Ice lithography: Opportunities and challenges in 3-D nanofabrication
Nanotechnology and nanoscience are enabled by nanofabrication. Electron-beam lithography (EBL), which makes patterns down to a few nanometers, is one of the fundamental pillars of nanofabrication. In the past decade, significant progress has been made in electron-beam-based nanofabrication, such as the emerging ice lithography (IL) technology, in which ice thin-films are used as resists and patterned by a focused electron-beam. The entire process of IL nanofabrication is sustainable and streamlined because spin coating and chemical developing steps commonly required for EBL resists are made needless.
A fresh review "Ice lithography for 3-D nanofabrication" by Prof. Min Qiu at Westlake University is published in Science Bulletin. In this review, the authors present current status and future perspectives of ice lithography (IL). Different ice resists and IL instrument design are also introduced. Special emphasis is placed on advantages of IL for 3-D nanofabrication.
The IL technology was first proposed by the Nanopore group at Harvard University in 2005. Water ice is the first identified ice resist for IL, and it is still the only one positive-tone lithography resist so far. As shown in Fig.1, water ice is easily removed within the electron-beam exposure area. Organic ice condensed from simple organic molecules, such as alkanes, demonstrates a negative-resist-like capability, which means only exposed patterns remain on the substrate after heating the sample to room temperature.
Read more.

















