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NVIDIA provides $1.5 billion prepayment to expand Amkor’s U.S. AI packaging capacity
July 24, 2026 / SemiMedia / — NVIDIA and Amkor Technology have entered into a multi-year strategic partnership that includes a $1.5 billion prepayment to expand advanced semiconductor packaging and test capacity in the United States. The financial arrangement will support Amkor’s U.S. manufacturing expansion and the joint development of packaging technologies for future AI and accelerated…
TSMC adds $100 billion to Arizona investment as AI chip demand stays strong
July 20, 2026 / SemiMedia / — Taiwan Semiconductor Manufacturing Co. plans to invest an additional $100 billion in its Arizona operations, raising its total planned investment in the state to $265 billion as customer demand for AI-related chips remains strong. TSMC Chief Financial Officer Wendell Huang said the company is satisfied with the progress of its Arizona projects and continues to see…
Copper Core Balls: A Smarter Alternative for BGA Packaging
If you work with BGA or CSP packaging, you've probably run into the tradeoffs of standard solder balls: good electrical performance, but limited mechanical reliability under thermal cycling — especially in larger package sizes.
Copper Core Balls (CCB) solve this by using a solid copper core wrapped in a solder alloy shell. The copper core keeps the standoff height consistent during reflow (no more collapsed joints), while the solder shell still gives you a proper metallurgical bond to the pad. The result: better thermal cycling reliability and more consistent joint height across the whole array, without giving up the ease of a standard SMT reflow process.
CCBs are increasingly used where board-level reliability really matters — automotive electronics, industrial modules, and larger BGA packages where a handful of failed joints can take down the whole assembly.
We manufacture copper core balls at JINNHOO Semiconductor, with sizes and alloy shells customizable to your process. If you're evaluating options for your next BGA design, more details are here: jinnhoosemi.com/copper-core-ball.html
#semiconductor #BGA #solderballs #electronics #SMT #packaging
Powertech plans $400 million Broadcom PLP venture in Singapore
July 17, 2026 / SemiMedia / — Powertech Technology Inc. said its board has approved a plan to establish a panel-level advanced packaging joint venture with Broadcom Technologies in Singapore, with Powertech planning to invest $400 million in the project. The investment will be made in stages according to the construction schedule and funding requirements of the Singapore facility. Powertech said…
The ringgit recovered against the dollar as the Fed's softened outlook eased pressure on emerging currencies....
Analyzing Epoxy Molding Compound for Semiconductor Packaging Market Trends and Technological Shifts
The Epoxy Molding Compound for Semiconductor Packaging Market is currently being reshaped by significant trends, including a decisive technological shift towards advanced, high-performance formulations and a growing emphasis on environmental sustainability. The market, valued at USD 2,067 Million in 2024 and projected to reach USD 3,635 Million by 2030, is witnessing a clear bifurcation in demand: steady, high-volume consumption of Basic and Middle-grade EMCs for legacy and mainstream applications, and a rapidly expanding, technology-intensive tier for High-end and Advanced Packaging EMCs . This latter segment, driven by the need for superior thermal management, ultra-low warpage, and low dielectric loss, is critical for applications in 5G, AI, and high-performance computing . The market is also seeing a significant trend towards "Green" EMCs, which are halogen-free and lead-free, accounting for over 51% of the market share in 2024, as manufacturers comply with stringent environmental regulations like RoHS and REACH . This is encouraging innovation in eco-friendly materials that meet both performance and sustainability goals.
The Epoxy Molding Compound for Semiconductor Packaging Market Trends also highlight the growing importance of regional dynamics and supply chain resilience. The Asia-Pacific region currently leads the market with a 56.55% share in 2024, driven by its dominant semiconductor manufacturing base in countries like China, Taiwan, South Korea, and Japan . However, Europe is emerging as the fastest-growing region, with a projected CAGR of 7.5% from 2025 to 2032, fueled by the EU Chips Act and a strategic push to reduce dependency on Asian supply chains . The Epoxy Molding Compound for Semiconductor Packaging Market is also witnessing consolidation and innovation among key players, with companies like Sumitomo Bakelite, Resonac, and Shin-Etsu Chemical investing heavily in R&D to develop next-generation materials . The rise of Chinese manufacturers, such as Jiangsu HHCK (which acquired Hysol Huawei), is also reshaping the competitive landscape, creating a dynamic environment where innovation and localization are key differentiators . This technological evolution and regional realignment ensure the Epoxy Molding Compound for Semiconductor Packaging Industry remains a hub of continuous improvement and strategic growth.
Global Foundry 2.0 revenue reaches $86 billion in Q1 as AI demand grows
July 1, 2026 /SemiMedia/ — Global Foundry 2.0 revenue reached $86 billion in the first quarter of 2026, rising 23% year-on-year, according to Counterpoint Research’s latest foundry supply tracker. The growth was mainly driven by strong demand for AI GPUs and AI ASICs, which increased demand for advanced-node wafers and raised utilization rates for advanced packaging capacity. Counterpoint…
5 Reasons Next-Gen AI Chips Quietly Rely on Korean Packaging Innovation
📋 The Gist: The relentless pursuit of next-generation AI models like GPT-5 and Mythos is pushing silicon to its limits, creating an urgent need for advanced chip packaging. Korean materials science pioneer SKC is quietly at the forefront with its Glass Core Substrate (GCS) technology, a revolutionary approach poised to unlock unprecedented data density and thermal efficiency for future AI…
