Having high quality and high reliability for PCB board that guarantees to design, artificers should usually carry on warm analysis of heat to PCB board, mechanical reliability analysis. Because the electronic device on PCB board is larger and larger in density, route narrower and narrower, the frequency of the signal is higher and higher, will introduce EMC (electromagnetic compatibility) inevitably And EMI (electromagnetic disturbance) Question,there are important without being seemed very on so electromagnetic compatibility for electronic product analysis. Compared with the situation that IC designs, EMC analysis and analog simulation in PCB design process are a weak link.
EMC/EMI analytic target in PCB design
In PCB design, signal completeness of routing network of EMC/EMI main analysis, ability that electromagnetic radiation, electromagnetic disturbance and circuit board that the actual routing network may produce resist electromagnetic disturbance of outside, and inhibit electromagnetic radiation and rule to interfere with while putting forward overall arrangement and routing according to the artificer's requirement, as the guiding principle of the whole PCB design process. Particularly, analyze the reflection analysis including the same signal on the same routing network in signal completeness, impedance matching analyze signal overshoot analyzes, the time series analysis of the signal, the signal puts emphasis on that analyzes etc.; As to the cross talk analysis between different signals on the neighbouring routing network. Must also consider the geometirc topological structure of the routing network during completeness analysis of the signal, the electric properties of dielectric characteristic and every routing layer on PCB insulating layer. Electromagnetic radiation analyze consider the intersection of PCB and board and external the intersection of interface and electromagnetic radiation of mainly, radiating the question externally at the time of the electromagnetic radiation of the floor of the power and routing network dynamic duty of the high-power in PCB board. Adopt heat sink that truss up at high-power IC in the circuit design ' For example metal heat sink sticking to the Pentium processor) ,Then such a heat sink radiates the electromagnetic wave outwards in the dynamic duty of the circuit ceaselessly the aerial, so must classify as EMC analytic focal point. Have a international standard of EMI which inhibits electronic device and instrument now, referred to as the electromagnetic compatibility (EMC) The standard, they may be as inhibiting electromagnetic radiation and criterion interfered with at the time of ordinary artificer's routing and overall arrangement, to military electronic product artificer, the standard will be rigorously enforced even more, the requirement is more harsh. As to the digital circuit design of the high speed, especially on the bus line when the digital signal rate is higher than 50MHz, analyzed by mathematical model of the lumped parameter EMC/EMI characteristic seemed powerless in the past, artificer tend, adopt mathematical model of distribution parameter make the intersection of routing and transmission line of network analyze (TALC) even more . Electronic system configured by means of bus connection as to many PCB boards. Must also analyze the electromagnetic compatibility characteristic between different PCB boards.
Support of EMC/EMI component storehouse
Nowadays a circuit board may include more than one hundred kinds come from electronic devices and components that different producers, function are different, the artificer needs to carry on EMC/EMI and analyze the electric property of understanding these components and parts, later concrete analog simulation of ability. This seemed it was an arduous job in the past, because there is support of databases such as IBIS and SPICE,etc. now, make EMC analytic question easily solved. In view of SPICE3, HSPICE, PSPICE, these data models, has already been known very well by vast circuit artificer, introduce IBIS here emphatically.
IBIS( I/O Buffer Interface Specification) ,Namely ANSI/EIA-656, it is one kind through measuring or circuit simulation is got, describing the model of the electrical performance fast and accurately of I/O dashpot based on V/I curve. Led by INTEL 1990, uniting the sector standard that several famous semi-conductive manufacturers made IBIS V1.0 together, through constant completion and development, it is IBIS V3.0 to upgrade in 1997. This standard has already been supported by several hundred semi-conductive manufacturers such as NS, Motorola, TI, IDT, Xilinx, Siemens, Cypress, VLSI now, RDA Companies such as Cadence, Mentor, Incases, Zuken-Redac,etc. added the function module about IBIS in their own software too at the same time. IBIS file is a kind of text file, it is the description of the behavioral information turned into through the standard software form, in order to explain the simulation electric property of IC. Most IBIS module comes from SPICF model, can also be by measuring V/I curve descriptive model got actually. The business secret that the people's body manufacturer is based on that SPICE model of IC is half and half, are protected by the intellectual property right, and IBIS model is the data totally opening users, so artificers can get these data free. Most semi-conductive manufacturers release IBIS data of relevant IC on one's own websites or in the products CD-ROM. Because EDA producer and electronic devices and components manufacturer jointly support data models such as IBIS and SPIICE,etc., the artificer can use they for analog simulation or using for EDA tool of the circuit comfortably, carry on EMC/EMI analysis easily.
Design combining together in EMC/EMI analog simulation and PCB
Past electronic circuit design, the engineers are mostly development experiences relied on for many years after PCB make, problem debugged in the hardware or solved EMC in the complete machine debugging process of the electronic device, method that this can not obviously a determine the nature quantitative, unreliable, not rigorously. Entered the 1990s, the electronic product was towards low power consumption, low electromagnetic radiation, the miniaturized and light direction that melts is developed, and require that can work in the complicated rugged environment, in order to try hard to shorten the development cycle of the products, the engineers have to open up the new foot-path separately. More ideal PCB designs the procedure, the overall arrangement designed in PCB and stage of routing join the criterion of EMC/EMI. For example for reduce parallel signal, walk mutual cross talk of space, can for distance between the fixed the intersection of line and line unable to smaller than certain value. In order to reduce the reflection of the signal, enable the impedance matching of Input/Output, avoid the ringing phenomenon, can stipulate the geometirc topological structure of the routing network, the collinear length leaves, the driving end thing even in the signal has a bunch of connecting resistance to output resistance-capacitance device one of head joint (commonly used method, the joining-up in parallel is pulled upward, downstream pull or upper and lower connecting resistance, can also adopt methods such as the catching diode,etc.) . After PCB overall arrangement routing finishes, carry on analysis and analog simulation of EMC/EMI to circuit design before making the real circuit board. According to characteristics such as intensity of the dynamic operating frequency analysis signal of the real circuit, time delay,etc. at the same time. If contain in PCB designed with the external interface, on IC when own power consumption of or circuit of the extra heat sink is great, must further carry on the simulation analysis of electromagnetic radiative simulation. TALC transmission line that it is necessary to carry on the routing network as to the high speed circuit is distributed parametric analysis. Step of design phase these that join newly, some work that the hardware was debugged was advanced to the design platform of the computer to finish before actually, its superiority is obvious. Because there is support of databases such as IBIS and SPICE,etc., EMC/EMI analysis not quantitative and intangible turned into rigorous and surveying the result of calculation with slight differencely in the past, the artificer can avoid the disadvantage of the products with bad electromagnetic compatibility according to imitating the artificial result.
EDA develops the manufacturer and notices user's demand in the field of EMC/EMI analog simulation gradually too, INCASES Company of Germany has offered the analytic package of software EMC-WORKBENCH of EMC/EMI analog simulation to artificer, become the leader of this trade and preside over the seminar of IEEE in EMC/EMI many times. EMC-WORKBENCH can meet artificer's active demand in electromagnetic compatibility of circuit, have improved the procedure that PCB designs, a lot of miscellaneous work while debugging that simplify the anaphase hardware.
Must fully consider the question of EMC within IC at the time of overall arrangement and routing; The numerous EPLD and FPGA software should analyze the question of EMC before producing the final thermal link picture; Must analyze electromagnetic compatibility and electromagnetic interference characteristic to PCB which forms the electronic system, reaching common understanding in the increasingly many circuit artificer in such a design philosophy. Because there is analog simulation of EMC/EMI that makes the design of PCB enter new era, electronics engineers utilize it to design the products of the high-quality high reliability in a short time. The analytic implementation of EMC/EMI analog simulation, will bring the limitless business opportunity to circuit artificer and PCB manufacturing industry.
From: http://www.emchome.net/article.php/864