Mar 16, 2022
The global flip chip market size is expected to reach USD 36.7 billion by 2028, rising at a CAGR of 8.2% during the forecast period.
Based on types, the global flip chip technology market is fragmented as copper pillar solder bumping, tin-lead eutectic solder, lead-free solder, and gold bumping, other. Growth of the copper pillar segment is attributed to advancement of copper bumping metallurgy and its wide applications. .The copper pillar has effective pitch of 80 μm and appears to be a promising approach down to pitches of 40 μm. Copper pillar technology was patented by IBM in 2001, in the form of a metal post attached by solder to the silicon and substrate pads. This technology is currently used by mobile companies.