Mar 21, 2025
Rubber/Tyres manufacturing, being a multi-stage process using different grades of rubber as the primary raw material, requires a robust trac
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Rubber/Tyres manufacturing, being a multi-stage process using different grades of rubber as the primary raw material, requires a robust trac
Have you digitised Quality Check (QC) with Digital Stamping and Signature? #Digitisation involves real-time data from sensors, #IoT devices, and barcode/RFID scanning. It monitors quality metrics more efficiently than manual methods, triggering alerts for corrective action in real time. #DataAnalytics exposes trends in quality issues to identify and plan preventive maintenance needs also. QC reviews and approvals are digitised with digital signatures of quality personnel to ensure a secure and traceable approval process. All QC documents, including digital stamps and approvals are stored in a centralised document management system for easy access during audits. We provide holistic solutions for digitised QC and monitoring, including data acquisition and #Traceability. For More Info: https://zurl.co/22oCY
Is the efficiency of Device Programming bothering you? Not any more! We bring you BPM Microsystems latest 9th generation 2900L four socket manual device programmer to program high-density devices such as MCUs, managed NAND, and flash memory. Its Vector Engine Co-Processor accelerates flash memory waveforms during programming, achieving sp eeds of 12.8 GB per second through synchronous operations with zero dead waiting time between the DUT and the programmer, resulting in fast programming matching the silicon design. • Minimal operator fatigue due to integrated lever socket actuator • Extendable to 44 devices simultaneously • Mission-critical quality standards • BPWin and JobMaster for fast and easy production • Up to 52% faster programming For More Info: https://zurl.co/inrAZ
Smart Factory Mistake-Proofing
Does your factory produce defect-free products?
Mistake Proofing:- To err may be human, but production mistakes are unacceptable in any industry. Efforts should be made to produce only defect-free products, towards this end, tools need to be used to eliminate errors or to rectify the errors quickly before the product reaches a customer.
Mistake Proofing or Poka Yoke is the most commonly deployed practice. One of how mistake-proofing achieves its goal is by creating tools which ease human operations at each error-causing possibility, including tools for automation.
Mistake Proofing needs to be applied at various stages to create defect-free products. Here are the different layers where your Mistake-proofing initiatives need to be applied to ensure the production of defect-free products.
1. Operational layer
The Operational Layer involves physical tools closest to the operator. This includes measuring instruments such as smart cameras, torque controllers, actuators, and sensors. These measure one device at a time and are designed by quality engineers or manufacturing engineers.
Operators need to be trained in using these devices. It involves parts identified by barcodes and RFID, the use of limit switches, mistake-proofing jigs, counters, timers, relays, dividers, blocks, automation and other tools which are useful to the operator in detecting and preventing errors, causing stoppage of line with control and warning codes for quick action by the operator. The activities at this level happen in silos and cannot be communicated to other levels.
2. Process layer
Programmable Logic Controllers (PLCs) and Supervisory Control and Data Acquisition (SCADA) are the tools used to monitor the sequence of tasks. Although they are easy to program, these are rigid interfacing devices involving multiple layers of programming and are often created with little understanding of human experience at the ground level. These are created by control engineers with little expertise in manufacturing.
3. Progress layer
The Progress Layer is software-based and involves the Manufacturing Execution System (MES) which specifies audits and has access to all devices and layers. It can integrate with all systems but is not agile. Any change that needs to be carried out is complex. It is created by the IT engineers and needs synchronisation with operator-level work.
4. Business layer
At the Business Layer, the Enterprise Resource Planning (ERP) system is involved which monitors the supply chain, inventory and human resources. It communicates with the MES and directs it on what to build. This is created by IT and Finance professionals.
5. Adaptive layer
The Adaptive Layer has access to all devices and layers, helping detect anomalies within manufacturing and enforcing action to reduce downtime and reduce time to build devices. It needs vast amounts of data and data models to make quick decisions. It is slowly finding relevance as it gives a clear advantage to those using it.
MELSS has been providing holistic solutions to industries which help in improving metrics by using mistake-proofing techniques. Synchronising well with traceability tools such as barcode and RFID, our Recipe Management System ensures the correct parts are used by the operators in the right sequence. Our PLC and SCADA systems are being used by many industries and our data loggers help in generating useful information. Our MES software is robust, integrating easily with the other mistake-proofing tools. For more: industrial automation and robotics
Melss's answer: Industry 4.0: Integrating advanced technologies into manufacturing and industrial processes to create smart, interconnected
Have your PIC-based devices been tested reliably and quickly?
Photonic Integrated Circuit (PIC) solutions are being adopted by manufacturers to address the reduced size and complexity challenges while also addressing heat management issues experienced in today’s data centres. Frantic development of smaller, faster, cheaper and greener transceivers/active components and passive components is driving the development of high-speed networks and 5G, Photonic Integrated Circuits (PICs).
Passive optical components used in optical systems operate without external power or active control. They use processes such as transmission, reflection, polarisation, coupling, splitting, filtering, and attenuation to alter light signals.
Need for Testing
A PIC is composed of many optical components such as optical couplers, fibre-optic switches, splitters, attenuators, wavelength-division multiplexers, and transceivers.
Testing of any PIC-based device is needed in all life cycle stages — from design and development, and qualification to validation of production.
Testing — The Requirements
Automation, repeatability, scalability and parallelisation of the testing processes are needed for the huge volume of circuits and ports, to be able to meet the profitability of economies of scale. Photonics labs must evolve with the optical test requirements of passive (guiding light) optical components.
The fast-maturing PIC die manufacturing has given rise to photonic wafers containing thousands of components made available by foundries through Process Design Kits (PDKs). Reliable testing is needed to optimise the different parameters of a given optical component.
Testing — The Challenges
Accuracy/repeatability: Obtaining traceable results for tight acceptance thresholds and greater yield of known good dies.
Dynamic range: Seeing full optical spectral contrast in a single measurement.
Speed: Keeping alignment and measurement time to a minimum, but also accelerating the ease of the test and analysis iterative flow.
From data to insight: Generating and managing structured data that is ready for artificial intelligence and business intelligence.
Flexible/Scalable: Leveraging test station modularity and third-party compatibility of software to improve test throughput and complexity over time or swap equipment as needed.
Automation: Automating chip and wafer advanced navigation to control any instrument and execute data analysis in user-defined test routines to test massive circuits with minimal cost of ownership.
Testing PIC-based passive components is challenging due to the high port count of some components like Arrayed Waveguide Grating (AWG) and the huge number of components to test on a single die. A component test platform operates in conjunction with a continuously tunable laser to measure optical insertion loss, return loss and polarisation-dependent loss across the laser’s spectral range. The optical spectrum must be realised quickly and with a high wavelength resolution, typically to the order of a picometer.
Testing — The Process
The PIC devices are usually tested at the wafer level prior to dicing to detect defects as early as possible and to avoid packaging defective dies.
Using a PIC wafer probe station, light is coupled into the wafer to enable measurement of the optical characteristics of the DUT.
Testing Solutions for Photonics from MELSS
MELSS brings you Test and Measurement (T&M) hardware and software solutions from market leaders EXFO, which are automated, scalable, fast, accurate and cost-optimised. These T&M solutions range from those for Passive and Active components as well as automated probe stations for wafer and single-die testing.
The OPAL series of probe stations deliver industry-leading performance for testing wafers, multiple as well as single dies, enabling accurate, repeatable and fast measurement. The PILOT software suite offers automation capabilities that support the full test flow (preparation through measurement to results analysis), using EXFOs or third-party T&M instruments.
EXFOs comprehensive range of optical testing solutions includes component test platforms, optical testing solutions, light sources, benchtop tunable lasers, passive component testers, optical spectrum analysers, tunable filters with adjustable bandwidth, variable attenuators, switches and power meters.
EXFO has developed automated, scalable, fast, accurate and cost-effective Test and Measurement (T&M) hardware and software solutions. Ranging from simple optical testing to spectral optical characterisation or traffic analysis, EXFO offers an extensive selection of probe stations for wafer, bar, multi-die or single-die configurations, and a powerful automation software suite.
The CTP10 from EXFO specifically addresses key PIC measurement challenges. measuring optical components quickly, reliably and accurately.
The CTP10 is a modular component test platform that operates together with the T200S or T500S continuously tunable lasers. The CTP10 characterises the spectral properties of high port count devices in one single scan with
High spectral resolution
70-dB dynamic range, even at a sweep speed of 200 nm/s
Operation from 1240 to 1680 nm
Coverage of a wide range of applications, including telecom, sensing and LIDAR.
Both optical and photocurrent measurements with analog output for PIC first-light search and coupling optimisation
Fast data transfer
Remote control using SCPI commands is possible
Increased PIC testing throughput
Reduced test time
High sampling resolution of 20 fm
Accurate measurement of narrow spectral features
The CT440 is a compact variant of the CTP10, with the same performance — ideal for the characterisation of PIC components with limited outputs.
In addition to the above range of products, EXFO produces other advanced products such as the T200S, T500S, CTP10, CT440, OSICS T100, FTBx-2850 and OSA20.
Author MELSS
Does your tyre unit have fool-proof traceability? In the #TyreIndustry, traceability and interlocking systems ensure #ProductQuality, supply chain transparency and safety, and meet regulatory standards. A unique ID (barcode, #RFID tag, or Data Matrix code) on each tyre at the production stage stores vital information: • Manufacturer details • Production date • Tyre specifications • Batch number Integration with supply chain and #LogisticsManagement enables real-time updation with location, transaction details, tracking, recycling and disposal to enable #sustainability. An interlocked supply chain (supplier, manufacturer, distributor) ensures no skipped or overlooked steps and automatic alerts at each stage help to avoid mishandling or delays. For more info, please visit https://zurl.co/onppa
We bring you D:PLOY from OnRobot It is an innovative and the industry’s first automated platform for building, running, monitoring, and re-deploying collaborative applications. It helps to get a robotic application up and running quickly even from the manufacturing floor with zero programming and zero simulations. It offers savings of up to 90% on Deployment and redeployment time from existing solutions, enabling you to bring down overall automation costs. This results in faster and lower-cost implementation, while you gain control over ongoing automation changes in your production.
It works with various grippers, robots, machine types, infeed/outfeed and pattern options, position, tool mounting and robot mounting.
For More Info https://www.melss.com/industry-4-0/grippers-eoat-and-end-effectors-for-robots/