Jenbacher gas #engines on the plant floor at our #manufacturing facility in Jenbach, Austria. #GE #technology
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Jenbacher gas #engines on the plant floor at our #manufacturing facility in Jenbach, Austria. #GE #technology
NVIDIA 'Kepler' GK110 - 2012
28 nm process technology, <550 mm² die size, 7.1 billion transistors.
NVIDIA 'Kepler' GK104 - 2012
28 nm process technology, 294 mm² die size, 3.54 billion transistors
NVIDIA GF100 - 2010
40 nm process technology, 529 mm² die size, 3 billion transistors
Intel 'Nehalem' - 2008
45 nm process technology, 263 mm² die size, 731 million transistors
Intel 'Silverthorne' - 2008
45 nm process technology, 26 mm² die size, 47 million transistors
NVIDIA GT200 - 2008
55 nm process technology, 576 mm² die size, 1.4 billion transistors
IBM z10 mainframe processor - 2008
65 nm process technology, 434 mm² die size, 993 million transistors
Sun Microsystems 'Niagara 2' - 2007
65 nm process technology, 342 mm² die size, 503 million transistors
AMD/ATI RV770 graphics processing unit - 2008
55 nm process technology, 260 mm², 956 million transistors
Intel 'Dunnington' (Penryn-based six-core) - 2008
45 nm process technology, 503 mm² die size, 1.9 billion transistors
IBM Cell Broadband Engine - 2006
90 nm process technology, 221 mm² die size, 234 million transistors
Intel 'Penryn' (Conroe die-shrink) - 2007
45 nm process technology, 107 mm² die size, 410 million transistors
Intel 'Conroe' (Core 2 Duo) - 2006
65 nm process technology, 143 mm² die size, 291 million transistors
AMD 'Shanghai' and 'Istanbul' quad- and six-cores (K10 die shrink) - 2009/2010
45 nm process technology, 258 mm² die size, 758 million transistors (quad)
45 nm process technology, 346 mm² die size, 904 million transistors (six-core)
IBM POWER 6 - 2007
65 nm process technology, 341 mm² die size, 790 million transistors
AMD K10 quad-core architecture - 2008
65 nm process technology, 285 mm² die size, 450 million transistors