Copper Core Balls: A Smarter Alternative for BGA Packaging
If you work with BGA or CSP packaging, you've probably run into the tradeoffs of standard solder balls: good electrical performance, but limited mechanical reliability under thermal cycling — especially in larger package sizes.
Copper Core Balls (CCB) solve this by using a solid copper core wrapped in a solder alloy shell. The copper core keeps the standoff height consistent during reflow (no more collapsed joints), while the solder shell still gives you a proper metallurgical bond to the pad. The result: better thermal cycling reliability and more consistent joint height across the whole array, without giving up the ease of a standard SMT reflow process.
CCBs are increasingly used where board-level reliability really matters — automotive electronics, industrial modules, and larger BGA packages where a handful of failed joints can take down the whole assembly.
We manufacture copper core balls at JINNHOO Semiconductor, with sizes and alloy shells customizable to your process. If you're evaluating options for your next BGA design, more details are here: jinnhoosemi.com/copper-core-ball.html
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