Jenbacher gas #engines on the plant floor at our #manufacturing facility in Jenbach, Austria. #GE #technology

Product Placement

❣ Chile in a Photography ❣
we're not kids anymore.

Janaina Medeiros
Keni
No title available
AnasAbdin
d e v o n
will byers stan first human second
Alisa U Zemlji Chuda

shark vs the universe
art blog(derogatory)

No title available

No title available

JVL

titsay
wallacepolsom
styofa doing anything

Love Begins
No title available
seen from United States
seen from Denmark
seen from United Kingdom
seen from Chile
seen from United States
seen from Italy

seen from Germany
seen from United States

seen from United States
seen from Malaysia
seen from United States

seen from United Kingdom
seen from Germany

seen from Spain

seen from Germany

seen from United Kingdom
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seen from United States
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seen from United States
@ars-ingeniaria
Jenbacher gas #engines on the plant floor at our #manufacturing facility in Jenbach, Austria. #GE #technology
NVIDIA 'Kepler' GK110 - 2012
28 nm process technology, <550 mm² die size, 7.1 billion transistors.
NVIDIA 'Kepler' GK104 - 2012
28 nm process technology, 294 mm² die size, 3.54 billion transistors
NVIDIA GF100 - 2010
40 nm process technology, 529 mm² die size, 3 billion transistors
Intel 'Nehalem' - 2008
45 nm process technology, 263 mm² die size, 731 million transistors
Intel 'Silverthorne' - 2008
45 nm process technology, 26 mm² die size, 47 million transistors
NVIDIA GT200 - 2008
55 nm process technology, 576 mm² die size, 1.4 billion transistors
IBM z10 mainframe processor - 2008
65 nm process technology, 434 mm² die size, 993 million transistors
Sun Microsystems 'Niagara 2' - 2007
65 nm process technology, 342 mm² die size, 503 million transistors
AMD/ATI RV770 graphics processing unit - 2008
55 nm process technology, 260 mm², 956 million transistors
Intel 'Dunnington' (Penryn-based six-core) - 2008
45 nm process technology, 503 mm² die size, 1.9 billion transistors
IBM Cell Broadband Engine - 2006
90 nm process technology, 221 mm² die size, 234 million transistors
Intel 'Penryn' (Conroe die-shrink) - 2007
45 nm process technology, 107 mm² die size, 410 million transistors
Intel 'Conroe' (Core 2 Duo) - 2006
65 nm process technology, 143 mm² die size, 291 million transistors
AMD 'Shanghai' and 'Istanbul' quad- and six-cores (K10 die shrink) - 2009/2010
45 nm process technology, 258 mm² die size, 758 million transistors (quad)
45 nm process technology, 346 mm² die size, 904 million transistors (six-core)
IBM POWER 6 - 2007
65 nm process technology, 341 mm² die size, 790 million transistors
AMD K10 quad-core architecture - 2008
65 nm process technology, 285 mm² die size, 450 million transistors