May 9, 2021
@eleni-christodoulou 2021
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@eleni-christodoulou 2021
STMicroelectronics expands Metalenz licensing to scale metasurface optics production
July 16, 2025 /SemiMedia/ — STMicroelectronics has expanded its partnership with Metalenz through a new licensing agreement, aiming to accelerate production of metasurface optics by leveraging its 300mm semiconductor manufacturing platform. The agreement enhances ST’s ability to integrate advanced optics and semiconductor processes for large-scale, high-precision, and cost-effective applications…
STMicroelectronics a global semiconductor leader serving customers across the spectrum of electronics applications, and OQmented, a deep-tech startup focused on MEMS-mirror technology, have agreed to collaborate on the advancement of the technology for Augmented Reality and 3D-sensing markets. The joint effort aims to build on the expertise of both companies to advance the technology and products […]
TriLumina releases world's first 'LED Killer' device for mobile 3D sensing
TriLumina releases world’s first ‘LED Killer’ device for mobile 3D sensing
TriLumina (www.trilumina.com), a specialist developer of flip-chip VCSEL(vertical-cavity surface-emitting laser) technology for 3D sensing, launched the world’s first surface-mount flip-chip back-emitting VCSEL array without the need for a submount or bond wires, which allows for lower costs and higher performance than existing designs using near-infrared light-emitting laser diodes or LEDs for…
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CyberOptics stock drops to 2-year low
CyberOptics stock drops to 2-year low
CyberOptics Corporation (NASDAQ: CYBE) stock fell to a nearly 2-year low of $12.75 on Wednesday. This follows the 3D sensing technology company’s sales warnings due to a slowdown in the chip demand and trade uncertainty.
The company said it will experience a cyclical, industry-wide slowdown in demand for surface mount technology (SMT) and semiconductor capital equipment and continued uncertainty…
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Apple interested in Sony's next-gen 3D camera sensors
Apple interested in Sony’s next-gen 3D camera sensors
”Sony Corp., the biggest maker of camera chips used in smartphones, is boosting production of next-generation 3D sensors after getting interest from customers including Apple Inc.,” Yuji Nakamura and Yuki Furukawa report for Bloomberg. “The chips will power front- and rear-facing 3D cameras of models from several smartphone makers in 2019, with Sony kicking off mass production in late summer to…
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New Apple patents reveal work on next-gen LiDAR using VCSELs for 3D sensing systems
New Apple patents reveal work on next-gen LiDAR using VCSELs for 3D sensing systems
[cfsp key=”getamac.jpg”]”Today the US Patent & Trademark Office published a patent application from Apple that relates to improving depth cameras and more specifically to opto-electronic devices, and particularly to light detection and ranging (LiDAR) sensors,” Jack Purcher reports for Patently Apple.
“Earlier this year a company by the name of TriLumina developed lower costs for reliable LiDAR…
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Apple gave away fingerprint sensor and came with a whole new technology called Face ID that used the front camera to unlock a smartphone. Apple is not done with 3D sensing and it has future plans for the next two years with this technology in upcoming iPhones.