May 29
ASE unveils 310 mm panel-level packaging line for next-generation AI and HPC chips
May 29, 2026 /SemiMedia/ — ASE Technology Holding’s semiconductor packaging subsidiary ASE announced it has developed what it describes as the industry’s first automated 310 mm × 310 mm panel-level packaging (PLP) production line, with mass production scheduled to begin in the first half of 2027. The new platform represents a major step in the transition from conventional wafer-level packaging…