure that product is free from soldering, component, and BGA defects.

Automated X-Ray Inspection(AXI):

This testing is performed to inspect insufficient fills, short circuits, fills, etc. The automated X-ray inspection helps reduce the number of defects and improve the quality of the Through-Hole circuit.

Burn-in Tests:

These tests detect components’ failure or reliability in real environments.

Assisted Visual Inspection:

Our experts use a wide range of advanced visual inspection equipment to perform a detailed inspection of soldering and component placement accuracy.

What’s difference between SMT assembly and THT assembly?

Most contract PCB Assembly manufacturers concentrate on their surface mount technology capabilities for PCB assembly. The SMT lines can be almost completely automated making it possible to run a high volume of boards with little human intervention and a low cost per board. Through whole assembly whether automated or manual is a slower process, it takes resources away from the high-volume business that many manufacturers prefer.

Only about 10 percent of the parts we buy are through-hole. Nearly 75 percent of the boards we run are mixed technology, which is a combination of through-hole and SMT parts one reason for this is that nearly half of our board assemblies are for high powered boards which use capacitors inductors and transformers to transfer energy. The size of these components is proportional to the energy they can store so for a high-power board we need to use some fairly large and heavy components and that means through-hole technology, in addition things like customer accessible connectors, that have to withstand stress as cables are connected and removed are likely to be through-hole components. Through-hole components are held in place by the pins as well as the solder so you can get a much stronger and more reliable mechanical bond than with surface mount components that have only solder to hold them in place. If a contract manufacturer is focused on higher volume SMT business, it's important to understand how they will handle through-hole components when you need them at z-axis. We run mixed technology boards every day we have a modern stuff line with a paperless process for assembly instructions and assemble in a single piece flow from the stuff line to a wave solder to inline inspection, d-paneling, qc testing.

In addition to PCB Assembly, be it through hole or surface mount, at Hitech Circuits Co., Limited we also undertake PCB assembly rework offering complete reliability, high quality and optimal costs. Not only are we well-versed in inventory management, fabrication and process control, we also have a stringent control on vendor component management.

#pcbassembly #dip

Heavy Copper PCB Manufacturing up to 18 Oz Hitech Circuits Co., Limited in Shenzhen China

What is Heavy Copper PCB?

Heavy copper PCB is a circuit board with a copper thickness that is ≥ 3oz per sq. ft in its outer and inner layers. What makes a circuit board classified as a heavy copper PCB is its thicker plating. During the production of heavy copper PCB, copper thickness is enhanced through plated holes and sidewalls. For instance, when a PCB has 2 ounces of copper per sq. ft thickness, it is a standard PCB. However, if it has more than 3oz of copper, it is a heavy copper PCB. Heavy copper PCB is considered a reliable wiring option. Heavy copper PCB is different from extreme copper PCB which features within 20 oz to 200 oz per sq. ft.

Thick copper plates are primarily utilized in domains demanding high current carrying capacity, efficient heat dissipation, and high reliability, encompassing automotive electronics, industrial control, communication equipment, renewable energy systems, aerospace, and more.

In the automotive electronics sector, new energy vehicles utilize copper-rich technologies in battery management systems (BMS), motor controllers, and fast-charging modules. For instance, the IGBT module for the 800V high-voltage platform employs a 12-ounce thick copper process, which reduces the temperature rise from 65°C to 42°C, thereby extending the module's lifespan to 150,000 kilometers. In the field of on-board power supplies, they must meet high voltage tolerance (≥1000V), temperature variation tolerance (-40°C to 125°C), and vibration resistance requirements. For instance, motor controllers enhance heat dissipation efficiency by 50% by embedding a 3mm thick copper block.

In the industrial control sector, high-power equipment is applied in frequency converters, servo drivers, and industrial power supplies (such as 300W switching power supplies). Copper thicknesses ranging from 2oz to 3oz can support currents of 10-30A, reducing the failure rate by 40%. In automation systems, they ensure stability in dusty and vibrating environments, such as by increasing the lamination pressure to 35kg/cm² to solve the issue of wire detachment.

In the communication equipment sector, 5G base stations utilize thick copper and high-frequency material hybrid pressing technology to reduce signal loss by 15% and support 28GHz millimeter-wave transmission. Network infrastructure, such as satellite communications and network base stations, meets high-density wiring requirements (with a line width accuracy of 0.05mm)

What does Heavy Copper PCB offer?

Heavy copper PCB has a lot to offer. It has got some unique features that make it an ideal option for high-end applications. Let’s discuss some of the benefits of this PCB; Great thermal distribution: Due to its copper-plated vias, this PCB offers high thermal resistance. Heavy copper PCB are used in applications that demand high speed and high frequency. You can also use this PCB at harsh temperatures. Mechanical strength: Heavy copper PCB feature great mechanical strength. When this PCB is used, it makes the electrical system durable and robust. Good conductor: Heavy copper circuit boards are a good conductor. They are utilized in the production of electronics due to this feature. They help to link various boards together. These boards can transfer current.

How is Heavy Copper PCB Fabricated?

For the fabrication of heavy copper PCB, plating or etching is often used. The main aim is to add copper thickness to sidewalls and plated holes. The methods used in fabricating heavy copper PCB aren’t far-fetched. Heavy copper PCBs need special etching and plating methods to ensure the extra thickness of copper. Using the normal etching techniques for the fabrication of heavy copper PCBs isn’t ideal. Normal etching methods produce over-etched margins and edge lines that are uneven. PCB producers now use advanced etching and plating methods to achieve straight edges.

Heavy copper PCBs are produced via etching and plating methods. The major aim in the production of this PCB is to add copper thickness through sidewalls and plated-through holes. Heavy copper PCBs have several benefits which make them in high demand. Due to their outstanding features and benefits, they can meet your electrical requirements. These circuit boards will always dissipate heat generated due to heavy currents conduction. Electronics using heavy copper boards have been in use for a long time. Heavy copper can carry high currents. These boards will continue to meet the needs of various applications. High power circuit wirings can be developed using Heavy Copper PCBs. Such a wiring mechanism offers more reliable thermal stress handling and offers fine finishing while incorporating multiple channels on a single layer of a compact board.

Printed circuit boards (PCBs) are usually bonded with a layer of copper foil on a glass epoxy substrate. The thickness of the copper foil is usually 18μm, 35μm, 55μm, and 70μm. The most commonly used copper foil thickness is 35μm. Domestic copper foil thickness is generally 35 ~ 50μm, there are thinner than this such as 10μm, 18μm; And thicker than that like 70μm. The thickness of composite copper foil on 1~ 3mm thick substrate is about 35μm. The thickness of the composite copper foil on the substrate less than 1 mm thick is about 18μm, and the thickness of the cladding copper foil on the substrate thicker than 5mm is about 55μm. If the PCB copper foil thickness is 35μm, printed line width is 1mm, then every 10mm long, its resistance value is about 5mΩ, its inductance is about 4nH. When the di/dt of the digital integrated circuit chip on the PCB is 6mA/ns and the working current is 30mA, the noise voltage generated by each part of the circuit is estimated to be 0.15mV and 24mV according to the resistance value and inductance value of each 10mm printed line. Heavy Copper PCB boards can be made simply by combining two main processes: electroplating and etching. Compared to other PCBs, the circuit is made of a thin layer of copper foil. The copper plates are uniformly laminated with FR4 or other epoxy-based substances. The average weight of a Heavy Copper PCB can be 4 oz. (140μm), which is a better ratio than a copper-shared PCB. Let's look at the benefits.

Heavy Copper PCB Manufacturer & Circuit board Assembly – One-stop service Printed Circuit Boards (PCB) are usually coated with thick copper foil on a glass epoxy substrates commonly thickness of copper foil are 18μm, 35μm, 55μm, and 70μm. The most common copper foil is 35μm. The heavy copper PCB boards can simply be manufactured by two main processes plating and etching in the combine. As compared to other PCBs, the circuit is made of a thin layer of the Copper foil sheet. The plates of copper are laminated uniformly with FR4 or other epoxy-based substance. The average weight of the thick copper PCB weight could be 4oz (140μm), and this ratio is better as compared to another type of PCBs who have copper in common. Let’s check out the benefits of it.

For more, please visit us at https://www.hitechpcba.com/heavy-copper-pcb-manufacturing.

#pcb manufacturer #Heavy Copper PCB

HDI PCB Supplier with Good Quality Made in China Hitech Circuits Co., Limited

HDI pcb is the abbreviation for High Density Interconnect pcb or High Density pcb. An HDI PCB is defined as a printed circuit board with a higher wiring density per unit area than a conventional PCB. Hitech Circuits Co., Limited is a professional high density interconnect pcbs, hdi pcb board manufacturer, supplier and design company from China. Pls send PCB files to [email protected] to get a quote now!

HDI board (High Density Interconnector), also known as high-density interconnect board, is a type of circuit board with relatively high circuit distribution density that uses micro blind buried hole technology. HDI boards have inner and outer layers of circuits, which are connected internally through processes such as drilling and metalization inside the holes.

HDI boards are generally manufactured using the layering method, and the more layers are applied, the higher the technical level of the board. Ordinary HDI boards are basically single layer stacked, while high-order HDI uses two or more layer stacking techniques, as well as advanced PCB technologies such as stacking holes, electroplating filling holes, and laser direct drilling.

When the density of PCB increases beyond eight layers, using HDI for manufacturing will result in lower costs compared to traditional complex lamination processes. HDI board is beneficial for the use of advanced assembly technology, and its electrical performance and signal accuracy are higher than traditional PCB. In addition, HDI boards have better improvements against radio frequency interference, electromagnetic wave interference, electrostatic discharge, thermal conduction, and other factors.

Electronic products are constantly developing towards high density and precision. The so-called "high" not only improves machine performance, but also reduces the size of machines. High density integration (HDI) technology can make terminal product design more compact while meeting higher standards for electronic performance and efficiency. Currently popular electronic products, such as mobile phones, digital cameras, laptops, automotive electronics, etc., many of which use HDI boards. With the upgrading of electronic products and market demand, the development of HDI boards will be very rapid.

What is a high-density interconnection PCB board

HDI is the abbreviation of High Density Interconnection, which is a kind of technology for the production of printed circuit boards. High density interconnection PCB board is a circuit board with a relatively high line distribution density using micro-blind and buried via technology.

HDI includes the use of fine features or signal traces and spaces of 0.003” (75 µm) or less and laser-drilled blind or buried microvia technology. Microvias allow the use of micro-interconnects from one layer to another within a PCB utilizing a smaller pad diameter creating additional routing density or reducing form factor.

HDI pcb board is a compact product designed for small-capacity users.

Advantages of high-density interconnected PCB boards

It can reduce the cost of PCB: When the density of PCB increases to more than eight-layer board, it is manufactured by HDI, and its cost will be lower than that of the traditional complex pressing process.

Increase circuit density: has better interconnection than that of traditional circuit boards and parts

Conducive to the use of advanced construction technology

Have better electrical performance and signal accuracy

Better reliability

Can improve thermal properties

It can improve radio frequency interference ( RFI ), electromagnetic wave interference ( EMI ), electrostatic discharge ( ESD )

Increase design efficiency

Disadvantages of high-density interconnected PCB boards

The value of NDI impedance focuses on pattern transfer (complexity of patterns) and pattern electroplating process.

The quantity and quality are abnormal, especially the high-density circuit part of the HDI PCB board has a slower etch rate than the isolation line, which causes the isolation line to be over-etched.

When the entire HDI board is etched after electroplating, a large area of copper on the PCB circuit board will be etched away, which increases the production cost. At the same time, a large amount of copper ions enter the waste liquid after etching, causing environmental pollution and difficulty in recycling.

High-density interconnection PCB board Vs ordinary PCB board

Ordinary PCB board is mainly FR-4, which is laminated with epoxy resin and electronic grade glass cloth. Generally, traditional HDI PCB board uses backed copper foil on the outer surface, because laser drilling cannot penetrate the glass cloth, glass fiber-free backed copper foil is generally used. However, the current high-energy laser drilling machine can penetrate 1180 glass cloth. This is no difference from ordinary PCB board materials.

For more details, please visit https://www.hitechpcba.com/hdi-pcb-manufacturer-high-interconnect-pcb-manufacturing.

#HDI PCB

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