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TSMC targets 2029 advanced packaging plant in Arizona to support AI demand
April 23, 2026 /SemiMedia/ — Taiwan Semiconductor Manufacturing Co (TSMC) plans to build an advanced chip packaging facility in Arizona, with a target to bring capacity online before 2029, as it looks to support growing demand from AI applications The move highlights a key constraint in the semiconductor supply chain. Modern AI chips, including those used by Nvidia, often rely on advanced…
Nvidia expected to take 60% of CoWoS wafer supply by 2026, TSMC to expand packaging in U.S.
July 31, 2025 /SemiMedia/ — Global demand for CoWoS (Chip-on-Wafer-on-Substrate) packaging wafers is forecast to reach 1 million units by 2026, with Nvidia expected to secure 60% of the total capacity, according to a new research note from Morgan Stanley. The report projects that Nvidia will require approximately 595,000 CoWoS wafers in 2026, with around 510,000 wafers to be manufactured by…
