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Powertech plans $400 million Broadcom PLP venture in Singapore

July 17, 2026 / SemiMedia / — Powertech Technology Inc. said its board has approved a plan to establish a panel-level advanced packaging joint venture with Broadcom Technologies in Singapore, with Powertech planning to invest $400 million in the project. The investment will be made in stages according to the construction schedule and funding requirements of the Singapore facility. Powertech said…

#Advanced packaging #AI chip packaging #Broadcom #Electronic components #FOPLP #panel-level packaging #Powertech Technology #Singapore semiconductor investment

Global FOPLP Market Present Trends, Demand Analysis, Market Strategy, Geography and Forecast 2024

Fan-out panel level package (FOPLP) is well-known process to extend for Fan-Out Wafer Level Package (FOWLP) efficiently in terms of area-fill factor and large.

According to this study, over the next five years the FOPLP market will register a xx% CAGR in terms of revenue, the global market size will reach US$ xx million by 2024, from US$ xx million in 2019. In particular, this report presents the…

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#Europe FOPLP Market #FOPLP #FOPLP Market #FOPLP Market Analysis #FOPLP Market Business #FOPLP Market Report #FOPLP Market Research Analysis #FOPLP Market Research Report #FOPLP Market Strategy #FOPLP Market Trends #Global FOPLP Market #Global FOPLP Market 2018 #Global FOPLP Market 2019 #Global FOPLP Market 2020

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