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New Product Launch: JFEGWO High-Performance Car Jump Starter Series

As automotive technology advances, the demand for reliable car jump starters and emergency power solutions continues to grow. JFEGWO is excited to introduce four new models in our car jump starter series, designed to tackle various battery issues and emergency situations. Each product is equipped with cutting-edge technology and intelligent safety features, ensuring a reliable and convenient experience for all drivers.

1. JFEGWO 12V 6250A 18000mAh Car Jump Starter with Air Compressor and LED Light

Key Features:

Specifications:

Peak Current: 6250A

Air compressor：150PSI switch on/off

Battery Capacity: 18000mAh

Application: Suitable for 12V vehicles such as cars, SUVs, etc.

Other Features: Short-circuit protection, overcurrent protection, overheating protection, reverse polarity protection.

Product size: 15.7*7.9*3.5cm/6.18*3.11*1.38 inches

Package Contents:

JFEGWO 12V 6250A Car Jump Starter

Smart Charging Cable

Car Charger

User Manual

EVA Storage Case

2. JFEGWO 12V 8250A 22000mAh Car Jump Starter with Air Compressor

Key Features:

Ultra-Large Capacity: With a massive 22000mAh battery capacity, this jump starter supports more start attempts, making it ideal for larger vehicles and prolonged use.

Efficient Air Compressor: Not only can it inflate car tires, but it also works with bicycles and motorcycles, offering versatile functionality.

Emergency Jump Start: This device is designed for emergency jump-starting of 12V vehicles, making it the perfect tool for car owners in need of a reliable solution.

Specifications:

Peak Current: 8250A

Air compressor：150PSI switch on/off;10.3bar

Battery Capacity: 22000mAh

Charging Method: USB Type-C and car charger

Operating Temperature: -20℃ to 60℃

Package Contents:

JFEGWO 12V 22000mAh Car Jump Starter

Smart Charging Cable

Air Compressor Accessories

Car Charger

Multi-functional Connection Cables

User Manual

3. JFEGWO 12V 6000A 22000mAh Ultra Super Powerbank Car Jump Starter

Key Features:

Advanced Capacitor Technology: Utilizing ultra-high capacitor technology, this jump starter provides rapid vehicle starts with no risk of overcharging.

Emergency Charging: In addition to vehicle jump-starting, it can also serve as a portable power bank to charge smartphones and other devices, offering versatile usage.

Intelligent Protection System: Equipped with a smart protection circuit, it prevents device damage and overcharging, ensuring safety during use.

Specifications:

Peak Current: 6000A

Air compressor：150PSI switch on/off

Battery Capacity: 22000mAh

Applicable Vehicle Types: Suitable for 12V vehicles

Other Features: Short-circuit, reverse polarity, overcurrent, and overheat protection.

Product size:15.7*7.9*3.5cm/6.18*3.11*1.38 inches

Package Contents:

JFEGWO 12V 22000mAh Jump Starter

Smart Charging Cable

USB Charging Cable

Car Charger

User Manual

Premium Storage Case

4. JFEGWO 2025 New Arrival 26000mAh Auto Power Bank Booster (8250A Peak Current)

Key Features:

Large Capacity & High Peak Current: With a 26000mAh battery and 8250A peak current, this jump starter can easily start various 12V vehicles, especially those with long periods of disuse or aging batteries.

Car Charging & Smart Alerts: Equipped with car charging functionality and an intelligent alert system, this device ensures safe usage. It will alert the user in case of improper connection, preventing reverse connections or errors.

Versatile Usage: In addition to car jump-starting, this device can charge other devices, making it a multifunctional emergency tool.

Specifications:

Peak Current: 8250A

Battery Capacity: 26000mAh

Applicable Vehicle Types: Suitable for all 12V vehicles

Smart Protection: Short-circuit, overcurrent, overheating protection, temperature monitoring.

Product size: 15.7*7.9*3.8cm/6.18*3.11*1.5 inches

Package Contents:

JFEGWO 26000mAh Car Power Bank Booster

Smart Cables

Car Charger

User Manual

Storage Bag

Conclusion

JFEGWO’s new car jump starter series is equipped with powerful features, precise protection measures, and an exceptional user experience. Whether you need to jump-start your car, inflate a tire, or charge devices, our products provide a comprehensive emergency solution. These devices are perfect for both everyday use and emergency situations, ensuring you’re always prepared. Each product comes with complete accessories and is packaged for easy portability, making it your ideal travel companion.

Visit our official website now to purchase the perfect car jump starter for your needs and ensure the safety of your journeys!

Why do we need AC DC converter | E-energyIT

Why do we need AC DC converter？

Have you ever stopped to think about how your electronic devices, such as phones, laptops, and appliances, are able to use the alternating current (AC) power supplied by the electrical grid? The answer lies in the AC to DC converter, a device that converts AC power to direct current (DC) power, which is the form of electricity that most electronic devices use.

But why do we need such a converter in the first place? And how does it work? In this article, we will explore these questions and more, delving into the different types of AC-DC converters and their applications. We will also discuss the inverse process of converting DC back to AC, which is essential for certain devices and systems.

Electricity is an integral part of modern life, powering everything from lighting and heating to communication and transportation. It is usually generated at power plants and transmitted to homes and businesses through a network of wires and transformers.

The electricity we use in our homes and businesses is typically alternating current (AC), which means the direction of the current alternates periodically. AC was chosen as the standard form of electricity because it is more efficient and easier to transmit over long distances than direct current (DC).

However, most electronic devices, such as computers, phones, and appliances, use DC power. This means that a conversion is needed to make AC power usable by these devices. This is where AC to DC converters come in.

How does an AC to DC converter work?

AC DC converters, also known as rectifiers, work by exploiting the fact that AC voltage periodically alternates between positive and negative values, while DC voltage is always either positive or negative.

There are two main types of rectifiers: half-wave and full-wave. Half-wave rectifiers only allow one half of the AC waveform to pass through, while full-wave rectifiers allow both halves of the waveform to pass through.

Half-wave rectifiers are the simpler and cheaper of the two, but they have a lower efficiency and produce a pulsating DC output. Full-wave rectifiers, on the other hand, have a higher efficiency and produce a smoother DC output.

Both types of rectifiers use diodes, which are electronic components that only allow current to flow in one direction. In a half-wave rectifier, one diode is used to allow only the positive half of the AC waveform to pass through. In a full-wave rectifier, four diodes are used to allow both halves of the waveform to pass through, but in opposite directions.

The output of the rectifier is then smoothed and filtered by a capacitor, which removes the remaining AC component and produces a pure DC voltage.

What are the different types of AC-DC converters and their applications?

There are several types of AC-DC converters, each with its own specific features and applications. Some of the most common types include:

Linear converters: These use a transformer to reduce the AC voltage to a lower level, and then use a rectifier and filter to produce a DC voltage. Linear converters are simple and reliable, but they have a low efficiency and produce a lot of heat. They are mostly used in low-power applications, such as chargers for small electronic devices.

Switching converters: These use electronic switches, such as transistors, to rapidly switch the AC voltage on and off. The resulting pulsed voltage is then filtered and rectified to produce a DC voltage. Switching converters are more efficient and produce less heat than linear converters, but they are more complex and prone to electromagnetic interference. They are used in a wide range of applications, from chargers for medium-power devices to power supplies for computers and appliances.

AC-DC power modules: These are compact, self-contained units that include a transformer, rectifier, and filter, as well as protection and regulation circuits. AC-DC power modules are convenient and easy to use, but they have a fixed output voltage and power rating, and are not suitable for high-power or high-voltage applications. They are commonly used in consumer electronics, such as TVs and home appliances.

What are the different types of DC-AC converters and their applications?

Just as AC-DC converters convert AC power to DC power, DC-AC converters, also known as inverters, convert DC power to AC power. They are used in a variety of applications, such as:

Renewable energy systems: Many renewable energy sources, such as solar panels and wind turbines, produce DC power, which needs to be converted to AC power to be used by the electrical grid or household appliances. Inverters are used to perform this conversion.

Uninterruptible power supplies (UPS): UPS systems provide backup power in case of a power outage or fluctuation. They usually consist of a battery bank, a charger, and an inverter. The inverter converts the stored DC power from the battery bank to AC power, which is then used to power the connected devices.

Electric vehicles (EVs): EVs use batteries to store and supply DC power to the electric motor. Inverters are used to convert the DC power to AC power, which drives the motor and propels the vehicle.

Which devices in our homes and businesses convert DC to AC?

There are several devices in our homes and businesses that convert DC to AC, either as their primary function or as part of a larger system. Some examples include:

Renewable energy systems: As mentioned above, solar panels and wind turbines produce DC power, which needs to be converted to AC power to be used by the electrical grid or household appliances. Inverters are used to perform this conversion.

Electric vehicles (EVs): EVs use batteries to store and supply DC power to the electric motor. Inverters are used to convert the DC power to AC power, which drives the motor and propels the vehicle.

Conclusion

AC to DC converters and DC to AC converters play a vital role in allowing us to use electronic devices and appliances powered by AC electricity. They come in various forms and sizes, and are used in a wide range of applications, from charging devices to powering motors and supplying backup power.

Without these converters, we would not be able to use the vast majority of our electronic devices and appliances, making them an essential part of our modern lives.

Prepare your supply chain

Buyers of electronic components must now be prepared for future prices, extended delivery time, and continuous challenge of the supply chain. Looking forward to the future, if the price and delivery time continues to increase, the procurement of JIT may become increasingly inevitable. On the contrary, buyers may need to adopt the "just in case" business model, holding excess inventory and finished products to prevent the long -term preparation period and the supply chain interruption.

As the shortage and the interruption of the supply chain continue, communication with customers and suppliers will be essential. Regular communication with suppliers will help buyers prepare for extension of delivery time, and always understand the changing market conditions at any time. Regular communication with customers will help customers manage the expectations of potential delays, rising prices and increased delivery time. This is essential to ease the impact of this news or at least ensure that customers will not be taken attention to the sudden changes in this chaotic market.

Most importantly, buyers of electronic components must take measures to expand and improve their supplier network. In this era, managing your supply chain requires every link to work as a cohesive unit. The distributor of the agent rather than a partner cannot withstand the storm of this market. Communication and transparency are essential for management and planning. In E-energy Holding Limited, we use the following ways to hedge these market conditions for customers:

Our supplier network has been reviewed and improved for more than ten years.

Our strategic location around the world enables us to access and review the company's headquarters before making a purchase decision.

E-energy Holding Limited cooperates with a well -represented testing agency to conduct in -depth inspections and tests before delivering parts to our customers.

Our procurement is concentrated in franchise and manufacturer direct sales.

Our customer manager is committed to providing the highest level of services, communication and transparency. In addition to simply receiving orders, your customer manager will also help you develop solutions, planned inventory and delivery plans, maintain the inventory level of regular procurement, and ensure the authenticity of your parts.

Add E-energy Holding Limited to the list of suppliers approved by you, and let our team help you make strategic and wise procurement decisions.

#AC converter #DC converter

What is difference between FPGA and CPLD | E-energyIT

Programmable logic devices, or PLDs, are a type of integrated circuit that can be reprogrammed to perform different functions. They are widely used in various applications, from embedded systems to high-performance computing. Two popular types of PLDs are Complex Programmable Logic Devices (CPLDs) and Field-Programmable Gate Arrays (FPGAs). While both CPLDs and FPGAs are programmable, they have distinct features and capabilities that make them suitable for different types of applications.

A Complex Programmable Logic Device (CPLD) is a type of integrated circuit that contains multiple programmable logic gates. CPLDs are typically used in applications that require a small number of gates, but need to be reprogrammable. They are designed to be simple to use and have a relatively low gate count. CPLDs are also relatively low cost and consume less power compared to other types of PLDs. They are often used in embedded systems and industrial control applications, where the ability to reprogram the device in the field is useful.

On the other hand, a Field-Programmable Gate Array (FPGA) is a more advanced type of PLD that offers higher densities and higher performance compared to CPLDs. FPGAs consist of a large number of configurable logic blocks (CLBs) and programmable interconnects that can be used to implement a wide range of digital designs. The CLBs in an FPGA can be configured to perform various logic functions, such as AND, OR, and XOR, and can also be used to implement memory and arithmetic functions.

One of the key differences between CPLDs and FPGAs is their architecture. CPLDs have a fixed architecture, which means that the number of gates and the way they are connected cannot be changed after the device has been manufactured. On the other hand, FPGAs have a flexible architecture, which allows the number of gates and the way they are connected to be changed after the device has been manufactured. This flexibility makes FPGAs more suitable for designs that are expected to change over time.

Another key difference between CPLDs and FPGAs is their performance. Due to the fixed architecture of CPLDs, they have a lower gate count and fewer resources compared to FPGAs. As a result, CPLDs are generally slower and less capable than FPGAs. FPGAs, on the other hand, have a much higher gate count and more resources, which makes them faster and more capable than CPLDs. This makes FPGAs better suited for high-performance applications that require a large number of gates and more resources.

FPGAs also have a wider range of programmable elements than CPLDs, for example, FPGAs have programmable interconnects which allows for more flexibility and better performance. Also, FPGAs have a wider range of programmable elements such as memory blocks, DSP blocks, and hard-IP blocks which allows for more advanced designs.

In terms of cost, CPLDs are generally less expensive than FPGAs. This is because CPLDs have a lower gate count and fewer resources, which makes them less complex and less expensive to manufacture. FPGAs, on the other hand, are more expensive because they have a higher gate count and more resources, which makes them more complex and more expensive to manufacture.

When it comes to power consumption, CPLDs tend to consume less power than FPGAs. This is because CPLDs have a lower gate count and fewer resources, which means they require less power to operate. FPGAs, on the other hand, consume more power because they have a higher gate count and more resources, which means they require more power to operate. This can be an important consideration for applications that are battery-powered or have power constraints.

In terms of design flow, CPLDs are generally simpler to design with than FPGAs. CPLDs have a fixed architecture, which means that designers do not need to worry about routing or place-and-route, as the device's layout is predetermined. FPGAs, on the other hand, have a flexible architecture, which means that designers need to consider the placement and routing of the logic elements, as well as the interconnects between them. This can make FPGA design more complex and time-consuming, but also allows for more flexibility in terms of the design.

In terms of programming, CPLDs can be programmed using a variety of methods, including in-system programming (ISP) and in-circuit serial programming (ICSP). FPGAs can also be programmed using a variety of methods, including JTAG, serial, and parallel programming. However, FPGAs typically require a specialized programming tool, such as a synthesis tool or a high-level synthesis tool, to convert the design into a format that can be programmed into the device.

Is a CPLD an IC?

CPLDs are used in a wide range of applications, including embedded systems and industrial control. One of the main benefits of CPLDs is that they can be reprogrammed to perform different functions, making them a versatile solution for many different types of projects. This flexibility is particularly useful in applications where the design may need to be changed or updated over time. CPLDs are also relatively low cost and consume less power compared to other types of PLDs.

Another advantage of CPLDs is that they are relatively simple to use. They have a fixed architecture, which means that the number of gates and the way they are connected cannot be changed after the device has been manufactured. This makes CPLDs easy to design with, as designers do not need to worry about routing or place-and-route, as the device's layout is predetermined.

CPLDs are also useful in applications where a small number of gates are required, but reprogrammability is still needed. They can be used to implement simple digital designs that would otherwise be implemented using discrete logic, such as state machines, counters, and simple memory. CPLDs are also useful for implementing glue logic, which connects different parts of a system together.

CPLDs are digital circuit that can be programmable logic device. They are typically used in applications that require a small number of gates, but need to be reprogrammable. CPLDs are designed to be simple to use and have a relatively low gate count. The number of gates in a CPLD can range from several hundred to several thousand, depending on the specific device.

CPLDs also have a fixed architecture, which means that the number of gates and the way they are connected cannot be changed after the device has been manufactured. This makes CPLDs easy to design with, as designers do not need to worry about routing or place-and-route, as the device's layout is predetermined.

Additionally, CPLDs are a cost-effective solution for designs that may not require the high gate density or advanced features provided by other programmable logic devices such as FPGAs. CPLDs are also a good choice for designs where power consumption is a concern. The simplicity of their architecture and programming methods also make them a good option for designers who are new to programmable logic devices or who have limited experience with more complex devices.

However, it's important to note that CPLDs may not be the best choice for all applications, particularly those that require a high gate density or advanced features such as DSP blocks and hard-IP blocks. In those cases, an FPGA may be a more appropriate solution. Additionally, CPLDs have a lower performance and less flexibility compared to FPGA.

CPLDs are a type of IC and a versatile programmable logic device that can be used in a wide range of applications, from embedded systems to industrial control. They are relatively low cost, low power, and simple to use and design with. However, they also have a lower gate density and less advanced features compared to FPGAs. Therefore, it's important to carefully evaluate the requirements of the specific project before selecting a CPLD or other programmable logic device.

What devices use CPLDs and FPGAs?

CPLDs and FPGAs are used in a wide range of devices across various industries. Some common applications of CPLDs include:

Embedded systems: CPLDs are often used in embedded systems due to their flexibility, small size, and low power consumption. They can be used to implement the control logic for a variety of devices, such as consumer electronics, industrial control systems, and automotive systems.

Industrial control: CPLDs are widely used in industrial control applications, such as programmable logic controllers (PLCs), motion control systems, and process control systems. They are used to implement the control logic for these systems and can be easily reprogrammed in the field to adapt to changing conditions.

Communication systems: CPLDs are also used in communication systems, such as routers, switches, and modems. They can be used to implement the control logic for these devices and are often used to handle high-speed interfaces, such as Ethernet and USB.

On the other hand, FPGAs are used in a wide range of applications, including:

High-performance computing: FPGAs are increasingly used in high-performance computing applications, such as data centers, supercomputers, and scientific simulations. They can be used to implement custom logic and offload computation from the main CPU, resulting in significant performance improvements.

Telecommunications: FPGAs are widely used in telecommunications systems, such as cellular base stations and optical transport systems. They can be used to implement custom logic for signal processing, modulation, and error correction, and can also be used to handle high-speed interfaces.

Image processing: FPGAs are also used in image processing applications, such as surveillance cameras, medical imaging, and machine vision. They can be used to implement custom logic for image processing, such as image enhancement, compression, and feature detection.

Automotive: FPGAs are increasingly used in automotive applications, such as advanced driver assistance systems (ADAS) and autonomous vehicles. They can be used to implement custom logic for image processing, sensor fusion, and control, as well as to handle high-speed interfaces.

CPLDs and FPGAs have different technical specifications that make them suitable for different types of applications. CPLDs typically have a lower gate count and fewer resources compared to FPGAs. This makes them slower and less capable than FPGAs, but also makes them simpler to use and design with.

FPGAs have a much higher gate count and more resources than CPLDs, which makes them faster and more capable. They also have a flexible architecture, which allows the number of gates and the way they are connected to be changed after the device has been manufactured. This makes FPGAs more suitable for designs that are expected to change over time.

In terms of power consumption, CPLDs tend to consume less power than FPGAs. This is because CPLDs have a lower gate count and fewer resources, which means they require less power to operate. This can be an important consideration for applications that are battery-powered or have power constraints.

CPLDs and FPGAs are both types of programmable logic devices that can be used in a wide range of devices across various industries. CPLDs are typically used in applications that require a small number of gates, but need to be reprogrammable, such as embedded systems and industrial control. FPGAs, on the other hand, are used in high-performance computing, telecommunications, image processing and automotive applications, as they have a higher gate count and more advanced features. Both devices have their advantages and disadvantages and it depends on the specific requirements of the application in which one is more suitable than the other.

Prepare your supply chain

Our supplier network has been reviewed and improved for more than ten years.

Our strategic location around the world enables us to access and review the company's headquarters before making a purchase decision.

E-energy Holding Limited cooperates with a well -represented testing agency to conduct in -depth inspections and tests before delivering parts to our customers.

Our procurement is concentrated in franchise and manufacturer direct sales.

Add E-energy Holding Limited to the list of suppliers approved by you, and let our team help you make strategic and wise procurement decisions.

#fpga #cpld

What are the 4 types and related uses of Optocouplers / Photocouplers？

Optocouplers, also known as optoisolators, are electronic components that are used to isolate electrical signals between two circuits. They are commonly used in a variety of applications, including industrial control systems, power supplies, and telecommunications. In this article, we will explore the four types of optocouplers and their related uses.

1. The 4 types of optocoupler/Photocouplers

The four main types of optocouplers are LED couplers, LASER couplers, photo-transistor couplers, and photo-diode couplers. Each type uses a specific optoelectronic device to transmit the signal, and each has its own unique characteristics and is best suited for specific applications.

1-1.LED couplers

LED couplers use a light-emitting diode (LED) to transmit the signal. The LED is a semiconductor device that emits light when a current is passed through it. The light from the LED is directed at a photosensitive device, such as a phototransistor or a photodiode. The light causes a change in the electrical characteristics of the photosensitive device, which in turn transmits the signal to the other circuit. LED couplers are typically used in low-power applications and are known for their low cost and high reliability.

1-2.LASER couplers

LASER couplers use a laser diode to transmit the signal. A laser diode is a semiconductor device that emits a highly focused beam of light. The light from the laser diode is directed at a photosensitive device, such as a phototransistor or a photodiode. The light causes a change in the electrical characteristics of the photosensitive device, which in turn transmits the signal to the other circuit. LASER couplers are typically used in high-precision applications and are known for their high accuracy and high-speed response.

1-3.Photo-transistor couplers

Photo-transistor couplers use a phototransistor to transmit the signal. A phototransistor is a type of transistor that is sensitive to light. The light from the LED or laser diode is directed at the phototransistor, which in turn amplifies the signal and transmits it to the other circuit. Photo-transistor couplers are typically used in applications where a high level of isolation is required, and they are known for their high gain and low input current.

1-4.Photo-diode couplers

Photo-diode couplers use a photodiode to transmit the signal. A photodiode is a type of semiconductor device that is sensitive to light. The light from the LED or laser diode is directed at the photodiode, which in turn generates a current proportional to the light intensity and transmits it to the other circuit. Photo-diode couplers are typically used in applications where a low-level signal needs to be amplified, and they are known for their high sensitivity and low noise.

2.What is the difference between optocoupler and relay?

An optocoupler and a relay both serve the purpose of isolating electrical signals, but they work in different ways. A relay uses a mechanical switch to open or close a circuit, while an optocoupler uses an optoelectronic device to transmit the signal. Relays are typically more robust and can handle higher power loads, but they are also larger and less precise than optocouplers. Optocouplers, on the other hand, are smaller and more precise, but they are also less durable and can handle lower power loads.

Relays are generally less expensive than optocouplers, but they are also less efficient. They typically require more power to operate and generate more electromagnetic interference (EMI). Relays also have a mechanical component, which can wear out over time, leading to possible failure. On the other hand, optocouplers have no mechanical component, making them more reliable and longer-lasting.

Another key difference between optocouplers and relays is the level of isolation they provide. Optocouplers use an optoelectronic device to transmit the signal, which provides a high level of electrical isolation between the input and output circuits. This is important in applications where there is a potential for high voltage or high current in one circuit that could damage the other circuit. Relays, on the other hand, use a mechanical switch to open or close a circuit, which provides less electrical isolation than an optocoupler.

3.What are optocouplers used for?

Optocouplers are commonly used in a variety of applications, including industrial control systems, power supplies, and telecommunications. They are used to isolate signals between different circuits, such as between a microcontroller and a high voltage circuit. They can also be used to isolate signals between different systems, such as between a computer and a peripheral device. Additionally, optocouplers can be used to provide voltage and current isolation, to protect sensitive electronic devices from voltage spikes and other electrical disturbances.

https://energy-sale-images.oss-cn-hongkong.aliyuncs.com/sale_images/pbougd7dlop5069c8cgr.jpg

3-1.In industrial control systems

optocouplers are often used to isolate signals between a microcontroller and a high voltage circuit, such as an AC motor or a solenoid valve. This is important to protect the microcontroller from high voltage or high current, which could damage the device.

3-2.In power supplies

optocouplers are often used to provide isolation between the input and output circuits. This is important to protect sensitive electronic devices from voltage spikes and other electrical disturbances.

3-3.In telecommunications

optocouplers are often used to isolate signals between different systems, such as between a computer and a peripheral device. This is important to protect the computer from any interference or damage that may be caused by the peripheral device.

3-4.In addition to these applications

optocouplers are also used in a wide range of other industries, such as automotive, medical, and aerospace, where isolation and protection of electronic circuits are critical.

4.Conclusion

optocouplers are an essential electronic component that is used to isolate electrical signals between two circuits. There are four main types of optocouplers: LED couplers, LASER couplers, photo-transistor couplers, and photo-diode couplers. Each type has its own unique characteristics and is best suited for specific applications. Optocouplers are commonly used in industrial control systems, power supplies, and telecommunications, and they provide voltage and current isolation, which helps protect sensitive electronic devices from voltage spikes and other electrical disturbances.

Prepare your supply chain

Our supplier network has been reviewed and improved for more than ten years.

Our strategic location around the world enables us to access and review the company's headquarters before making a purchase decision.

E-energy Holding Limited cooperates with a well -represented testing agency to conduct in -depth inspections and tests before delivering parts to our customers.

Our procurement is concentrated in franchise and manufacturer direct sales.

Add E-energy Holding Limited to the list of suppliers approved by you, and let our team help you make strategic and wise procurement decisions.

#optocouplers #Photocouplers

The Shift Toward Mini PCs Maximizing Efficiency in the Enterprise Market

A Mini PC is a compact, low-power, and cost-effective computer designed for various applications in both consumer and enterprise markets. Unlike traditional desktop computers, Mini PCs are designed to have most of the features of a full-sized desktop computer but in a much smaller form factor. They typically come equipped with a CPU, RAM, storage, and various connectivity options, including USB, HDMI, Ethernet, and Wi-Fi.

Mini PCs are designed to be highly portable and can easily fit into small spaces, making them an ideal solution for a range of applications. They can be used as a home entertainment system, digital signage, or as a compact and portable computing solution. In the enterprise market, Mini PCs are often used as Point of Sale (POS) systems, conference room solutions or kiosks.

1.Overview of the Trend of Businesses Moving Toward Mini PCs

2.Applications of Mini PCs in Enterprise Settings

---------------2.1 Point of Sale (POS) Systems

---------------2.2 Conference and Meeting Rooms

---------------2.3 Kiosks and Self-Service Stations

3.Conclusion

1.Overview of the Trend of Businesses Moving Toward Mini PCs

In recent years, there has been a growing trend among businesses of all sizes to adopt Mini PCs as their computing solution. The reasons for this trend are numerous, including cost-effectiveness, space-saving design, improved performance and productivity, and versatility and scalability.

The compact form factor of Mini PCs provides businesses with a cost-effective solution for computing needs, as they often require less hardware and consume less energy than traditional desktop computers. Additionally, their space-saving design allows for a smaller physical footprint in the office, freeing up valuable space for other uses.

Mini PCs also offer improved performance and productivity compared to traditional desktop computers. With advancements in technology, Mini PCs are now equipped with powerful CPUs, ample RAM, and fast storage options, allowing businesses to run demanding applications and multi-task with ease.

Furthermore, Mini PCs are highly versatile and scalable, allowing businesses to customize and upgrade their computing solutions as their needs change. This means that businesses can easily adapt to changes in their computing needs, such as an increase in users or the adoption of new applications, without having to completely overhaul their existing computing infrastructure.

In conclusion, the trend of businesses moving toward Mini PCs is expected to continue as they offer a cost-effective, space-saving, and versatile computing solution for a range of enterprise needs. With improved performance and productivity, businesses of all sizes can maximize their efficiency and meet their computing needs with a Mini PC.

2.Applications of Mini PCs in Enterprise Settings

2.1 Point of Sale (POS) Systems

Point of Sale (POS) systems are a critical component of many businesses, as they are responsible for processing transactions and managing sales data. Mini PCs provide an ideal solution for POS systems due to their compact form factor, low-power consumption, and cost-effectiveness.

Mini PCs are designed to be highly portable and can be easily mounted on a wall or placed on a counter, making them an ideal solution for businesses that need to set up a POS system in a small space. They also require less hardware and consume less energy than traditional desktop computers, which helps to keep operating costs low.

In addition to their cost-effectiveness and compact form factor, Mini PCs are equipped with the necessary hardware and software to handle the demanding requirements of a POS system. This includes fast processing speeds, ample storage capacity, and connectivity options for peripherals such as barcode scanners, cash drawers, and receipt printers.

With Mini PCs as their POS system, businesses can improve their efficiency and streamline their sales processes. By leveraging the power of Mini PCs, businesses can manage inventory, process transactions, and analyze sales data in real-time, which can help to increase sales and improve customer satisfaction.

2.2 Conference and Meeting Rooms

In today's fast-paced business environment, conference and meeting rooms play a crucial role in enabling teams to collaborate and make informed decisions. Mini PCs provide an ideal solution for conference and meeting rooms due to their compact form factor, versatility, and scalability.

With a Mini PC in a conference room, businesses can leverage technology to enhance collaboration and improve the overall experience for participants. Mini PCs can be used for video conferencing, screen sharing, and multimedia presentations, making it easier for teams to communicate and share information.

In addition to their versatility, Mini PCs are highly scalable, allowing businesses to easily upgrade their conference room technology as their needs change. This means that businesses can keep pace with advancements in technology, such as the adoption of new video conferencing applications, without having to completely overhaul their existing infrastructure.

By leveraging the power of Mini PCs, businesses can improve their collaboration and decision-making processes, making it easier for teams to communicate and share information. This can lead to increased productivity and improved outcomes, making Mini PCs an ideal solution for conference and meeting rooms.

2.3 Kiosks and Self-Service Stations

Kiosks and self-service stations are becoming increasingly popular in a variety of settings, including retail stores, museums, airports, and more. Mini PCs provide an ideal solution for kiosks and self-service stations due to their compact form factor, low-power consumption, and versatility.

Mini PCs are designed to be highly portable and can be easily mounted on a wall or placed on a stand, making them an ideal solution for businesses that need to set up a kiosk or self-service station in a small space. They also require less hardware and consume less energy than traditional desktop computers, which helps to keep operating costs low.

In addition to their cost-effectiveness and compact form factor, Mini PCs are equipped with the necessary hardware and software to handle the demanding requirements of a kiosk or self-service station. This includes fast processing speeds, ample storage capacity, and connectivity options for peripherals such as touchscreens, card readers, and printers.

By leveraging the power of Mini PCs, businesses can improve their customer experience and increase efficiency. For example, a retail store can use Mini PCs as self-service stations, allowing customers to check out items on their own and reducing the need for staff to assist with transactions.

3.Conclusion

Mini PCs are becoming an increasingly popular solution for businesses of all sizes, as they offer a range of benefits that traditional desktop computers simply cannot match. With their compact form factor, low-power consumption, cost-effectiveness, and versatility, Mini PCs are an ideal solution for businesses looking to improve their operations, increase efficiency, and streamline their technology infrastructure.

Whether it's in the form of Point of Sale (POS) systems, conference and meeting rooms, or kiosks and self-service stations, Mini PCs are providing businesses with the tools they need to succeed in today's fast-paced business environment. As technology continues to advance and new applications emerge, it is likely that the popularity of Mini PCs will continue to grow, as businesses look to leverage their benefits to achieve their goals.

In short, the trend of businesses moving toward Mini PCs is driven by the need for cost-effective, versatile, and scalable technology solutions that can support the demands of today's fast-paced business environment. Whether you are a small startup or a large enterprise, Mini PCs are an investment that is well worth considering.

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Low-power AI chips fight in the open

1-Sensor computing: an important technical path for low-power AI

2-Low power AI MCU

3-Market pattern of low-power AI

With the popularization of the Internet of Things and the next generation of intelligent devices, low-power electronic devices and AI chips are increasingly entering thousands of households, and low-power design is becoming increasingly important. On the one hand, the Internet of Things and smart devices have limitations on the size of the device, on the other hand, they also have high requirements for the cost. In addition, in some use scenarios, there are requirements for the battery replacement and charging cycle (such as the need for monthly or longer battery replacement cycle), so there are high restrictions on the battery capacity, which requires that the chip can use low-power design.

On the other hand, the Internet of Things and intelligent devices are increasingly adding the features of artificial intelligence. AI can provide important new features for the Internet of Things and intelligent devices, such as voice AI can provide wake-up word recognition, voice instruction recognition, etc., while machine vision AI can provide face detection, event detection, etc. As mentioned earlier, the Internet of Things and intelligent devices have a demand for low power consumption, so the addition of AI features also needs to be low power AI.

At present, AI chips have been popularized in the cloud and intelligent device terminals, such as GPU represented by Nvidia and AMD and AI acceleration chips represented by Intel/Habana in the cloud; In terminal intelligent devices, AI acceleration IP on SoC is mainly used. However, neither GPU nor AI acceleration IP on SoC takes into account the need for low power consumption. Therefore, in the future, the Internet of Things and AI in intelligent devices will need new low-power related design.

Sensor computing: an important technical path for low-power AI

Low-power AI in intelligent devices and IoT applications needs to reduce power consumption to very low, so as to realize real-time online (always-on) AI services. The so-called "always-on" here means that AI needs to be available forever instead of being opened by users. On the one hand, it is necessary to keep the relevant sensors open to detect the signals of relevant modes in real time, and on the other hand, it is also necessary for AI to achieve low power consumption.

In traditional design, the function of the sensor is to collect high-performance signals and transmit the collected signals to the processor (SoC or MCU) for further calculation and processing, while the sensor itself has no computing power. However, the traditional design assumption is that the relevant processors will be turned on at the same time when the sensor is turned on, which cannot meet the requirements of always-on AI, because the SoC and MCU will consume a lot of batteries if they are running AI algorithms all the time. On the other hand, from a practical point of view, this kind of always-on AI application mainly hopes that AI will always run so that it can respond in real time once important related events occur (for example, IMU detects that the user is driving and turns off the push notification of the intelligent device), but in fact, the frequency of such related events is not very high. If the AI module of SoC or MCU is always turned on, Most of the time, the output of the AI model is "no event detected".

Combined with these two points, the calculation running at the sensor end is becoming more and more important. First of all, in always-on's low-power AI, the sensor needs to be turned on at all times. Therefore, if the sensor can have AI computing capability, the AI model can be run on the sensor side without opening the AI module on the SoC or MCU. In addition, running AI at the sensor end can also avoid the continuous transmission of data between the sensor and SoC/MCU, thus further reducing power consumption. Finally, the AI module at the sensor end can be customized for the sensor without considering universality, so it can customize and optimize the AI algorithm that is most suitable for the sensor, so as to achieve a very high energy efficiency ratio.

Of course, artificial intelligence at the sensor end also has its own limitations. On the one hand, in terms of performance and cost, the computing and storage space at the sensor end is usually small, and the AI module cannot support large models, so the performance of the model will be limited.

On the other hand, as mentioned above, artificial intelligence at the sensor end is also difficult to support general models, and often only supports some specific operators and model structures.

To sum up, the sensor side AI can achieve low power consumption, but its model performance is also relatively limited; On the other hand, in low-power AI scenarios, the frequency of relevant events that really need to be handled is not high. Combined with these two points, the sensor side AI is most suitable for running some specialized small models to filter out most irrelevant events; After the sensor side AI detects the relevant events, the sensor can wake up the AI on the SoC or MCU to confirm the next step, so as to meet the requirements of low power consumption and always-on at the same time.

In the field of image sensors, Sony has launched the IMX500 series of sensors, in which the sensor chips and logic chips integrated with AI computing capabilities are stacked, so that pixel signals can be transmitted to the AI computing engine on the logic chip, so that the output of the sensor can be an image, an AI model output, or a combination of both. In this way, the sensor can run in the low-power always-on state, and only when its model output meets certain specific conditions (such as the detection of a face) can it wake up the MCU or SoC to do the next action. We expect that Sony will further strengthen its AI capability in the next sensor chip, thus enhancing its leading position in this field.

Another example of the combination of sensors and artificial intelligence is the IMU series products launched by ST. ST integrates Machine Learning Core and Finite State Machine in IMU with relevant AI features, which can support AI calculation directly on IMU in a very efficient way. At present, the AI algorithms supported by ST are mainly decision tree algorithms, and can support some important feature extraction of IMU signals (such as signal amplitude, signal variance, etc.), so that user activity classification can be directly realized on the IMU (such as classification of stationary, walking, cycling, driving a car, etc.), so that the MCU/SoC can be awakened for the next operation when relevant events are detected. According to the data published by ST, the power consumption of MLC is only in the order of microwatts, which can well support the always-on demand. Of course, on the other hand, we also see that the decision tree algorithm has limited capacity in fact, and it is difficult to model complex activities. Therefore, as we discussed earlier, the artificial intelligence in IMU sensor is suitable to complete the initial screening of events to filter out irrelevant events, and the more complex classification and confirmation can be completed through the model running on MCU or SoC.

Low power AI MCU

In addition to intra-sensor AI, another important low-power AI technology path is AI running in MCU. Both the Internet of Things and intelligent devices cannot be separated from the low-power MCU as the most critical control unit. Generally speaking, the power consumption of MCU is one or two orders of magnitude lower than that of SoC. By integrating AI on the MCU, we can put the task of running AI on the MCU, so there is no need to wake up the SoC; Or in some low-cost applications, cost considerations make it impossible to integrate SoC. At this time, if AI is needed, MCU with AI capability is an important option.

It is worth noting that there is no contradiction between AI on MCU and AI on sensor. As mentioned earlier, the complexity of the types of models that AI in sensors can normally run is relatively limited, and the model in a sensor can obviously only use the signal of that sensor as input. On the other hand, the AI module on the MCU can usually support a more general AI model, and it also has the opportunity to use multiple sensor signals as model inputs. Of course, the energy efficiency ratio of the AI module on the MCU is generally slightly lower than that of the AI module on the sensor side. Therefore, the sensor with AI capability and the MCU with AI capability can be combined in a system to run a more specific level of relatively simple model screening event on the sensor side, Wake up the AI module on the MCU to execute a more general model to confirm the event when necessary.

At present, there are some related products on the MCU chip market, such as NXP's RT600 MCU. In addition to the ARM M33 core, this product also integrates Tensilica HiFi 4 DSP and has 4.5 MB of on-chip storage, which can accelerate the general AI model. In addition to NXP, ADI MAX78000 MCU integrates ARM M4 and RISC-V core, and also integrates CNN accelerator to realize AI acceleration. We believe that in the future, more and more low-power MCUs will join AI capabilities to meet the needs of the Internet of Things and intelligent devices.

Market pattern of low-power AI

As we discussed earlier, low-power AI is more than creating a new category of chips, but adding AI capabilities to existing chips to create certain differentiated competitive advantages. At present, we see that both in the sensor side and in the MCU side, there are leading enterprises in the market (such as Sony and ST in the sensor field; NXP and ADI in the MCU field) actively participating in AI functions. It is expected that more and more companies will also invest in AI products in the future.

For Chinese semiconductor enterprises, artificial intelligence in sensor and MCU is also a direction worthy of attention. At present, joining AI is more about product positioning and integration (that is, how to grasp the market corresponding to the product and integrate the most appropriate AI module), but in the future, with the progress of technology, the relevant technology accumulation will gradually deepen, so if Chinese semiconductor manufacturers can start to layout in this field from now on, It can deepen its technical strength in this field and increase the competitiveness of its products in the future intelligent Internet of Things and the next generation of intelligent devices.

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The Shift Toward Mini PCs Maximizing Efficiency in the Enterprise Market -E-energyIt

The Shift Toward Mini PCs Maximizing Efficiency in the Enterprise Market

1.Overview of the Trend of Businesses Moving Toward Mini PCs

2.Applications of Mini PCs in Enterprise Settings

---------------2.1 Point of Sale (POS) Systems

---------------2.2 Conference and Meeting Rooms

---------------2.3 Kiosks and Self-Service Stations

3.Conclusion

1.Overview of the Trend of Businesses Moving Toward Mini PCs

2.Applications of Mini PCs in Enterprise Settings

2.1 Point of Sale (POS) Systems

2.2 Conference and Meeting Rooms

2.3 Kiosks and Self-Service Stations

3.Conclusion

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Semiconductor applications in the field of new energy vehicles | E-energyIT

As the automotive industry moves towards the wave of new energy electrification, the semiconductor industry is ushering in another "east wind".

The China Association of Automobile Manufacturers predicts that by 2025, China's new energy vehicle sales are expected to reach 6 million units. In addition, according to EVTank, global sales of new energy vehicles are expected to reach 12 million units by 2025.

The ability of new energy vehicles to rapidly capture the automotive market is mainly due to their high technology, including intelligent driving, Sensor chip and on-board sensing systems, all of which are necessary for their implementation without semiconductor technology such as digital chips, sensor chips and memory chips. The trend towards smarter and more electric vehicles is bound to drive up the value of automotive semiconductors.

Semiconductors are the key to the development of the automotive industry

Semiconductors are widely distributed in the various control and power management systems of automobiles, meaning that the automotive chip, which can be said to be the "brain" of the vehicle's institutional components, serves to coordinate the normal driving functions of the vehicle. Among the several functional areas of new energy vehicles, the main areas covered by the chip are: battery management, driving control, active safety, automatic driving and other systems.

A professional body has calculated that on average, each new energy vehicle needs to carry about 1,600 semiconductors, and from the application point of view, the entire vehicle controller and the automatic driving domain controller are inseparable from the various chips.

The more intelligent a new energy vehicle is, the more chips it carries and the more refined it is. Artificial intelligence, Internet of Things and other technologies are advancing and innovating all the time, which requires the quantity and quality of chips in the vehicle to be upgraded accordingly.

The China Association of Automobile Manufacturers expects that the average number of chips in China's new energy vehicles will be as high as 1,459 in 2022, but due to the technical gap between design and production and the international leading level, the import rate of automotive chips is as high as about 95%.

Especially in advanced sensors, vehicle networks, three electrical systems, chassis electronic control, advanced driver assistance systems (ADAS), autonomous driving and other key areas, China's semiconductor industry needs to quickly rise with the industry boom cycle, in order to shorten the main gap in various areas, and constantly improve the independent rate, breaking the system chip monopoly by developed country enterprises this "barrier ".

At present, the relevant Chinese enterprises can produce automotive chip products have basically covered all types of automotive chips. Among them, in the MCU chip and analog chip production, China's several head producers of annual production can reach 600-800 million; memory chip production, the head producers can reach 260,000 pieces.

At the same time, some of the traditional domestic automotive manufacturers have also begun to focus on the extension and expansion of the upstream and downstream of the industry chain, actively layout the automotive semiconductor industry, in the emerging field of automotive semiconductor also continue to push the new, become the main path to support the development of China's automotive semiconductor.

Industry development continues to seek breakthroughs

Although China is still in a weak position in terms of the overall development status of automotive semiconductors, there have been breakthroughs in the application results of semiconductors in individual fields.

For example, in automotive-grade IGBTs, Hangzhou silan2021 generated revenues of 190 million yuan for IGBT devices in the first half of the year, +110% year-on-year, and the company's automotive-grade IGBT module B1 and B3 package products are equivalent to Infineon's five-generation technology, and received a billion yuan order from BYD.

BYD is also relying on its own advantages in electric vehicles, independent research and development of IGBT chips and continuous technology updates and iterations, and by the end of 2020, BYD Semiconductor's IGBT-based automotive-grade power devices have been installed in more than 1 million vehicles in total.

These are signs of China's breakthrough in the field of automotive-grade semiconductors.

In addition, some domestic listed companies in the industry have acquired and integrated major global semiconductor companies through capital operations. In 2019, wingtech acquired the world-renowned semiconductor company Ansell Semiconductor of the Netherlands; in the same year, Willsemi, a veteran domestic manufacturer of semiconductor discrete devices and power management ICs and other semiconductor product designs, acquired OmniVision and SuperPix In the same year, Willsemi, an established domestic manufacturer of semiconductor discrete devices and power management ICs, acquired OmniVision and SuperPix.

These companies through mergers and acquisitions overlaid with endogenous development, China's automotive-grade semiconductors are expected to gain a major breakthrough, to achieve "independent" alternative to imports, and the related automotive semiconductor companies are also expected to benefit deeply, while bringing a significant increase in the value of a single vehicle semiconductor opportunities.

It is widely expected that by 2026, the market size of China's automotive chip industry will reach US$28.8 billion. From the trend point of view, chip integration to lead the deep development of autonomous driving, functional integration to promote the transformation of automotive electronics and electrical architecture, software and hardware decoupling and software-defined car three major directions will become the mainstream of the industry upward movement.

More importantly, the policy tilts towards the automotive electronics chip industry, bringing quality development conditions for the automotive chip industry.

New energy vehicles continue to be popular, automotive intelligence upgrade, integrated circuits as the most critical component of intelligent devices, demand continues to be strong, coupled with 5G, artificial intelligence, intelligent network technology in the automotive field gradually deepen, the application of automotive industry chips will show a long-term growth trend.

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Growing IDM suppliers | E-energyIT

Growing IDM suppliers

Recently, TSMC bucked the trend of growth in the third quarter earnings report once again sigh the hot wafer foundry, in recent years the status of wafer foundry has been climbing, become a big concern in the industry. However, from the perspective of the global chip production capacity structure, pure foundry capacity accounts for only about 20% of the total. Although foundries are "hot", it must be admitted that the current global chip production capacity is still carried by those large IDM factories. As pointed out by the co-CEO of SMIC, 80% of the global IC production capacity comes from IDM factories in the US and Europe.

In the past, the extremely serious lack of core devices, compared to only rely on the foundry, the need to compete for capacity chip design companies, IDM manufacturers and their obvious advantages, stable capacity supply, shorter delivery cycle, stronger design production capacity of adaptability ... Although, in the face of the current bottomless down cycle, IDM manufacturers and foundries also need to Scaling back capital expenditures, but there is an exception to everything, and power devices are that exception. The power IDM giants seem to have chosen a path of counter-trend expansion that runs counter to the logic and storage IDM vendors.

Rushing to 12 inches of 2021

As we all know, the power semiconductor is the core device of energy conversion and control, according to the application area, automotive, industrial and consumer electronics are the first three major end markets of power semiconductors. As the power semiconductor design and manufacturing link combination requirements are higher, so take IDM mode is more conducive to design and manufacturing process accumulation, can speed up the launch of new products, so as to obtain a stronger competitive edge, 2021 global power semiconductor top ten list are basically occupied by IDM manufacturers.

2021 can be described as a high light year of power semiconductors, this year in the power device price has become a not surprising thing, like Infineon, ON Semiconductor, STMicroelectronics and other giants are in a year issued several price increase letter, to June 2021, most of the original factory shipping price increases even up to 30%-40%.

Analysis of the reasons for the two main aspects, on the one hand is last year's new energy vehicles, new energy power generation, industrial automation, rail transportation and other downstream demand for multi-point explosion, making power semiconductor market demand increased greatly. On the other hand is the 8-inch wafer foundry capacity shortage, power semiconductors are mainly processed and manufactured on 8-inch wafers, but last year both domestic and foreign power IDM giants seem keen to expand 12-inch wafers, for example.

Toshiba announced in March last year that it would build a new 300mm wafer fab for the production of MOSFETs and IGBTs; Infineon announced in September last year that its 300mm thin wafer power semiconductor chip plant in Firach, Austria, had officially started operations; ON Semiconductor began to increase the capacity of its 300mm wafer fab in East Fishkill in August last year.

12-inch in full swing, but let 8-inch wafer more "stretched", not to mention a new wafer production line itself will take about 1-2 years, it is difficult to solve the problem of capacity in the short term, more importantly, most of the 12-inch wafer factory is by the original 8-inch production line transformation to the power semiconductor supply and demand imbalance Pressure to further increase, to July 2021, part of the power semiconductor product delivery cycle has been close to a year and a half, to promote the power device industry boom continued upward, even to the first half of this year, the power semiconductor demand is still strong, this can be seen in the second quarter earnings report from the major IDM factory.

ON Semiconductor's 2Q2022 revenue increased by 25% to US$2,085 million, a new record high, combined automotive and industrial chip revenue grew 38% to US$1,365.8 million from US$989 million in 2Q2021; ST's 2Q net profit reached US$3,840 million, with operating profit for the Automotive Products and Discrete Components Products Division (ADG) surging 251.1% to a total of NXP's revenue increased by 28% to US$3,312 million in 2Q2022, while the automotive division's revenue increased by 36% to US$1,713 million; Infineon's revenue reached €3,618 million in 3Q2022, up 33% compared to the same period last year, with a gross margin of 43.2%, including an increase in automotive revenue to €1,701 million from €1,491 million in the previous three months... 1,701 million euros...

Judging from the financial reports of the major manufacturers alone, automotive is indeed the top pillar supporting the development of the power semiconductor industry.

SiC gets stronger and stronger in the second half of 2022

In fact, in the first half of this year, the consumer electronics market had already weakened, but at that time the global shortage of core gap still existed, so a large number of manufacturers still chose to expand production, in the second half of the year, the rapid reversal of supply and demand, coupled with the plummeting demand, further impacted the semiconductor market, many large manufacturers have cut back on capital expenditure, but the power IDM giants still chose to strike again.

Taking power semiconductor leader Infineon as an example, just on October 14, Infineon announced the opening of a new plant in Szeged, Hungary, for the assembly and testing of high-power semiconductor modules to drive the electrification of cars as a key to global carbon emissions reduction. In addition, Infineon has further expanded its investment to increase production capacity for high-power semiconductor modules for a wide range of applications such as wind turbines, solar modules and energy-efficient motor drives to drive green energy. Commenting on this, Rutger Wijburg, Chief Operating Officer of Infineon Technologies, said that the construction of the new plant will further help Infineon to meet the growing demand for electric vehicle applications.

This is not the first time that Infineon has announced a production expansion since the second half of this year. In July this year, it already announced that it would invest US$1.807 billion in the construction of a wafer fab in Kulim, Kedah, Malaysia, which is expected to be completed in the third quarter of 2024. Infineon said at the time that the world was actively promoting carbon reduction and that demand for wide-gap power semiconductors for electric vehicles, charging and storage infrastructure and renewable energy was growing and ready to provide demand support.

In addition to Infineon, two other major IDMs in Europe and the US have chosen to expand their SiC production, with ON Semiconductor holding a ribbon-cutting ceremony on 21 September to inaugurate the expansion of its Roznov SiC plant in the Czech Republic, which will increase SiC production capacity by 16 times over the next two years, with ON Semiconductor investing an additional US$300 million in the Czech plant by the end of 2023. Likewise, this is not the first plant to be inaugurated in the second half of the year. On August 11, ON Semiconductor announced that a ribbon-cutting ceremony had been held for the SiC plant in Hudson, New Hampshire, USA. On August 1, ON Semiconductor announced that it had signed long-term supply agreements with a number of customers, with a total of US$4 billion in commitments for SiC over the next three years.

On 5 October, STMicroelectronics announced that it would build a new SiC substrate plant in Catania, Italy, to meet growing customer demand for SiC devices for automotive and industrial applications as they transition to electrification and seek greater efficiency, thereby enabling ST to supply 40% of its SiC substrates in-house. Production is expected to start in 2023.

When it comes to power IDM giants expanding their production, it's inevitable that Japan is not missing. Japan is a power semiconductor powerhouse, occupying half of the top ten seats in the power semiconductor list.

According to a Nikkei News report in July, Fuji Electric will increase its production capacity for next-generation power semiconductors in FY2024 to about 10 times that of FY2020. Fuji Electric expects demand to expand in areas such as pure electric vehicles, and will establish a mass production system at its plants in Japan in order to be ready to supply products to the automotive industry. Fuji Electric's subsidiary, Fuji Electric Tsugaru Semiconductor, will also introduce a new production line for next-generation power semiconductors at its plant, and will begin mass production in fiscal 2024, increasing the share of SiC power semiconductors in its semiconductor business to around 10% of sales by fiscal 2025, with the goal of taking a leading position in the global SiC power semiconductor market by 2025-2026. The company aims to capture 20% of the global SiC power semiconductor market by 2025-2026.

According to Japanese media Newswitch in September, Hitachi Power Semiconductor, a subsidiary of Hitachi, plans to invest in its Rinkai and Yamanashi factories, as well as in the factories of its outsourced foundry partners, with the aim of increasing the production capacity of power semiconductors for use in EVs and air conditioners to approximately three times the current capacity by 2027. The overall investment (including equipment introduction, depreciation costs and investment in foundry) is estimated to reach 100 tens of billions of yen, mainly due to the high demand from electric vehicles and other uses, and the lack of production capacity.

However, the major giants are also confident in their expansion, as there are only a few products that can continue to increase in price in today's downturn. Rohm and NXP have been exposed to the imminent price hike, IC Insight is expected to power semiconductors in 2022 the average price will rise 11%, which is the highest rate of increase since the economic recovery in 2010.

From the above manufacturers to expand production news, stimulate them to expand production against the trend of the biggest driving force is still the growing demand for electric vehicle applications. While the economic downturn has affected the automotive industry to some extent, in the long term, pure electric vehicles will eventually dominate, with LMC Automotive predicting that they could account for nearly half of all sales by 2034.

Compared to last year's feverish 12-inch wafer expansion, the second half of this year, SiC has become the main focus of power IDM manufacturers, after all, the new generation of power semiconductors made of SiC can withstand higher voltages than existing silicon products, which can significantly reduce power losses and help extend the range of pure electric vehicles and achieve battery miniaturisation.

According to the Fuji Economic Survey Report, the global power semiconductor market is expected to expand to 5 trillion 358.7 billion yen by 2030 due to the expansion of demand for automotive/electronic devices, with the SiC power semiconductor market (including SiC-SBD, SiC-FET and SiC power modules) expected to expand to 969.4 billion yen by 2030, an 11.8-fold increase from 2021. By comparing the two market sizes, the SiC power semiconductor market still has a lot of room for growth, and the expansion momentum may be even hotter in the future.

In conclusion

Generally speaking, the dynamics of the industry giants can reflect the outlook trend of the whole industry. From the power IDM giants' expansion momentum, we can believe that the high boom in power devices will continue, with a low chance of oversupply in the short term.

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SIC MOSFETs offer significant advantages in automotive and power management applications | E-energyIT

SIC MOSFETs offer significant advantages in automotive and power management applications

Traditional silicon-based MOSFET technology is maturing and is approaching the theoretical limits of performance. Wide band gap semiconductors with better electrical, thermal and mechanical characteristics can improve the performance of MOSFETs and are a highly sought after alternative technology. Commercial silicon-based power MOSFETs have been around for nearly 40 years and since their introduction, MOSFETs and IGBTs have been the primary power handling control component for switching power supplies and are widely used in power supplies, motor drives and other circuit designs.

However, this success has also led to MOSFETs and IGBTs experiencing what it means to suffer from success instead. With improvements in the overall performance of the products, particularly the significant reduction in on-resistance and switching losses, these semiconductor switches are being used in a wider range of applications. As a result, the market has come to expect more and more performance from these silicon-based MOSFETs and IGBTs.

Although major semiconductor R&D institutes and manufacturers have made great efforts to meet market requirements and further improve MOSFET/ IGBT products, at some point the law of diminishing returns has prevailed. For several years now, despite significant investment, little has been achieved. It is not uncommon for technologies and products to eventually evolve to a stage where the give and take is not proportional, setting the stage for new disruptive approaches and the introduction of new products.

For MOSFET devices, this cycle of disruptive technology innovation is the result of developing and mastering new base materials. Silicon carbide (SiC) based MOSFETs offer superior performance when compared to pure silicon based MOSFETs. Please note that the products used in this comparison test are not development samples or demonstration prototypes, but SiC-based MOSFETs that are already commercially available.

The development of electric and hybrid vehicles (EV/HEV), an important and rapidly growing application area, has benefited from advances in MOSFET technology, which in turn has pushed MOSFET development and manufacturing activity. Regardless of what consumers think, these battery-laden vehicles are not simply a large battery pack connected to several traction motors (hybrids also have a small petrol engine to charge the batteries), but require a large number of electronic modules to drive the system, manage the equipment and perform special functions.

▪ Power switching conversion systems for electric and hybrid vehicles including.

▪ wheel motor traction inverters (200 kW/up to 20 kHz).

▪ AC input on-board chargers (20 kW/50 kHz-200 kHz).

▪ optional fast charging function (50 kW/50 kHz-200 kHz)

▪ Power supply for auxiliary functions: centre console, battery management control, air conditioning, infotainment system, GPS, internet connection (4 kW/ 50 kHz-200 kHz range)

Why focus on energy efficiency? Range is clearly one of the most important considerations for consumers shopping for electric and hybrid vehicles. Even small improvements in the performance of the inverter can lead to significant improvements in the basic performance indicators that consumers can see in the vehicle.

But it is not just this one factor that requires high energy efficiency, there are a variety of other factors

▪ lower operating temperatures and increased reliability.

▪ lower heat loads, reducing the amount of heat emitted through radiators, heat sinks, coolants and other technologies.

▪ reduction of charging times and basic power consumption.

▪ the need for greater flexibility in the overall package due to the inherent requirements and limitations of systems with higher operating temperatures.

▪ easier compliance with regulatory requirements.

SiC meets the challenge

Fortunately, SiC offers a pathway to greater energy efficiency and the associated performance improvements. How do SiCMOSFETs differ from mainstream pure silicon MOSFETs in terms of structure and performance? In short, SiCMOSFETs are SiC n + substrates with a SiC n-doped epitaxial layer (also known as a drift layer), as shown in Figure 2. The key parameter on-state resistance RDS(ON) depends heavily on the channel resistance RDrift between the source/base and the drift layer.

When the RDrift value is given and the junction temperature is 25?C, the actual area of the SiC transistor die is a fraction of the area of the silicon superjunction transistor die, giving a much higher performance of the SiC transistor if the two tubes are made to have the same chip area. Another way to compare SiC and silicon is to use the familiar quality factor (FOM), i.e. RDS(ON) x chip area (the lower the quality factor the better). At 1200V blocking voltage, the SiC MOSFETs have a very small FOM value, about one tenth that of the best high voltage silicon MOSFETs on the market (900V superjunction tubes).

Compared to the silicon-based IGBTs commonly used in traction inverters, the SiC MOSFETs have the following main advantages.

▪ lower switching losses and, at small to medium powers, lower conduction losses

▪ absence of the PN junction voltage drop that IGBTs have.

▪ a SiC device with a robust, fast intrinsic diode, eliminating the need for an external diode; the recovery charge of this intrinsic diode is so small as to be almost negligible

▪ higher operating temperatures (200?C), resulting in reduced cooling requirements and heat dissipation requirements, while improving reliability

▪ Four times the switching frequency of an IGBT with the same energy efficiency, lower weight, size and cost due to fewer passive components and external components.

Drivers

Experienced engineers know that the power device is only one of many important components of the overall system. To make the design reliable, efficient and cost-effective, it is also necessary to select the right driver for the MOSFET. A suitable driver is one that is specifically designed for the rate of change of current, voltage values and timing constraints that are unique to the target MOSFET and its load. As SiC MOSFET technology has matured, there are many brands of standard drivers on the market that guarantee proper operation of the driver/MOSFET combination.

It is therefore only natural that people are concerned about the ease of driving SiC MOSFETs and more so about the availability of drivers on the market. Excitingly, driving a SiCMOSFET is almost as easy as driving a silicon-based MOSFET, with only 20V gate-source voltage and a maximum drive current of about 2A required to drive an 80mΩ device. Thus, simple standard gate drivers can be used in many cases.

Not just an inference, but a fact

Advances in manufacturing processes sometimes do not guarantee that new technologies will necessarily be industrialised and adopted on a large scale, and SiCMOSFETs are an exception to this rule. SiCMOSFETs are now in high volume production and are being adopted in hybrid and electric vehicles, with tangible results in terms of energy efficiency, performance and operating conditions, which are being transmitted to the circuit level and system level.

A comparison test between a SIC MOSFET and a silicon IGBT was done with an 80kW traction motor inverter power module for hybrid and electric vehicles and the results showed that the 650V SIC MOSFET far outperformed the silicon IGBT in many key parameters. this three-phase inverter module uses a bipolar PWM control topology with synchronous rectification mode. Both devices are sized for junction temperatures of less than 80% of the absolute maximum rated junction temperature. The silicon IGBT scheme uses four parallel 650V/200A IGBTs and associated silicon diodes of the same rating for current continuation; the SIC MOSFET-based scheme design uses seven parallel 650V/100A SiC MOSFETs without any external diodes (only intrinsic diodes are used); rated at 480 Arms (10 seconds) peak power and 230 Arms normal load. Arms. other operating conditions are

▪ DC circuit voltage: 400 Vdc

▪ Switching frequency: 16kHz

▪ SiCVgs voltage +20V/-5V, IGBT Vge voltage ±15V

▪ Coolant temperature: 85°C

▪ RthJ-C(IGBT-die)=0.4°C/W; RthJ-C(SiC-die)=1.25°C/W

▪ Tj ≤ 80% × Tjmax°C under any condition

The following table shows typical power losses at rated peak power.

Notice that SiC MOSFETs show a significant improvement in almost all power loss parameters compared to silicon-based IGBTs. When the MOSFETs are connected in parallel, the resulting RDS(ON) on-resistance divided by the number of MOSFETs results in near-zero conduction losses, so that the SiC MOSFETs have lower conduction losses than the IGBTs. conversely, when the IGBTs are connected in parallel, the resulting VCE(SAT) voltage does not drop linearly and the minimum conduction voltage drop is limited to a range of approximately 0.8 to 1 V.

It is easy to see that the SiC-based MOSFET solution has much lower power losses over the entire load range. Due to the low on-state voltage drop, the on-state losses of these MOSFETs are also reduced from 125 W to 55 W at 100 % load.

At low loads, SiC devices are up to 3% more energy efficient than silicon IGBTs; over the entire load range, the total energy efficiency is at least 1% higher. Although 1 % may not seem like much, for this power class, 1 % represents high power consumption, dissipated power and heat dissipation. Engineers know that high temperatures are the enemy of long-lasting performance and reliability. In addition, high energy efficiency extends the range of electric vehicles, which is a value proposition valued by car manufacturers and consumers alike. Comparing the junction temperatures of SiC and IGBT at 16 kHz switching frequency, from low to full load, it is clear that SiC is the winner, with coolant temperatures of 85?C for both, as shown in Figure 4. The data suggests that because of the high losses, the IGBT cooling system must be more efficient.

Under peak power pulse conditions, SiC MOSFET conduction losses are higher than those of IGBTs. To keep the junction temperature below the maximum junction temperature (typically 80% of Tjmax at 200?C), we limit the size of the SiC MOSFET, which then has the following advantages.

▪ Small chip area for more compact solutions.

▪ much lower power losses at low and medium loads

▪ longer battery life, extending the range of the vehicle.

▪ lower losses at full load for smaller cooling solutions

▪ Small temperature differences between junction temperature Tj and coolant temperature Tfluid over the entire load range for increased reliability.

These features and benefits offer tangible benefits to the user, such as at least a 1% improvement in energy efficiency (75% reduction in losses); smaller and lighter cooling systems on the inverter side (approx. 80% reduction); and smaller and lighter power supply modules (50% reduction).

Cost considerations

When discussing technological advances and the benefits they bring, any discussion that does not take cost into account is one-sided. Currently, SiCMOSFETs cost 4-5 times more than silicon IGBTs, however, the savings in bill of materials, cooling system and energy consumption of SiCMOSFETs, which reduce the total system cost, can often offset the cost difference of these base components. Over the next 2-5 years, as the industry moves to larger diameter wafers, which have already begun to transition, this price gap should drop to 3x or even 2.5x and the quality factor RDSON × area will improve and yields will increase. In the long term, costs will continue to fall over the next 5-10 years as these parameters improve.

SiC power switches offer the promise of improved performance and at the same time turn these hopes into reality with few design trade-offs in application and installation. As automakers ramp up development of hybrids, electric vehicles and many associated power modules, as well as other high-power motor-centric applications, SiC power switches can play an important role in successful designs, bringing huge advances to the system level even if the pace of improvement is small.

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How semiconductor chips are revolutionizing the tech industry | E-energyIT

How semiconductor chips are revolutionizing the tech industry

Semiconductor chips, also known as integrated circuits, are tiny electronic devices that are made up of a combination of materials, such as silicon and germanium. These materials are known as semiconductors, hence the name semiconductor chips.

The role of semiconductor chips in modern technology is crucial.

They are the building blocks of many electronic devices, from smartphones and laptops to automobiles and medical equipment. Semiconductor chips are responsible for storing, processing, and transmitting data and information in these devices.

Semiconductor chips are used in a wide range of industries, including computing, telecommunications, and automotive.

In the computing industry, semiconductor chips are used in the production of computers, laptops, and other electronic devices. They are also used in the telecommunications industry for the production of smartphones and other communication devices. In the automotive industry, semiconductor chips are used in the production of vehicles, including cars, trucks, and motorcycles.

One of the key benefits of using semiconductor chips is their ability to increase speed and efficiency.

Semiconductor chips are able to process and transmit data much faster than traditional electronic devices. This allows for faster and more efficient communication and processing of information. In addition, semiconductor chips are also much smaller and more compact than traditional electronic devices, which makes them perfect for use in portable and handheld devices, such as smartphones and tablets.

Another benefit of using semiconductor chips is their durability and reliability.

Because they are made up of materials that are resistant to heat and other forms of damage, semiconductor chips are able to withstand harsh conditions and continue to function properly. This makes them ideal for use in a wide range of industries, including those that require high levels of reliability, such as the automotive and medical industries.

In conclusion, semiconductor chips are an essential component of modern technology.

They are used in a wide range of industries, including computing, telecommunications, and automotive, and offer a number of benefits, such as increased speed and efficiency. With their ability to withstand harsh conditions and continue to function properly, semiconductor chips are helping to drive the growth and development of the technology industry.

Prepare your supply chain

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The role of semiconductor chips in renewable energy | E-energyIT

The role of semiconductor chips in renewable energy

Semiconductor chips play a crucial role in renewable energy technology. These tiny, highly specialized microelectronic devices are used in a wide range of renewable energy systems, from solar panels and wind turbines, to electric vehicles and energy storage systems.

Material of semiconductor chips

Semiconductor chips are made from materials such as silicon, germanium, and gallium arsenide, which have unique electrical properties that make them ideal for use in renewable energy systems. When exposed to light or other forms of energy, these materials can generate an electric current, which can be used to power electronic devices or to store energy in batteries.

Efficiency of Semiconductor chips

The efficiency of PV cells is largely determined by the quality of the semiconductor material used in their construction. High-quality semiconductor chips can convert a higher percentage of sunlight into electricity, which means that solar panels made with these chips are more efficient and can produce more electricity.

Application of Semiconductor chips

One of the key applications of semiconductor chips in renewable energy is in photovoltaic (PV) cells, which are used in solar panels to convert sunlight into electricity. PV cells are made up of several layers of semiconductor material, which are carefully engineered to maximize their ability to absorb sunlight and generate an electric current.

Another important use of semiconductor chips in renewable energy is in wind turbines. Wind turbines rely on sensors and control systems to optimize their performance and maximize their ability to generate electricity. These sensors and control systems are often based on semiconductor chips, which are able to accurately measure wind speed and direction, and to adjust the position of the turbine blades accordingly.

Semiconductor chips are also used in electric vehicles (EVs) to control the flow of electricity from the battery to the motors that power the vehicle. These chips are critical for ensuring that EVs are able to operate efficiently and safely, and for maximizing their range and performance.

In addition to their use in renewable energy generation and storage systems, semiconductor chips are also essential for managing the distribution and use of renewable energy. Smart grid technology, for example, relies on semiconductor chips to monitor and control the flow of electricity on the grid, ensuring that it is distributed efficiently and that demand is met without interruption.

Overall, semiconductor chips play a vital role in the development and deployment of renewable energy technology. Without these tiny, highly specialized microelectronic devices, many of the renewable energy systems that we rely on today would not be possible.

Prepare your supply chain

Our supplier network has been reviewed and improved for more than ten years.

Our strategic location around the world enables us to access and review the company's headquarters before making a purchase decision.

E-energy Holding Limited cooperates with a well -represented testing agency to conduct in -depth inspections and tests before delivering parts to our customers.

Our procurement is concentrated in franchise and manufacturer direct sales.

Add E-energy Holding Limited to the list of suppliers approved by you, and let our team help you make strategic and wise procurement decisions.

#e-energy #semiconductor chips

How semiconductor chips are revolutionizing the tech industry

The role of semiconductor chips in modern technology is crucial.

Semiconductor chips are used in a wide range of industries, including computing, telecommunications, and automotive.

One of the key benefits of using semiconductor chips is their ability to increase speed and efficiency.

Another benefit of using semiconductor chips is their durability and reliability.

In conclusion, semiconductor chips are an essential component of modern technology.

Prepare your supply chain

Our supplier network has been reviewed and improved for more than ten years.

Our strategic location around the world enables us to access and review the company's headquarters before making a purchase decision.

E-energy Holding Limited cooperates with a well -represented testing agency to conduct in -depth inspections and tests before delivering parts to our customers.

Our procurement is concentrated in franchise and manufacturer direct sales.

Add E-energy Holding Limited to the list of suppliers approved by you, and let our team help you make strategic and wise procurement decisions.

#e-energy #semiconductor chips

Automotive chips, how long can they last? | E-energyIT

Automotive chips, how long can they last?

Just a few days ago, Infineon smashed 5 billion yuan to expand production capacity of 12-inch plan is still making people sigh the automotive chip market "dominant" still, after all, the global semiconductor market downturn is an indisputable fact, but the automotive chip maker Infineon still choose to expand production against the trend, and even made the largest single investment in history, which seems to be the automotive chip market This seems to be the biggest proof of the strong upward momentum of the automotive chip market.

However, a week later, internationally renowned investment institution DAMO Securities warned that there is an oversupply of automotive chips, and pointed out that Renesas and ON Semiconductor have issued a cut order, will cut orders for chip testing in the fourth quarter. At a time when consumer electronics is weak, the automotive business once became the "lifeline" of many chip makers, from the beginning of 2020 to the end of 2022, the former infinite scenery is going to usher in the curtain moment?

Automotive chips in the "surplus" storm?

In fact, before, TSMC and the world advanced on the quarterly law said that the car and server chips will be adjusted inventory warning. And the big Morgan securities that automotive chips will turn from shortage to oversupply, mainly for two main reasons: First, TSMC 3 quarter automotive semiconductor wafer output annual growth of 82%, 140% higher than before the epidemic; Second, China's electric car sales turn weak (accounting for fifty to sixty percent of the world's electric vehicles), so that automotive semiconductors have been fully supplied, which led to automotive chip makers have cut orders.

The big Morgan semiconductor industry analyst Zhan Jiahong pointed out, compared with the global automotive semiconductor revenue trend and automobile production changes, can find that in recent years the automotive semiconductor revenue compound annual growth rate (CAGR) up to 20%, but only 10% of automobile production. Based on this trend, the oversupply of automotive semiconductors should have occurred at the end of 2020 and the beginning of 2021, but at that time, it was affected by the spread of the global new crown epidemic, and transportation was not smooth or even cut off, resulting in an extreme shortage of automotive chips and a continuous shortage of goods. However, recently, as the impact of transportation tends to ease, the increase in production capacity of chip manufacturers, coupled with the weakening of automotive end demand, resulting in the full production of automotive chips, the long-standing chip shortage problem plaguing the automotive industry has officially ended.

From a cyclical point of view, the shortage of automotive chips has been more than 3 years. 3 years ago, due to automotive manufacturers did not predict the rapid growth of new energy vehicles, smart cars, and therefore did not order chip manufacturers in advance, coupled with the impact of the epidemic, automotive chip shortage has become more and more serious. 3 years later, as the global epidemic tends to ease, the semiconductor market also due to high inflation led to demand contraction, coupled with the past few years of investment in new chip manufacturers Production capacity gradually released, the shortage of automotive chips to be relieved seems to be a natural thing, but many car manufacturers do not seem to feel the joy of automotive chips "within reach".

Just a few days ago, Ford CEO Jim Farley is still straightforward: "It's too painful, we need chip engineers. According to the Ford chief, chip supply constraints have cost Ford 1.3 million vehicles over the past two years, and the same problem has cost Ford 4 million employee days this year.

Apparently, Ford is not the only one whose car production has been affected by the lack of chips, as Changan also lost 606,000 vehicles in the first nine months of this year. According to Auto Forecast Solutions, an automotive industry data forecasting company, the global automotive market had lost a cumulative total of about 3.905 million vehicles this year due to the chip shortage by the end of October. According to the forecast, the cumulative production cut in the global automotive market will climb to 4,278,500 vehicles by the end of this year, an increase of about 16,200 vehicles from the previous estimate.

Judging from the number of cars whose production has been cut due to the lack of cores, the shortage of car chips is far from being the end of the story. On the other hand, according to the Economic Daily News, unnamed IC designers also said frankly that, compared with the previous situation of an unbelievable shortage of automotive chips, the supply and demand are now indeed more balanced, and the situation of long and short supply chain materials has improved, but still not to the extent of oversupply.

Why is the shortage of automotive chips still a problem, when it has been three years since the company began to lack them? Since the upstream chip cut single wind has been rumored, then the automotive chip market can still hold up for how long?

There are two main reasons why automotive chips are still in short supply: First, the automotive supply chain is long and complex. From the fab output chip to the automotive supply chain processing, and then to the supply chain like Bosch such a large factory can output, at least three to five months, after which they have to go through the group car factory to obtain the car chip and then assembled into a car, during which time, the time to reach the destination through logistics and sea transport is quite long. According to the Economic Daily News, many car manufacturers believe that the current supply chain situation, I'm afraid that by the middle of next year, because of the chip shortage caused by the lack of car problems, can not be improved.

Secondly, there is a serious shortage of mature chips needed for cars. Compared to advanced chips, mature chips are a major impediment to the production of cars, such as Ford's MOSFET chip for windshield wipers, the cost per chip is only $ 0.40, but it has affected the production of 40,000 vehicles for Ford.

To continue Moore's Law and strengthen their position in the foundry sector, semiconductor majors such as TSMC and Samsung have made a major push into advanced processes, but these moves have been more like a life-threatening butcher's knife for automakers hungry for mature chips. Although currently driven by the huge demand, chip makers have also realized the market prospects of mature chips and started to expand investment, but "distant water cannot put out a nearby fire", how can the future capacity of mature chips fill the immediate chip gap?

Jeremie Bouchaud, head of S&P Global Mobility Autonomy and E/E & Semiconductor, believes that in 2022-2023, chipmakers' investment in expansion of the surge in mature process node capacity will not show the desired capacity results any time before the next 18-32 months, which is the average lead time for commissioning new capacity in the semiconductor industry.

Although Mercedes-Benz, Hetai, Yu Ri car and other car manufacturers that the shortage of automotive chips will not be solved until next year, but from Jeremie Bouchaud proposed this point in time, automotive chips next year to get relief is already very optimistic expectations, Bosch China Executive Vice President Xu Daquan said, the lack of core problem has not been solved, and the forecast for next year is not optimistic, many chip suppliers respond Next year can not meet the procurement needs, the current supply of automotive chips there is still a gap, some chips gap is larger. Ford Farley even believe that the automotive industry chip crisis is unlikely to ease until 2025.

Storage makers, relying on cars to blow the counter-attack horn

At present, the automotive chip to hold up for another two or three years should not be a problem, but as a member of the semiconductor industry, the cycle fluctuations are inevitable, even if the supply exceeds demand again today, there will be a day of oversupply, DAMON Securities has given the industry a precautionary shot in advance, ON Semiconductor, Renesas cut orders also hinted at the seeds, but other chip makers for the automotive business preference is still "Emboldened", even storage vendors who are now facing the brunt of the semiconductor downturn market.

For storage manufacturers, 2022, especially in the second half of 2022, the situation is particularly difficult, storage market shrinkage serious, affected by its impact, the world's top three storage manufacturers Samsung Electronics, SK Hynix and Micron Technology in the third quarter of this year, the amount of revenue fell sharply, Samsung's third quarter sales fell 28.1% ringgit, and therefore by Intel to take away the leading position in the semiconductor market, SK Hynix Sales fell by more than 26% and Micron's sales fell by more than 27%.

In contrast to data centres, personal computers and mobile devices, where demand has fallen sharply, demand for high-performance chips for electric vehicles is growing rapidly, which may be one reason why storage vendors are turning their attention to automotive semiconductors. On the other hand, as smart cars become more popular, the demand for memory in cars is growing. The most common definition of a smart car is a "smartphone with four wheels", and in the years of smartphone development, the more memory you buy, the more you feel, and the more you socialise.

Software, games, etc. all take up a large amount of memory, and from this point of view, it is an irreversible trend that the memory capacity of smart car configurations will only get larger. According to Micron's estimates, a fully self-driving car will require 30 times or 100 times more DRAM and NAND than a human-driven vehicle alone.

Samsung, as the world's number one storage manufacturer, has made a recent push in the automotive semiconductor sector for all to see. Samsung Electronics predicts that automotive semiconductors will grow into the top three chips along with chips for servers and mobile devices by 2030, so it has set a target to take the number one position in the automotive memory market by 2025 and plans to respond to the demand for high-performance automotive semiconductors by offering next-generation memory solutions such as LPDDR5X and GDDR7 chips.

Samsung launched the industry's first automotive UFS solution back in 2017, and late last year Samsung began mass production of automotive memory with a product lineup that includes 256GB PCIe Gen3 NVMe ball grid array package (BGA) SSDs, 2GB GDDR6 DRAM and 2GB DDR4 DRAM for infotainment systems, and 2GB GDDR6 DRAM and 128GB Universal Flash Storage (UFS) for self-driving systems. As for SK Hynix, another Korean storage major, which set up an automotive team in 2016 to specialize in DRAM for cars, businesskorea recently reported that, like Samsung, SK Hynix is also turning its attention to automotive semiconductors.

However, when it comes to the current automotive DRAM, Micron is naturally the best. Micron has been working on automotive chips for more than 30 years, and with its geographical advantage, long cooperation with Tier-one car manufacturers in Europe and the US, and a full range of products (most traditional DDR to DDR4, LPD2 to LPD5 and GDDR6, as well as NAND, NOR Flash and MCP), it has a market share of nearly 50% in the automotive DRAM sector. As the top automotive storage supplier, we have a strong market share of nearly 50%.

As a top automotive storage supplier, Micron is very optimistic about the future of the automotive market, estimating that by 2025, the annual growth rate of DRAM bits in the automotive market will reach 40% and NAND 49%. Early last year, Micron launched LPDDR5 memory specifically designed for automotive use, with a 50% increase in data access speed and over 20% improvement in energy efficiency, making it the industry's first automotive memory to meet ASIL Safety Level D requirements. In November this year, Micron officially launched the world's most advanced 1β technology node DRAM, and while it has only sent samples to some smartphone manufacturers and chip platform partners for validation, Micron has also highlighted that it will mass produce 1β nodes in other applications such as industrial and automotive, embedded, and data centre in the coming year.

In addition, Taiwan's Nan Ya Tech and Huabang Electric are diversifying into the automotive market. Nanya has a complete product portfolio from DDR to DDR4, LPSDR to LPDDR4X, with stable yields for now. Huabang, on the other hand, has been working in the automotive field for more than 10 years, and its NOR Flash and niche DRAMs have been steadily supplied to the world's top tier car manufacturers.

The general manager of Huabang Electronics, Mr. Chen Pei-Ming, recently emphasized that Huabang Electronics will actively enter the automotive market, which is more favored by the market. According to him, in terms of Nor Flash, Huabang Electronics has about 20% of the automotive market in the industrial control field, and will further develop the DRAM field for automotive use in the future.

Macronix has been expanding into the automotive market since 2009 and has shipped more than 440 million units of coded flash memory worldwide. Its automotive NOR flash chips have penetrated many chip makers including NXP, TI, NVIDIA, STMicroelectronics and Qualcomm. It is expected that every luxury car will use Macronix's chips by 2023, making it the leader in automotive NOR Flash. Although Macronix's 2022 capital expenditure has been revised downward from the original NT$16 billion to NT$10.6 billion due to the general environment, Macronix will focus its future capital expenditure on NOR Flash applications and strive to maintain stable prices in the fourth quarter and 2023.

Although many storage manufacturers are turning to automotive semiconductors, it is not easy to do a good job with automotive chips. For example, since the life span of a car can easily start at 10 years, the maintenance and durability requirements for automotive storage product lines are much higher than those for commercial products; or in order to adapt to the different extreme climates of different countries, automotive memory needs to have a higher temperature tolerance threshold to avoid sudden failures during driving. All of these will pose challenges for automotive DRAMs with high production difficulties and high production costs.

Wafer foundry, pure car manufacturers will also be the target?

The automotive track is arguably the first new track that foundries are actively pursuing as consumer electronics shrink.

The cause is that TSMC's 5 nm fab in Arizona, USA is about to be completed, and foreign media reports say that one of the fab's most important customers is the electric car leader Tesla, and may be the largest order for TSMC's US plant, TSMC will OEM the new generation of fully automated driving (FSD) chips for Tesla, with 4/5 nm process production, and Tesla is expected to become the top 7 customers in 2023. TSMC's top 7 customers. If the news is true, then Tesla will be the first pure-play car manufacturer to appear among TSMC's main customers.

In the past, TSMC's top 7 customers were mostly branded factories, IC design companies and IDM factories, but this is the first time a pure car manufacturer has been included. Although neither Tesla nor TSMC has responded to this news, it must be admitted that TSMC's recent assault on the automotive sector has been very aggressive. In addition to the DAM Securities pointed out, TSMC 3 quarter automotive semiconductor wafer output annual growth of 82%, TSMC three quarter automotive electronics revenue is also very impressive, earnings data show that TSMC 3 quarter of this year, automotive electronics revenue accounted for about 5%, related revenue amount quarterly growth of about 15%, quarterly growth in the top three applications. Legal estimates, the third quarter of this year TSMC from automotive electronics revenue exceeded $1 billion.

In the field of MCU, TSMC production of automotive MCU has occupied about 70% of the market share, Infineon, ST, NXP, TI, Renesas Electronics and other major suppliers of MCU using TSMC foundry; in terms of capacity planning, TSMC Nanjing and Japan production line, are likely to be used for automotive wafer production.

In this news of Tesla's order for TSMC, the former can have a more advanced manufacturing process, the latter can have a not insignificant order, and Samsung may become the only injured person in this news. As the world's second largest foundry after TSMC, Samsung was the main foundry partner for Tesla's previous generation of fully automated assisted driving chip, Hardware 3.0, mainly using the 14nm process.

At the end of last year, it was revealed that Tesla and Samsung Electronics' foundry division had been working on chip design and prototyping since early 2021, with Tesla eventually deciding to outsource the HW 4.0 Autopilot chip to Samsung, which will be produced at its Hwaseong plant in South Korea using a 7nm process. But a year later, it was rumoured that Tesla would switch to TSMC's main supply and Samsung would provide the previous generation of older chip production and memory part support, which should not hurt Samsung a little.

After all, from the industry's estimates, Tesla's order volume is very substantial. The industry to Tesla production plan estimates, Tesla next year's production scale is expected to jump from 3 million vehicles, to fully automatic assisted driving chip using 2 chip design (a main and a backup assistance), if a long contract to focus on TSMC and with advanced packaging and other design, TSMC order volume is estimated to reach nearly 15,000 pieces, and continue to grow rapidly. From this point of view, with the continued expansion of the future smart car market scale, those self-researched chip-making core forces may also be expected to become the target of the foundry competition.

Although it is unknown whether Samsung will really lose this order from Tesla, but the car as a popular track nowadays, Samsung since in the field of memory chips will not miss, in the foundry market is even more so. October South Korean analysts pointed out that Samsung has plans to invest in Europe to build a new fab, its target customers is the European automotive electronics semiconductor demand. At the same time Samsung also shared its intention to strengthen its automotive semiconductor business at a technology forum held recently.

At the 2022 Foundry Forum, Samsung's Foundry Division also revealed plans to increase the number of mature and specialised processes in foundries by more than 10 by 2024, which would increase capacity by 2.3 times what it was in 2018. This is certainly good news for car manufacturers who are in serious shortage of mature chips.

In addition to TSMC and Samsung, of course, other foundries are also actively laying out their plans. UMC confirmed that automotive chips will be one of its focus areas and spine for the layout of special processes; World Advanced Automotive Electronics continues to introduce a number of process technologies and into mass production, and into the supply chain of international automotive majors; Gecon will continue to expand its automotive chip production capacity; Hua Hong to enter the automotive chip market; Jinghe automotive certification to accelerate...

As for why foundries actively layout automotive chip track, "foundries, targeting new track" article will be attributed to three reasons: First, the automotive market growth is large, production capacity continues to be tight; Second, the industry chain model adjustment; Third, "lack of core tide" after the automotive industry chain reshaping. But perhaps this is also inseparable from the automotive supply chain is too complex, as mentioned above, automotive chip from the foundry cast production to the end market, the middle needs a long time, the foundry only ahead of the deployment to cope with the subsequent boom recovery demand, but also to avoid the loss of chip drought repeat.

Packaging and testing manufacturers, local enterprises accelerate the layout of automotive packaging

From the perspective of the industry chain, the impact of the general environment on packaging and testing plants is not small, with many manufacturers extending their inventory correction to the first half of next year and lowering their capital expenditure planning for next year. However, even so, they remain bullish on the continued solid demand for automotive and industrial control.

In November, ASE spent US$300 million to build a new factory in Malaysia, which is expected to be completed by 2025, stressing that the new factory in Malaysia will cater to the demand for 5G, artificial intelligence, high-performance computing and automotive electronics. In addition, ASE's Huanxu Electronics is also actively expanding its automotive electronics business, aiming to exceed US$1 billion in annual automotive electronics-related revenue by 2024. ASE Semiconductor, on the other hand, has been developing chiplet advanced packaging, targeting artificial intelligence and automotive applications.

In conclusion

Although computers and communications are still the main pulling force in the IC market, automotive applications account for a relatively low proportion, but looking to the future, the prospects are undoubtedly huge, IDC report shows that the size of China's new energy vehicle market will reach 15.98 million units in 2026, a compound annual growth rate of 35.1%. A large part of the reason why chipmakers are turning to automotive semiconductors is to over-deploy to deal with the booming future. As for the oversupply problem they may face in the future, the entire semiconductor industry has a cyclical nature, so as long as the strength is strong, why fear the unknown future?

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Our supplier network has been reviewed and improved for more than ten years.

Our strategic location around the world enables us to access and review the company's headquarters before making a purchase decision.

E-energy Holding Limited cooperates with a well -represented testing agency to conduct in -depth inspections and tests before delivering parts to our customers.

Our procurement is concentrated in franchise and manufacturer direct sales.

Add E-energy Holding Limited to the list of suppliers approved by you, and let our team help you make strategic and wise procurement decisions.

#e-energy #Automotive chips #ASE

The chip that may usher in a new era of AR | E-energyIT

The chip that may usher in a new era of AR!

As the mobile computing market becomes saturated, more and more high-tech companies are investing in developing the next generation of computing platforms that have the potential to replace the mobile phone. In order to replace the mobile phone, such a computing platform needs to be able to be used 24/7, so that it can be used as much or more than the mobile phone on a daily basis. On the other hand, such a computing platform needs to be able to provide a greater sense of immersion than the mobile phone, while also avoiding the hassle of having to take the phone out of your pocket to use it, so that it can provide more real-time information input and feedback to the user. From this perspective, Augmented Reality (AR) glasses are a very promising computing platform, which is why technology giants around the world (including Google, Meta, Huawei, Xiaomi, etc.) are investing heavily in research and development.

The main feature of AR glasses is the way in which the glasses are used, providing a device that can interact with the user anytime, anywhere, 24/7, and that the device can provide significant value to the user. We believe that AR glasses can be further divided into two generations of products. Firstly, we can look at the benchmark for AR glasses, which is what the second generation of AR glasses looks like. One of the most critical features of second generation AR glasses is the ability to superimpose virtual objects on the real world, so that when the user is wearing the glasses, such virtual objects do not look any different from real objects. For example, the user can place a virtual globe on their table, and as they slowly move away from the table, they will see that the virtual globe will remain on the table and will appear smaller and smaller in a realistic way, and when the user turns around the virtual globe will disappear, only to reappear when the user turns back to the original angle, etc. - this is called world locked render. -This technique is called world locked rendering (WLR). In order to achieve this WLR capability, the second generation of AR glasses requires a chip that provides strong rendering capabilities, as well as real-time user position tracking, so that virtual objects can be truly mixed with the real world.

At present, Microsoft's Hololens is a typical second generation AR glasses, but due to the maturity of the technology, second generation AR glasses often require a larger size and high cost, and there is still a long way to go before they become a truly popular computing platform. Until the second generation of AR glasses can be rolled out on a large scale, the technically simpler first generation of AR glasses can be mass produced and rolled out on a large scale in a simpler way, thus playing a role in carrying forward the next generation. The second generation of WLR is a revolutionary technology, but there are other important values that AR glasses can provide to the user beyond WLR, which is not yet fully mature. The first generation of AR glasses, also known as 'smart glasses', did not include the more technically expensive WLR technology, but offered a range of other important uses, including real-time display of important information, quick photography, direct calls and more. We expect that in the next five years, the first generation of AR glasses will further spread to the market, while the second generation of AR glasses will further mature in terms of technology. The second generation of AR glasses will slowly replace the first generation of AR glasses as a mainstream product and become a complementary electronic product to mobile phones, or even gradually replace mobile phones as the preferred computing platform for users.

Qualcomm's AR2 Gen1 platform is expected to accelerate the maturation of AR glasses

As mentioned earlier, the first generation of AR glasses is currently accelerating its market expansion, while the second generation of AR glasses is still working on the technology. The chip plays an extremely important role for AR glasses, and the chip design for AR glasses is full of challenges. the most critical metrics for AR glasses chips include power consumption, computing power, size, etc.

Firstly, the chip needs to meet low power consumption and high energy efficiency, because the size of AR glasses cannot accommodate a large capacity battery, and the user experience of AR glasses is expected to be all-day use. This places a high demand on the energy efficiency of the chips in AR glasses to be able to perform complex calculations while using as little energy as possible (to ensure the battery can support a full day). In addition to energy efficiency, it is also important to note that, again due to the size of AR glasses, their cooling capacity is limited, so the chip must be optimised for power consumption to ensure that the glasses do not overheat.

In addition to power consumption and energy efficiency, the processing power of the chip in AR glasses must not be too poor, or the signals that need to be processed in AR glasses are in fact no simpler than in mobile phones, and the system is relatively complex. The WLRs required for second generation AR glasses are naturally very complex, but even without the WLRs, first generation AR glasses still require complex processing capabilities to meet the needs of the user, ranging from the basics of running an operating system (commonly known as an AR glasses operating system based on Android modifications), high performance photography, voice recognition, on-screen display, running AI models to recognise objects in the user's field of view, to more complex processing capabilities. to more complex hand tracking, eye tracking and so on, all of which require the chip to have the corresponding capabilities and be able to implement them in an efficient way.

Finally, the size of the AR glasses requires that the corresponding chip is not too large, which also limits the number of transistors and the process nodes used (smaller feature size processes are needed to ensure that the chip size is not too large, while smaller feature size processes usually result in better power efficiency ratios).

Just last week, Qualcomm announced its latest AR2 Gen1 series AR chipset, which we believe is expected to be the chip of choice for most AR glasses in the next few years (or not many other options are available on the market), while the high performance of the chipset will also drive further performance improvements in AR glasses. The first and most interesting thing about this chipset is that it contains three chips, including a main chip (AR Processor), a secondary chip (AR CoProcessor) and a wireless connectivity chip. We believe that one of the main reasons why Qualcomm has released three chips instead of one SoC is because of the size and power constraints of AR glasses, as the size of the chip may be too large if too many functions are integrated into one SoC, and the power consumption will be too high if multiple modules are working at the same time. This is why it is better to split into three chips to better meet the power and size constraints.

Of the three chips, the AR Processor is responsible for the most critical work of the AR glasses, including running the SoC, and most of the functional modules, including the CPU for running the OS, the ISP for shooting, the Adreno GPU module for the screen display, the Hexagon Processor for accelerating AI models, and so on. As previously analysed, a 4nm feature size process is used to meet power and size requirements. the AR CoProcessor is mainly responsible for eye tracking and related forveated rendering, while finally the wireless interconnect chip is responsible for the high speed interconnection with the phone and supports WiFi7.

Overall, Qualcomm's AR2 Gen1 achieves quite good performance, with 2.5 times more AI-related performance than the previous generation used inside VR (XR2), while consuming half the power. Due to Qualcomm's leadership in the wireless space, Qualcomm also emphasised the importance of using wireless connected chips to work in tandem with the phone. In Qualcomm's vision, the key thing for the AR glasses chip is to be able to do some immediate processing (including the running of some basic AI models), while some more complex operations, such as WLR or larger models, can be run by using wireless interconnects to transfer data to the phone. We believe that Qualcomm's AR Processor chip is the most promising for mass adoption in first generation AR glasses, as it does contain most of the functional modules needed for AR glasses, while the AR CoProcessor, which focuses on eye tracking, may not be adopted at scale from the outset as eye tracking is not standard in first generation AR glasses. Finally, there is no certainty that first generation AR glasses will need to be wirelessly interconnected to mobile phones at high speed for extended periods of time (at present it appears that many operations can be performed directly on the glasses, with only a few operations such as accessing information that requires a connection to the internet requiring a connection to the phone), so whether the AR glasses system will use the wireless solution in Qualcomm's AR2 Gen1, or whether it will use Qualcomm's or even other manufacturers' last generation wireless solutions to reduce costs is still uncertain. It remains to be seen whether AR glasses systems will use Qualcomm's wireless solution in AR2 Gen1 or whether they will use Qualcomm's or even other vendors' previous generation wireless interconnect solutions to reduce costs.

What is the future competitive landscape of the AR chip market

As the market for first generation AR glasses is further rolled out, we believe Qualcomm's AR2 Gen1 is currently in a leading position for related solutions, as Qualcomm is willing to invest in the AR glasses market before its capacity is fully developed. However, as the AR glasses market volume rises year on year, we expect other chip companies such as MediaTek to join the competition. From a technical point of view, apart from the need for high power efficiency and low power consumption designs, most of Qualcomm's designs in AR2 Gen1 can be achieved by competitors such as MediaTek, so it is entirely expected that competing companies will join the market if it becomes large enough.

Outside of the first generation of AR glasses, the second generation of AR glasses is now looking like another market for Qualcomm. The main challenge for third-party vendors like Qualcomm is that system vendors (e.g. Apple, etc.) will prefer to use their own silicon solutions, partly because second-generation AR requires more extreme performance and the market is smaller, and it is often difficult for third-party solutions to design for such a small market in great detail. On the other hand, the use of in-house chips strengthens the competitive barrier, thus ensuring that their products have a unique technical performance not achieved by other competitors by buying the same third-party chipset.

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Characteristics and application tips for linear voltage regulators | E-energyIT

Characteristics and application tips for linear voltage regulators

There are two types of voltage regulator used to supply a constant voltage to a circuit: linear voltage regulators and switching voltage regulators. Linear voltage regulators have a pathway element that operates as a linear electronic component. Factors such as heat dissipation, low efficiency, high operating temperatures and large heat sinks limit the use of linear electronics in voltage regulation schemes. In this article we will learn why as we discuss the characteristics and applications of linear voltage regulators.

1. Supply voltage regulation

A wide range of applications, such as industrial utilities, consumer appliances, handheld devices and communication systems - require power supplies. The power supply for these applications is a stable DC voltage, which is obtained by rectifying the AC supply. The rectified AC voltage is pulsating, so filters must be used to smooth out the power supply.

Power solutions in today's electronic designs often need to maintain or regulate a constant output voltage independent of variations in the AC grid or load changes. Voltage regulators are integrated in combination with rectifier filters to provide a constant DC power supply. Typically, the voltage regulation circuit includes a transmission element, a reference voltage, a feedback circuit and a control circuit. The core function of the voltage regulation scheme is to detect changes in the output DC voltage with respect to the reference voltage. The difference between the output DC voltage and the reference voltage creates an error. Based on the error, a control signal is generated to drive the pathway components so that the output DC voltage is always constant.

2. Linear Voltage Regulators

Power management design can be a challenging task for the circuit design engineer. Several factors need to be considered when selecting a suitable power supply design, such as efficiency, size, compactness, transient response, cost and accuracy. Depending on the application, the solution can be either a linear regulator or a switching regulator.

Linear regulators use MOSFETs or BJTs as transmission elements to maintain a constant output voltage. The variable conductivity of the conduction element is used for voltage regulation in linear voltage regulation. The linear regulator acts as a voltage divider circuit, which is only possible due to the operation of the transmission element in the active region (also known as the ohmic or linear region).

There are two main types of linear regulators.

(1).Series linear regulators:

When a regulating element is connected in series with a load, it forms a series linear regulator. In a series voltage regulator, the load voltage is regulated by controlling the voltage drop through the element.

(2).Parallel linear voltage regulator:

A parallel linear voltage regulator is a voltage regulator in which the pathway element is connected in parallel with the load. The current through the path element is controlled to maintain a constant voltage in a parallel linear voltage regulator.

3. characteristics of linear regulators

Linear regulators are available as highly integrated circuits such as IC7805, 7812, 7915, LM317, LM309 and LM2940. linear regulators are available in three basic designs based on the minimum voltage drop voltage constant required to maintain the output on the regulator. The classifications are as follows.

(1) Standard regulators: The pass in standard regulators is the NPN Darlington pair.

(2) Low Dropout Voltage (LDO) regulators: There is one transistor in an LDO regulator.

(3) Quasi-LDO regulators: A combination of PNP and NPN transistors forms the pass element in a quasi-LDO regulator.

Linear regulators can output a stable voltage with almost no noise. These regulators are best suited for applications smaller than 20 W. Linear regulator ICs simplify the design and require minimal external components such as resistors and capacitors. However, several characteristics of these regulators limit their application.

(1) Very low efficiency is offered, around 20-60%.

(2) The linear mode operation of the transmission element leads to excessive power dissipation and heat generation.

(3) Can only be used as step-down regulators.

(4) I.F. transformers are used for linear voltage regulation and they add to the size and weight of the system.

In space-constrained applications, voltage regulators based on linear electronics should be replaced by switching regulators. The use of high frequency transformers reduces the PCB space occupied by switching regulators more than linear regulators. In addition, switching regulators are highly efficient and have both step-up and step-down regulator options.

Prepare your supply chain

Our supplier network has been reviewed and improved for more than ten years.

Our strategic location around the world enables us to access and review the company's headquarters before making a purchase decision.

E-energy Holding Limited cooperates with a well -represented testing agency to conduct in -depth inspections and tests before delivering parts to our customers.

Our procurement is concentrated in franchise and manufacturer direct sales.

Add E-energy Holding Limited to the list of suppliers approved by you, and let our team help you make strategic and wise procurement decisions.

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Notes on the use of common linear DC power supplies in life | E-energyIT

Notes on the use of common linear DC power supplies in life

With the development of global diversification, our life is also changing, including our contact with a variety of electronic products, then you must not know some of the composition of these products, such as linear DC power supply.

Linear DC power supply in the process of operation, pay attention to the following matters, you can effectively avoid unnecessary trouble.

1).Voltage setting:

Turn on the DC power switch and adjust the voltage knob so that the voltage reading is adjusted to the required working electrical connection. When the voltage needs to be lowered, the potentiometer should be slowly turned so that the voltmeter drops at a rate commensurate with the speed of the hand-adjusted knob.

The power transformer converts the AC input voltage from the grid (e.g. 220V, 50Hz) to a lower AC voltage (e.g. 9V, 12V, 15V, etc.).

2) Constant current setting:

Connect the load and first set the current adjustment potentiometer to minimum. Turn on the DC power supply and set the current to the desired current value.

A power transformer usually has two or more windings, where the winding connected to the AC power supply is called the primary winding and the rest of the winding is called the secondary winding. The primary and secondary windings are electrically insulated, so that the power transformer is electrically isolated from the grid while the voltage amplitude is being transformed.

3) Voltage protection value setting:

first turn the voltage protection knob to the maximum, adjust the output voltage to the required protection value, and then slowly adjust the DC power supply voltage protection potentiometer counterclockwise until the DC power supply over-voltage protection occurs. The voltage protection value should generally be about 10% higher than the working voltage, so adjust the output voltage to about 1 0% higher than the required voltage, and then slowly adjust the voltage protection potentiometer counterclockwise until the DC power supply is protected from overvoltage.

The rectifier circuit is a semiconductor diode with unidirectional conductivity, which converts the alternating positive and negative sinusoidal AC voltage into a unidirectional pulsating DC voltage.

4) Current alarm value setting:

first turn the current alarm knob to the maximum, adjust the output current to the required alarm value, then slowly adjust the current alarm potentiometer counterclockwise until the power supply issues an audible and visual alarm.

The rectifier circuit usually uses a bridge rectifier consisting of four diodes, referred to as the rectifier bridge. The pulsating DC voltage output from the rectifier circuit contains a large AC component and cannot be used directly in electronic circuits. A filter circuit needs to be connected after the rectifier circuit.

5) DC power supply switched

When the DC power supply is switched on or disconnected from the load, the voltmeter reading will jump momentarily, which is a normal phenomenon.

A capacitor filter circuit is usually used in small to medium power linear power supplies. A capacitor filter circuit is formed by connecting a filter capacitor in parallel directly to the output of the rectifier circuit. The filtering circuit can filter out most of the AC components in the pulsating DC voltage and turn it into a relatively smooth DC voltage.

6) After switching off the power

if you need to switch on the DC power supply again, please wait for a moment and do not switch on and off the power supply frequently, otherwise the power supply may be damaged.

In the research and design process, there must be one or another problem, which requires our scientific workers in the design process to continue to sum up experience, so as to promote the continuous innovation of the product.

Prepare your supply chain

Our supplier network has been reviewed and improved for more than ten years.

Our strategic location around the world enables us to access and review the company's headquarters before making a purchase decision.

E-energy Holding Limited cooperates with a well -represented testing agency to conduct in -depth inspections and tests before delivering parts to our customers.

Our procurement is concentrated in franchise and manufacturer direct sales.

Add E-energy Holding Limited to the list of suppliers approved by you, and let our team help you make strategic and wise procurement decisions.

#e-energy #linear DC power supplies

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